JP2010171049A - Electronic component package and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package that can increase the number of electronic component packages to be taken out of a wafer, allows even electronic components having functional surfaces on both the sides to easily, without fail, and electrically conduct electricity, and can be miniaturized, as compared with before. <P>SOLUTION: The electronic component package 10 includes the electronic component 11, and a casing 13 formed by joining a plurality of components so that the electronic component is covered. In the electronic component package, an IC for signal processing is formed on sidewalls facing a front 11a or a rear 11b of the electronic component 11 in the casing 13, and functional surfaces 11a, 11b of the electronic component and junction surfaces 21a, 21b among components 21, 22, 23 of the casing are disposed so that they cross mutually. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component package.

  2. Description of the Related Art In recent years, attention has been focused on MEMS (Micro Electro Mechanical System) devices, which are electrically driven micro devices in which a mechanical structure is formed on a substrate using semiconductor process technology, as one of electronic components. Since this MEMS device is manufactured using semiconductor technology, it has advantages such as high processing accuracy and ease of mass production. Not only IT-related, but also various communication, chemistry, medical treatment, biotechnology, etc. It has begun to be applied in the field.

  Electronic components such as MEMS devices are generally accommodated in a package having a cavity formed therein (see, for example, Patent Document 1). The surface-mount type piezoelectric device of Patent Document 1 is an inverted saddle-like shape that is fixed in a state of surrounding a space on a package body including a flat package body and a piezoelectric vibration element (electronic component) supported on the package body. A metal lid formed on the upper surface of the package main body so as to close each upper opening of the through hole inside the metal plated wall, and a piezoelectric plate. An internal electrode that supports the vibration element, and a metal-plated external electrode disposed on the lower surface of the package body are provided.

As this type of MEMS device, a MEMS chip and a signal processing IC for processing an output signal of the MEMS chip in a rectangular parallelepiped ceramic package or a can package are provided.
Conventionally, a MEMS chip is mounted on a signal processing IC chip mounted on one surface of a ceramic substrate, and the MEMS chip and the signal processing IC chip are electrically connected via bonding wires to cover each chip. A MEMS device having a structure in which a ceramic cap is covered on one side of a ceramic substrate has also been proposed. (For example, see Patent Document 2)

JP 2003-87071 A JP-A-8-110351

  By the way, in the surface mount type piezoelectric device of Patent Document 1, a piezoelectric vibration element (electronic component) is arranged substantially parallel to the flat package body, and a reverse lid-shaped metal lid is covered from above the piezoelectric vibration element. Is formed. That is, the joint surface between the package body and the metal lid is substantially parallel to the functional surface of the piezoelectric vibration element. With this configuration, there is a problem that the surface of the wafer constituting the package body and the functional surface having a large area in the electronic component are arranged in parallel, and the number of electronic components that can be placed on the wafer is limited. is there. In addition, when mounting an electronic component having both functional surfaces, in order to electrically connect to both surfaces of the electronic component, a through electrode that can be electrically connected between the functional surface of the electronic component and the internal electrode It is necessary to newly form wiring such as wire bonding. Therefore, in the case of an electronic component having both functional surfaces, the production efficiency is poor in the conventional manufacturing method.

  In addition, a MEMS chip is mounted on a signal processing IC chip mounted on one surface of a ceramic substrate as in the MEMS device of Patent Document 2, and the MEMS chip and the signal processing IC chip are electrically connected via bonding wires. In the case of a structure in which a ceramic cap covering each chip is covered on one surface side of the ceramic substrate, the thickness dimension of the entire MEMS device is increased.

  Therefore, the present invention has been made in view of the above-described circumstances, and can increase the number of wafers taken out from a wafer, and can easily and reliably electrically conduct even an electronic component having functional surfaces on both sides. The present invention also provides an electronic component package that can be reduced in size as compared with the prior art.

In order to solve the above problems, the present invention provides the following means.
An electronic component package comprising: an electronic component; and a casing formed by bonding a plurality of component members so as to cover the electronic component, and a functional surface of the electronic component and a bonding surface between the component members of the casing However, the signal processing IC is formed on a surface parallel to the functional surface of the electronic component of the constituent member of the casing.

