JP2010098340A - Piezoelectric vibrator, piezoelectric oscillator, and method of manufacturing piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that there is a limit to thickness reduction and the frequency of a piezoelectric vibration piece shifts from a desired frequency due to an influence of heat generation of an oscillation circuit etc. <P>SOLUTION: A piezoelectric oscillator (10) includes: a piezoelectric vibrator (11) which houses the piezoelectric vibration piece (114) and is provided with a pair of first electrode portions (111) on a bottom surface; a circuit module (13) which is disposed on the same plane with the piezoelectric vibrator (11) and on which a circuit element is mounted; and a lead frame (12) which electrically connects the piezoelectric vibrator (11) with the circuit module (13), and is provided with a pair of second electrode portions (122). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibrator, a piezoelectric oscillator, and a method for manufacturing a piezoelectric oscillator, and more particularly to a piezoelectric vibrator, a piezoelectric oscillator, and a method for manufacturing a piezoelectric oscillator in which a piezoelectric vibrator and a circuit module are arranged in the same plane.

  Due to the rapid progress of miniaturization and price reduction with the spread of mobile communication devices such as mobile phones, demands for thinning, miniaturization, and price reduction are also required for piezoelectric oscillators used in these communication devices. Is growing.

  A piezoelectric oscillator disclosed in Patent Document 1 has been proposed. FIG. 9A is a cross-sectional view of the piezoelectric oscillator. As shown in FIG. 9A, the opening is hermetically sealed by the lid 43 in a state where the piezoelectric vibrating piece 41 and the semiconductor component 42 are housed together vertically in the recess of the package 40. The package 40 is made of ceramic or the like, and the semiconductor component 42 includes a capacitor, a resistor, an integrated circuit, and the like that constitute an oscillation circuit. FIG. 9B is a bottom view of the piezoelectric oscillator shown in FIG.

In addition, the piezoelectric oscillator disclosed in Patent Document 2 has piezoelectric vibration on a circuit board 45 as shown in FIGS. 10A and 10B in order to make the piezoelectric oscillator shown in FIG. 9 thinner. The child 46 and the module substrate 47 are mounted so as to be adjacent to each other. Further, after the circuit element 48 is mounted on the module substrate 47 of the piezoelectric oscillator, the piezoelectric vibrator 46, the circuit element 48 and the module substrate 47 are covered with a sealing material 49.
JP 2004-015441 A JP 2007-036536 A

  The piezoelectric oscillator disclosed in Patent Document 1 has a problem that since the crystal oscillator and the semiconductor component are mounted on the upper and lower sides, the overall height of the piezoelectric oscillator is increased and the thickness cannot be reduced. In addition, the piezoelectric vibrating piece and a semiconductor component such as a resistor constituting the oscillation circuit are housed in the same recess. For this reason, there is also a problem that the frequency of the piezoelectric vibrating piece shifts due to the influence of heat generation of the oscillation circuit and deviates from a desired frequency. Therefore, there is a limit to reducing the overall thickness of the piezoelectric oscillator and maintaining the operating temperature of the piezoelectric vibrator constant.

  In order to solve the above-described problem, the piezoelectric oscillator disclosed in Patent Document 2 is provided with a piezoelectric vibrator and a circuit module on a circuit board so as to be adjacent to each other on the same plane. However, the total height of the piezoelectric oscillator is at least the thickness of the circuit board plus the thickness of the piezoelectric vibrator or circuit module. For this reason, further thinning cannot be achieved, and additional steps such as connecting the piezoelectric vibrator and the circuit module by wire bonding increase, resulting in an increase in cost.

  In view of the above-described problems, the present invention provides a piezoelectric oscillator in which the height of the piezoelectric oscillator is further reduced and the piezoelectric vibrator is not affected by the heat generated by the circuit, and a method for manufacturing the piezoelectric oscillator.

A piezoelectric vibrator according to a first aspect includes a piezoelectric vibrating piece and a package that accommodates the piezoelectric vibrating piece, and at least four connection terminals are formed on a side surface, and a pair of electrode portions and a connection terminal are provided on a bottom surface. A lead portion for connecting the pair of connection terminals and the pair of electrode portions, respectively, is formed.
According to such a configuration, a piezoelectric vibrator suitable for downsizing and thinning of the piezoelectric oscillator can be provided.

The piezoelectric oscillator according to the second aspect accommodates a piezoelectric vibrating piece and is arranged side by side on the same plane as the piezoelectric vibrator having a pair of first electrode portions provided on the bottom surface and mounted with a circuit element. And a lead frame provided with a pair of second electrode portions and electrically connecting the piezoelectric vibrator and the circuit module.
According to such a configuration, the circuit board essential in Patent Document 2 is not required, and the piezoelectric vibrator and the circuit module are provided on the same plane. Note that the height of the piezoelectric oscillator is the sum of the thickness of the piezoelectric vibrator and the thickness of the electrode portion, and the overall piezoelectric oscillator can be made thinner. Furthermore, it is possible to prevent the frequency of the piezoelectric vibrator from shifting due to the heat from the circuit module and deviating from the desired frequency.

  In the piezoelectric oscillator according to the third aspect, the side surface of the piezoelectric vibrator includes four connection terminals that are connected to the circuit module via the lead frame, and the bottom surface of the piezoelectric vibrator is a pair of connection terminals of the four connection terminals. And a pair of first electrode portions.

The lead frame of the piezoelectric oscillator according to the fourth aspect includes a first lead portion connected to the connection terminal of the piezoelectric vibrator and a second lead portion connected to the second electrode portion.
According to the third and fourth aspects, the circuit board is unnecessary, and the piezoelectric vibrator and the circuit module are arranged side by side on the same plane.

The piezoelectric oscillator in the fifth aspect covers the piezoelectric vibrator and the circuit module with a sealing material.
According to such a structure, it can prevent receiving the influence of a water | moisture content etc.

In the piezoelectric oscillator according to the sixth aspect, the first lead portion and the second lead portion are covered with a sealing material, and the pair of first electrode portions and the pair of second electrode portions are not covered with the sealing material.
By sealing in this way, the first electrode and the second electrode can be exposed to the outside and connected to an external power source to supply power to the piezoelectric vibrator and the circuit module.

According to a seventh aspect of the present invention, there is provided a piezoelectric oscillator manufacturing method comprising: preparing a piezoelectric vibrator having a pair of first electrode portions; preparing a circuit module on which circuit elements are mounted; and forming a pair of second electrode portions. A prepared lead frame, a step of arranging and electrically connecting the circuit modules in the same plane as the piezoelectric vibrator via the lead frame, a pair of first electrode portions and a pair of second electrode portions And a step of covering the piezoelectric vibrator and the circuit module with a sealing material so that is exposed to the surface.
According to such a method, the circuit board which is essential in Patent Document 2 is unnecessary, and a piezoelectric oscillator that can be thinned can be manufactured. Furthermore, a piezoelectric oscillator that can prevent the frequency of the piezoelectric vibrator from being shifted from the desired frequency by heat from the circuit module is manufactured.

  In the piezoelectric oscillator manufacturing method according to the eighth aspect, the step of preparing the piezoelectric vibrator includes a step of forming four connection terminals connected to the circuit module on the side surface, a pair of the first electrode portion and the first electrode portion. Forming a pair of drawer portions to be connected to the bottom surface.

  In the piezoelectric oscillator manufacturing method according to the ninth aspect, the step of preparing the lead frame includes forming a first lead portion connected to the connection terminal and forming a second lead portion connected to the second electrode portion. A process.

In the piezoelectric oscillator manufacturing method according to the tenth aspect, a plurality of first lead portions are formed on the first base material, and a plurality of second electrode portions and second lead portions are formed on the second base material. The base material is separated from the first electrode portion and the first lead portion before being covered with the sealing material, and the second base material is separated from the second electrode portion after being covered with the sealing material.
As described above, the manufacturing method using the base material does not require an additional process such as connecting the piezoelectric vibrator and the circuit module by wire bonding, and can achieve mass production. Therefore, the manufacturing cost can be reduced.