  With such a configuration, a functional surface having a large area in an electronic component is generally not parallel to a joint surface between members of a casing made of a plurality of members. For example, when forming a casing with a wafer In addition, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, since the side surface of the electronic component and the inner surface of the casing are in contact, while forming the electrodes on the front and back surfaces of the electronic component near the side surface, By providing a conductive material such as a conductive paste between the inner surface of the casing and the inner surface of the casing, electrical conduction can be easily and reliably obtained. In addition, since the size in the plane parallel to the functional surface of the electronic component in the electronic component package can be made substantially the same as the size of the functional surface of the electronic component, the overall size of the MEMS device can be reduced compared to the conventional case. Can be planned.

  Further, the functional surface of the electronic component and the mounting surface of the electronic component in the casing are arranged so as to intersect with each other.

  By comprising in this way, when mounting an electronic component in a casing, a mounting area can be made small. Accordingly, a large number of electronic components can be arranged on the wafer constituting the casing, and the number of wafers taken out from the wafer can be increased.

  The casing has a first casing in which a through hole capable of accommodating the electronic component is formed and the signal processing IC is formed on a surface parallel to a functional surface of the electronic component, and both ends of the through hole. It is comprised by the 2nd casing and 3rd casing which cover an opening part, and is arrange | positioned so that the functional surface of the said electronic component may oppose the internal peripheral surface of the said through-hole.

  By configuring in this way, the functional surface of the electronic component is not parallel to the joint surface between the first casing and the second casing and the joint surface between the first casing and the third casing. When the third casing is formed of a wafer, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the inner surface of the second casing or the third casing are configured to contact each other. By forming a conductive material such as a conductive paste between the second casing and the inner surface of the third casing while being formed in the vicinity, electrical conduction can be easily and reliably achieved. In addition, since the size in the plane parallel to the functional surface of the electronic component in the electronic component package can be made substantially the same as the size of the functional surface of the electronic component, the overall size of the MEMS device can be reduced compared to the conventional case. Can be planned.

  In addition, a fourth casing in which the casing is formed with a recess capable of accommodating at least a part of the electronic component, and the signal processing IC is formed on a surface parallel to the functional surface of the electronic component, and the electronic component And a functional surface of the electronic component is disposed so as to face a side surface of the concave portion of the fourth casing and a side surface of the concave portion of the fifth casing. It is characterized by being.

  With this configuration, the functional surface of the electronic component is not parallel to the joint surface between the fourth casing and the fifth casing. For example, when forming the fourth to fifth casings with a wafer, On the other hand, the number of electronic components can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the bottom surface of the recess of the fourth casing or the fifth casing are configured to contact each other. Is formed in the vicinity of the side surface, and it is easily and reliably electrically connected by arranging a conductive material such as a conductive paste between the bottom surface of the recess of the fourth casing or the fifth casing. be able to. In addition, since the size in the plane parallel to the functional surface of the electronic component in the electronic component package can be made substantially the same as the size of the functional surface of the electronic component, the overall size of the MEMS device can be reduced compared to the conventional case. Can be planned.

  Further, the casing includes a sixth casing in which a recess capable of accommodating the electronic component is formed and the signal processing IC is formed on a surface parallel to a functional surface of the electronic component, and an opening of the recess. It is characterized by comprising a seventh casing to be covered, and being arranged so that the functional surface of the electronic component faces the side surface of the recess.

  With this configuration, the functional surface of the electronic component is not parallel to the joint surface between the sixth casing and the seventh casing. For example, when the sixth to seventh casings are formed of a wafer, On the other hand, the number of electronic components can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the bottom surface of the recess of the sixth casing are in contact with each other. While being formed, it can be easily and reliably electrically connected by arranging a conductive material such as a conductive paste between the bottom surface of the concave portion of the sixth casing. In addition, since the size in the plane parallel to the functional surface of the electronic component in the electronic component package can be made substantially the same as the size of the functional surface of the electronic component, the overall size of the MEMS device can be reduced compared to the conventional case. Can be planned.

  According to the electronic component package of the present invention, the functional surface having a large area in the electronic component is generally not parallel to the joint surface between the casing members composed of a plurality of members. When forming, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, since the side surface of the electronic component and the inner surface of the casing are in contact, while forming the electrodes on the front and back surfaces of the electronic component near the side surface, By providing a conductive material such as a conductive paste between the inner surface of the casing and the inner surface of the casing, electrical conduction can be easily and reliably obtained. In addition, since the size in the plane parallel to the functional surface of the electronic component in the electronic component package can be made substantially the same as the size of the functional surface of the electronic component, the overall size of the MEMS device can be reduced compared to the conventional case. Can be planned.

It is a perspective view of the electronic component package in 1st embodiment of this invention. It is sectional drawing which follows the AA line of FIG. It is sectional drawing which follows the BB line of FIG. It is a perspective view of the electronic component package in 2nd embodiment of this invention. It is sectional drawing which follows the CC line of FIG. It is a perspective view of the electronic component package in 3rd embodiment of this invention. It is sectional drawing which follows the DD line | wire of FIG.

(First embodiment)
Next, a first embodiment of an electronic component package according to the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the electronic component package 10 includes a flat electronic component 11, a casing 13 that covers the electronic component 11, and a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 13. And an external electrode 17 disposed on the outer peripheral surface of the casing 13, and a wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17.

  The electronic component 11 is composed of, for example, a MEMS or a crystal resonator, and has functional surfaces on the front surface 11a and the back surface 11b. Further, the side surface 11c of the electronic component 11 is joined to the surface 22c of the second casing 22 by a conductive material 15 made of a conductive paste. Further, an electrode 12 is formed in the vicinity of the side surface 11c on the front surface 11a and the back surface 11b.

  The casing 13 is a member having a substantially rectangular parallelepiped shape made of, for example, silicon and having a cavity formed therein. In the present embodiment, a first casing 21 in which a through hole 20 capable of accommodating the electronic component 11 is formed, a second casing 22 and a third casing 23 that respectively close both ends of the through hole 20 of the first casing 21, It consists of

  It arrange | positions so that the internal peripheral surface 31 of the through-hole 20 of the 1st casing 21 and the surface 11a of the electronic component 11 may oppose, and the internal peripheral surface 32 of the through-hole 20 and the back surface 11b of the electronic component 11 oppose. . The inner peripheral surfaces 31 and 32 are surfaces facing each other, and are inner peripheral surfaces having a larger area among the four inner peripheral surfaces of the through hole 20. Further, a signal processing IC is formed on the side wall of the first casing 21 facing the front surface 11a or the back surface 11b of the electronic component 11, and an amplifier circuit that amplifies the output signal of the electronic component 11, the sensitivity of the sensor, and the offset voltage. In addition, a temperature compensation circuit that corrects the temperature characteristics, a noise removal circuit that removes noise, and the like are integrated. However, since the circuit configuration and operation of these circuits are well known, illustration and description thereof are omitted. The signal processing IC and the electronic component 11 are electrically connected by a wiring (not shown).

  The second casing 22 and the third casing 23 are plate-like members. On the end faces 21a and 21b of the first casing 21, anodic bonding, adhesive bonding, or solder bonding using gold or tin, Cu, Al, Au , Ge, etc. are used for metal-metal bonding.

  Further, the through electrode 27 is formed by filling the inside of the through hole 25 (two in this embodiment) formed in the second casing 22 with a conductive paste or the like.

  Moreover, the notch part 21d is formed in the area | region in which the external electrode 17 is formed in the outer surface 21c of the first casing 21 (in this embodiment, two places). Further, a notch 22 b is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 22 a of the second casing 22. A wiring portion 19 made of a conductive paste or the like is formed in the cutout portion 22b. The conductive material 15 and the external electrode 17 are electrically connected by the wiring portion 19.

  According to the present embodiment, the functional surfaces (front surface 11 a and back surface 11 b) having a large area in the substantially flat electronic component 11 are members of the casing 13 including the first casing 21, the second casing 22, and the third casing 23. Therefore, the number of electronic components 11 can be increased with respect to the wafer constituting the casing 13. Therefore, the number of electronic component packages 10 taken out from the wafer can be increased.

  In addition, since the size of the electronic component package 10 in the direction parallel to the electronic component 11 can be made equal to the size of the electronic component 11, the electronic component package 10 can be downsized compared to the conventional one.

  In addition, both the front surface 11a and the back surface 11b of the electronic component 11 are functional surfaces, and the side surface 11c of the electronic component 11 and the surface 22c of the second casing 22 are in contact with each other. By disposing the conductive material 15 made of a conductive paste between the surface of the casing 22 and the surface of the casing 22, electrical conduction can be easily and reliably achieved.