  In the present invention, since the piezoelectric vibrator and the circuit module are provided side by side on the same plane, the piezoelectric oscillator can be thinned. Further, it is possible to prevent the frequency of the piezoelectric vibrator from being shifted due to heat from the circuit module and deviating from a desired frequency. Further, since the piezoelectric vibrator and the circuit module are covered with the sealing material, it is possible to prevent the influence of moisture and the like. Furthermore, since an additional process such as connecting the piezoelectric vibrator and the circuit module by wire bonding is not required, the manufacturing cost can be reduced.

(First embodiment)
Hereinafter, the piezoelectric vibrator 11, the piezoelectric oscillator 10, and the method for manufacturing the piezoelectric oscillator 10 according to the first embodiment will be described with reference to FIGS.

<About the piezoelectric vibrator 11>
FIG. 1 is a diagram illustrating a configuration of a piezoelectric vibrator 11 according to the present embodiment. Among them, (a) is a bottom view, (b) is a BB cross-sectional view of (a), and (c) is a CC cross-sectional view of (a).

  As shown in FIG. 1A, the piezoelectric vibrator 11 of this embodiment is provided with a pair of first electrode portions 111 at both corners of the long side of a package 116 made of ceramic, Four connection terminals 112 are formed at equal intervals near the center of the long side. A pair of connection terminals 112 </ b> A outside the four connection terminals 112 are respectively connected to the pair of first electrode portions 111 via the lead-out portions 113. In the present embodiment, the bottom surface of the connection terminal 112 is semicircular, but when viewed from the side, the cylinder is divided in half (see FIG. 2). The connection terminal 112 may have a shape obtained by dividing another quadrangular prism in half.

As shown in FIG. 1B, a piezoelectric vibrating piece 114 and a conductive adhesive 115 are included in the piezoelectric vibrator 11 of this embodiment. Here, the piezoelectric vibrating piece 114 is housed in a package 116 that is in a vacuum or inert gas state. The piezoelectric vibrating piece 114 is fixed to the inner bottom surface of the package 116 by the conductive adhesive 115 and is accommodated in the package 116. Further, the piezoelectric vibrating piece 114 includes a crystal vibrating piece, and there are various types such as an AT vibrating piece, a SAW vibrating piece, and a tuning fork type vibrating piece.
Further, as shown in FIG. 1C, the first electrode portion 111 is thinner than the lead portion 113.

  In this embodiment, the pair of outer connection terminals 112A out of the four connection terminals 112 are electrically connected to the first electrode portion 111 connected to an external power source (not shown). Although not shown, a pair of inner connection terminals 112 </ b> B among the four connection terminals 112 are electrically connected to the piezoelectric vibrating piece 114 by a wiring pattern provided on the package 116 and a conductive adhesive 115. That is, out of the four connection terminals 112 of the piezoelectric vibrator 11, the pair of outer connection terminals 112 </ b> A transmits signals from the piezoelectric vibrator 11 to the outside, and the pair of inner connection terminals 112 </ b> B transmits signals from the outside to the piezoelectric vibrator 11. .

  According to the above-described configuration, the piezoelectric vibrator 11 suitable for reducing the size and thickness of the piezoelectric oscillator 10 can be provided.

<About the piezoelectric oscillator 10>
Next, the piezoelectric oscillator 10 will be described with reference to FIGS.

FIG. 2 is an exploded view of the piezoelectric oscillator 10 according to this embodiment.
As shown in FIG. 2, the piezoelectric oscillator 10 includes the piezoelectric vibrator 11 shown in FIG. 1, a lead frame 12, and a circuit module 13. Here, the lead frame 12 includes a pair of four first lead parts 121 (including 121A and 121B corresponding to the connection terminals 112A and 112B of the piezoelectric vibrator 11) connected to the connection terminal 112 of the piezoelectric vibrator 11 and a pair. A pair of second electrode portions 122 corresponding to the first electrode portion 111 and a pair of second lead portions 123 connected to the pair of second electrode portions 122. Here, the pair of second lead portions 123 are provided on the pair of second electrode portions 122, respectively. In order to facilitate manufacture, the plurality of first lead parts 121 are connected by a first base material 124, and the plurality of second electrode parts 122 and the second lead part 123 are connected by a second base material 125. . Further, the circuit module 13 has a plurality of circuit elements (at least one of IC, transistor, resistor, capacitor, thermistor, etc.) formed therein.

FIG. 3 is a perspective view showing a state before the piezoelectric oscillator 10 according to the present embodiment is assembled and before being covered with a sealing material 14 to be described later.
As shown in FIG. 3, the piezoelectric vibrator 11 and the circuit module 13 are installed side by side on the same plane by the lead frame 12. Here, the first lead portions 121A and 121B are connected to the connection terminals 112A and 112B of the piezoelectric vibrator 11 shown in FIG. 2, respectively, and the upper surface of the piezoelectric vibrator 11 is brought into contact with the first base material 124. Install in. As a result, the first lead 121 is stably in contact with the connection terminal 112. The circuit module 13 is installed on a plane constituted by the terminals of the first lead portion 121 and the second lead portion 123.

4A and 4B are diagrams showing the connection configuration of the piezoelectric oscillator 10 according to the present embodiment, in which FIG. 4A is a bottom view and FIG. 4B is a side view.
As shown in FIG. 4A, the six terminals of the first lead portion 121 and the second lead portion 123 of the lead frame 12 have six terminals (in the longitudinal direction) provided on the bottom surface of the circuit module 13. 2 columns are formed at equal intervals (2 × 3 matrix). The terminal of the circuit module 13 includes a terminal (not shown) for controlling the piezoelectric oscillator 10, two input / output terminals (not shown) to the piezoelectric vibrating piece 114, a terminal connected to the ground (not shown), A terminal (not shown) for supplying power to the circuit element and an output terminal (not shown) of the piezoelectric oscillator 10 are included.

  As shown in FIG. 4B, the first electrode portion 111 and the second electrode portion 122 are on the same plane of the plane PL, and the other lead portion 113, the first lead portion 121, and the second lead portion. 123 is provided so as not to contact the PL.

  As shown in FIGS. 2 to 4, the piezoelectric oscillator 10 is electrically connected to the piezoelectric vibrator 11 and the circuit module 13 via the lead frame 12, and operates by an oscillation circuit and a temperature compensation circuit of the circuit module 13. First, the first electrode portion 111 of the piezoelectric vibrator 11 and the second electrode portion 122 of the lead frame 12 are connected to an external power source (not shown). The first electrode portion 111 is electrically connected to the circuit module 13 by the lead portion 113 and the pair of outer connection terminals 112 </ b> A and the first lead portion 121 </ b> A, and the second electrode portion 122 is electrically connected by the second lead portion 123. Further, the circuit module 13 and the piezoelectric vibrator 11 transmit signals through a pair of inner first lead portions 121B and connection terminals 112B. Accordingly, the piezoelectric oscillator 10 oscillates the piezoelectric vibrating reed 114 by the oscillation circuit or the temperature compensation circuit of the circuit module 13 and performs temperature compensation.

<About the manufacturing method of the piezoelectric oscillator 10>
Next, a method for manufacturing the piezoelectric oscillator 10 described in this embodiment will be described with reference to the drawings. FIG. 5 is a flowchart showing a manufacturing process of the piezoelectric oscillator 10 according to the present embodiment. Hereinafter, the manufacturing method of the piezoelectric oscillator 10 of the present embodiment will be described in the order shown in FIG.

  First, the piezoelectric vibrator 11 is prepared (step S11). This process includes the following steps as indicated by a broken line S11 in FIG.