(Second embodiment)
Next, a second embodiment of the electronic component package according to the present invention will be described with reference to FIGS. Note that the present embodiment is different from the first embodiment only in the configuration of the casing, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 4 and 5, the electronic component package 110 includes an electronic component 11, a casing 113 that covers the electronic component 11, a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 113, and a casing. The external electrode 17 disposed on the outer peripheral surface of the 113 and a wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17 are provided.

  The casing 113 includes a fourth casing 124 in which a recess 120 capable of accommodating approximately half of the electronic component 11 is formed, and a fifth casing 125 in which a recess 121 capable of accommodating approximately half of the electronic component 11 is formed. It is configured.

  The side surface 131 of the concave portion 120 of the fourth casing 124 and the front surface 11a of the electronic component 11 are opposed to each other, and the side surface 132 of the concave portion 120 and the back surface 11b of the electronic component 11 are opposed to each other. Further, a signal processing IC is formed on the side wall of the fourth casing 124 facing the front surface 11a or the back surface 11b of the electronic component 11, and an amplifier circuit that amplifies the output signal of the electronic component 11, the sensitivity of the sensor, and the offset voltage. In addition, a temperature compensation circuit that corrects the temperature characteristics, a noise removal circuit that removes noise, and the like are integrated. However, since the circuit configuration and operation of these circuits are well known, illustration and description thereof are omitted. The signal processing IC and the electronic component 11 are electrically connected by a wiring (not shown). Similarly, the side surface 133 of the concave portion 121 of the fifth casing 125 and the surface 11a of the electronic component 11 are opposed to each other, and the side surface 134 of the concave portion 121 and the back surface 11b of the electronic component 11 are opposed to each other. Note that the side surface 131 and the side surface 132, and the side surface 133 and the side surface 134 are surfaces facing each other, and are the side surfaces having the larger area among the four side surfaces of the recess 120 and the recess 121.

  The 4th casing 124 and the 5th casing 125 are joined in each end surface 124a and 125a. The fourth casing 124 has through holes 25 (two in this embodiment), and the through electrodes 27 are formed by filling the through holes 25 with a conductive paste or the like.

  Further, a notch 124d is formed in a region where the external electrode 17 is formed on the outer surface 124c of the fourth casing 124. Furthermore, a notch 124e is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 124b of the fourth casing 124. The wiring part 19 is formed in the notch part 124e.

  According to the present embodiment, the functional surfaces (the front surface 11 a and the back surface 11 b) having a large area in the substantially flat electronic component 11 are parallel to the joint surfaces of the members of the casing 113 including the fourth casing 124 and the fifth casing 125. In addition, since they are arranged in a substantially orthogonal direction, it is possible to increase the number of electronic components 11 arranged on the wafer constituting the casing 113. The wafer can be used effectively.

  In addition, since the size of the electronic component package 10 in the direction parallel to the substantially flat plate-like electronic component 11 can be made the same size as the substantially flat plate-like electronic component 11, the electronic component package 10 is smaller than the conventional size. Can be achieved.

  Moreover, since it has functional surfaces on both the front surface 11a and the back surface 11b of the electronic component 11 and the side surface 11c of the electronic component 11 and the bottom surface 120a of the recess 120 of the fourth casing 124 are in contact with each other, the side surface of the electronic component 11 By arranging the conductive material 15 made of a conductive paste between 11c and the bottom surface 120a of the recess 120, electrical conduction can be easily and reliably achieved.

(Third embodiment)
Next, a third embodiment of the electronic component package according to the present invention will be described with reference to FIGS. Note that the present embodiment is different from the first embodiment only in the configuration of the casing, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 6 and 7, the electronic component package 210 includes an electronic component 11, a casing 213 that covers the electronic component 11, a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 213, and a casing. The external electrode 17 arranged on the outer peripheral surface of 213, and the wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17 are provided.

  The casing 213 includes a sixth casing 226 in which a recess 220 capable of accommodating the electronic component 11 is formed, and a substantially flat seventh casing 227 that closes the recess 220.

  It arrange | positions so that the side surface 231 of the recessed part 220 of the 6th casing 226 and the surface 11a of the electronic component 11 may oppose, and the side surface 232 of the recessed part 220 and the back surface 11b of the electronic component 11 may oppose. The side surface 231 and the side surface 232 are surfaces facing each other, and are the side surfaces having the larger area among the four side surfaces of the recess 220. Further, a signal processing IC is formed on the side wall of the sixth casing 226 facing the front surface 11a or the back surface 11b of the electronic component 11, and an amplifier circuit that amplifies the output signal of the electronic component 11, the sensitivity of the sensor, and the offset voltage. In addition, a temperature compensation circuit that corrects the temperature characteristics, a noise removal circuit that removes noise, and the like are integrated. However, since the circuit configuration and operation of these circuits are well known, illustration and description thereof are omitted. The signal processing IC and the electronic component 11 are electrically connected by a wiring (not shown).