  The piezoelectric vibrating piece 114 is fixed and accommodated on the inner bottom surface of the package 116 in a vacuum or inert gas state by the conductive adhesive 115 (step S111). Here, as the conductive adhesive 115, a silicone resin containing a conductive material such as silver filler is used. The piezoelectric vibrating piece 114 is formed by covering a quartz piece with a metal such as gold (Au) or silver (Ag) sequentially on the both sides of a quartz piece by chemical vapor deposition and etching, etc. Form. The package 116 is made of ceramic or the like, and has a wiring pattern that constitutes an oscillation circuit and a temperature compensation circuit.

  Connection terminals 112 are formed at equal intervals near the center of the side surface of the piezoelectric vibrator 11 (step S112). Here, there are four connection terminals 112, which are formed by digging into the long side surface of the piezoelectric vibrator 11 so as to have a cylindrical or quadrangular prism shape.

  The first electrode portion 111 and the lead portion 113 are formed on the bottom surface of the piezoelectric vibrator 11 (step S113). First, the pair of first electrode portions 111 is formed at both corners of the other long side facing the side where the connection terminal 112 is provided. Then, a lead portion 113 that connects the pair of connection terminals 112A outside the connection terminal 112 and the pair of first electrode portions 111 is formed. Here, an Fe—Ni-based alloy is widely used for the first electrode part 111 and the lead part 113.

  Next, a lead frame 12 for connecting the piezoelectric vibrator 11 and the circuit module 13 is prepared (step S12). As shown by the broken line S12 in FIG. 5, in step S12, the first lead portion 121 is formed by a mold (step S121), and the second electrode portion 122 and the second lead portion 123 are formed by a mold (step S121). S122). Here, in view of thermal expansion, electrical characteristics, and strength, the first lead portion 121, the second electrode portion 122, and the second lead portion 123 are widely used Fe-Ni alloys and have the shape shown in FIG. Form. Further, the plurality of first lead parts 121 are connected by the first base material 124, and the plurality of second electrode parts 122 and the second lead part 123 are connected by the second base material 125 to be manufactured at the same time.

  In addition, a circuit module 13 including circuit elements such as an IC, a transistor, a resistor, a capacitor, and a thermistor and including an oscillation circuit and a temperature compensation circuit is prepared (step S13). As indicated by the broken line S13 in FIG. 5, in step S13, the circuit element is fixed by solder (step S131), and a connection terminal to which the terminal of the REIT frame 12 is connected is formed on the bottom surface (step S132). The circuit element is covered with resin.

  Thereafter, the piezoelectric vibrator 11 is fixed to the lead frame 12 with a conductive adhesive or solder (step S14). At this time, the connection terminal 112 of the piezoelectric vibrator 11 is connected to the first lead portion 121 of the lead frame 12, and the first base material 124 is brought into contact with the upper surface of the piezoelectric vibrator 11, thereby It is fixed to the lead frame 12.

  Further, the circuit module 13 is fixed to the lead frame 12 so as to be arranged in the same plane as the piezoelectric vibrator 11 (step S15). Here, as shown in FIG. 4, the circuit module 13 is fixed to the lead frame 12 so that the six terminals of the circuit module 13 and the terminals of the lead frame 12 are aligned.

  Next, the first base material 124 is separated from the first lead portion 121 (step S16). After the piezoelectric vibrator 11 and the circuit module 13 are fixed to each other by the lead frame 12, the first base material 124 indicated by a one-dot chain line in FIGS.

  In addition, the piezoelectric vibrator 11, the lead frame 12, and the circuit module 13 are covered with the sealing material 14 so that the pair of first electrode portions 111 and the pair of second electrode portions 122 are exposed on the surface (step S17). As shown in FIG. 4B, the first electrode portion 111 and the second electrode portion 122 are provided lower than the lead portion 113, the first lead portion 121, and the second lead portion 123, so that they are on the surface. It can be sealed so that it is exposed. 6A and 6B show a state after sealing with the sealing material 14. FIG. 6A is a perspective view showing a state in which a thermosetting resin such as an epoxy resin is used as the sealing material 14 to cover the piezoelectric vibrator 11 and the circuit module 13. FIG. 6B is a bottom view showing a state in which the pair of first electrode portions 111 and the pair of second electrode portions 122 are exposed on the surface.