  The sixth casing 226 and the seventh casing 227 are joined at the end face 226a of the sixth casing 226. The sixth casing 226 has through holes 25 (two in the present embodiment), and the through electrodes 27 are formed by filling the through holes 25 with a conductive paste or the like.

  Further, a notch 226d is formed in a region where the external electrode 17 is formed on the outer surface 226c of the sixth casing 226. Further, a notch 226 e is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 226 b of the sixth casing 226. A wiring portion 19 is formed in the notch 226e.

  According to the present embodiment, the functional surfaces (the front surface 11 a and the back surface 11 b) having a large area in the substantially flat electronic component 11 are parallel to the joint surfaces between the members of the casing 213 including the sixth casing 226 and the seventh casing 227. In addition, since they are arranged in a substantially orthogonal direction, it is possible to increase the number of electronic components 11 arranged on the wafer constituting the casing 213.

  In addition, since the size of the electronic component package 10 in the direction parallel to the substantially flat plate-like electronic component 11 can be made the same size as the substantially flat plate-like electronic component 11, the electronic component package 10 is smaller than the conventional size. Can be achieved.

  Moreover, since it has functional surfaces on both the front surface 11a and the back surface 11b of the electronic component 11 and the side surface 11c of the electronic component 11 and the bottom surface 220a of the recess 220 of the sixth casing 226 are in contact with each other, the side surface of the electronic component 11 By arranging the conductive material 15 made of a conductive paste between 11c and the bottom surface 220a of the concave portion 220, electrical conduction can be easily and reliably achieved.

  Note that the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.

  For example, in the present embodiment, the case where a silicon wafer is used for the casing has been described, but a glass substrate, ceramic, or metal substrate can also be used.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component package 11 ... Electronic component 11a ... Front surface (functional surface) 11b ... Back surface (functional surface) 13 ... Casing 20 ... Through-hole 21 ... First casing 21a ... End surface (joint surface) 21b ... End surface (joint surface) 22 ... second casing 22c ... surface (mounting surface) 23 ... third casing 31 ... inner peripheral surface 32 ... inner peripheral surface 110 ... electronic component package 120 ... recessed portion 121 ... recessed portion 124 ... fourth casing 125 ... fifth casing 131,132 ... Side 133,134 ... Side 210 ... Electronic component package 220 ... Recess 226 ... Sixth casing 227 ... Seventh casing 231,232 ... Side

Claims (5)

Electronic components,
In an electronic component package having a casing formed by joining a plurality of constituent members so as to cover the electronic component,
The functional surface of the electronic component and the joint surface between the component members of the casing are arranged so as to intersect with each other, and the signal processing surface is parallel to the functional surface of the electronic component of the component member of the casing. An electronic component package in which an IC is formed.   The electronic component package according to claim 1, wherein a functional surface of the electronic component and a mounting surface of the electronic component in the casing are arranged to intersect each other. The casing includes a first casing in which a through-hole capable of accommodating the electronic component is formed and the signal processing IC is formed in a plane parallel to a functional surface of the electronic component, and openings at both ends of the through-hole. A second casing and a third casing covering the
The electronic component package according to claim 1, wherein a functional surface of the electronic component is disposed so as to face an inner peripheral surface of the through hole. The casing includes a fourth casing in which a recess capable of accommodating at least a part of the electronic component is formed, and the signal processing IC is formed on a surface parallel to a functional surface of the electronic component. Consists of a fifth casing formed with a recess capable of accommodating a part,
3. The electronic component package according to claim 1, wherein the functional surface of the electronic component is disposed so as to face a side surface of the concave portion of the fourth casing and a side surface of the concave portion of the fifth casing. The casing includes a sixth casing in which a recess capable of accommodating the electronic component is formed and the signal processing IC is formed on a surface parallel to a functional surface of the electronic component, and a first casing that covers the opening of the recess. Consisting of seven casings,
The electronic component package according to claim 1, wherein the electronic component package is disposed so that a functional surface of the electronic component faces a side surface of the recess.

Images