  Finally, the second base material 125 connected to the second electrode portion 122 is separated from the plurality of piezoelectric oscillators 10 (step S18). The plurality of piezoelectric oscillators 10 are connected to the second base material 125 through the above-described process. By separating the second base material 125 from the plurality of piezoelectric oscillators 10, the manufacture of the piezoelectric oscillator 10 according to the present embodiment is completed. Since the plurality of piezoelectric oscillators 10 are connected until the second base material 125 is separated in step S18, many piezoelectric oscillators 10 can be handled at a time.

  In the piezoelectric oscillator 10 formed by the manufacturing method of this embodiment, since the piezoelectric vibrator 11 and the circuit module 13 are provided in the same plane by the lead frame 12, the piezoelectric oscillator 10 can be thinned. Become. And it can prevent that the frequency of the piezoelectric vibrator 11 shifts with the heat | fever from the circuit module 13, and shift | deviates from a desired frequency. Further, since the piezoelectric vibrator 11 and the circuit module 13 are covered with the sealing material 14, it is possible to prevent the influence of moisture or the like. Furthermore, since a plurality of piezoelectric oscillators 10 can be manufactured simultaneously with the first base material 124 and the second base material 125, the manufacturing cost can be reduced.

(Second embodiment)
Hereinafter, a method of manufacturing the piezoelectric vibrator 21, the piezoelectric oscillator 20, and the piezoelectric oscillator 20 according to the second embodiment will be described with reference to the drawings. Here, the same members will be described with the same symbols.

<About the piezoelectric vibrator 21>
FIG. 7 is an exploded view of the piezoelectric oscillator 20 according to the present embodiment. As shown in FIG. 7, the piezoelectric vibrator 21 of the present embodiment has a piezoelectric vibrating piece 114 housed in a package 216 that is in a vacuum or inert gas state. Further, two connection terminals 212 are formed at equal intervals near the center of the long side surface of the package 216 made of ceramic. In this embodiment, the connection terminal 212 has a shape in which a cylinder is divided in half when viewed from the side. The connection terminal 212 may have a shape obtained by dividing another quadrangular prism in half.

  In this embodiment, the two connection terminals 212 are electrically connected to the piezoelectric vibrating piece 114 by a wiring pattern (not shown) provided on the package 216 and a conductive adhesive (not shown) in which the piezoelectric vibrating piece 114 is fixed in the package 216. Has been.

  According to the above-described configuration, the piezoelectric vibrator 21 suitable for reducing the size and thickness of the piezoelectric oscillator 20 can be provided.

<About the piezoelectric oscillator 20>
As shown in FIG. 7, the piezoelectric oscillator 20 includes the piezoelectric vibrator 21, the lead frame 22, and the circuit module 13 described in this embodiment. Here, the lead frame 22 includes a pair of first electrode portions 211, four first lead portions 221 in which two outer lead portions 221A are connected to the pair of first electrode portions 211, and a pair of first electrodes. A pair of second electrode portions 122 corresponding to the portion 211 and a pair of second lead portions 123 connected to the pair of second electrode portions 122 are provided. The first electrode portion 211 and the second electrode portion 122 are located on the same plane, and the first lead portion 221 and the second lead portion 123 are provided on the first electrode portion 211 and the second electrode portion 122, respectively. Yes. Further, in order to facilitate manufacture, the plurality of first electrode portions 211 and the first lead portions 221 are connected by a first base material 224, and the plurality of second electrode portions 122 are connected by a second base material 125. . Further, although not shown, the piezoelectric vibrator 21 and the circuit module 13 are arranged side by side on the same plane by the lead frame 22 as shown in FIG.

  In addition, since the connection structure of the piezoelectric oscillator 20 of a present Example is the same as the structure shown by FIG. 4, description is abbreviate | omitted here. As in the first embodiment, the first electrode portion 211 and the second electrode portion 122 are on the same plane, and the first lead portion 221 and the second lead portion 123 are provided on the plane. .

  In the piezoelectric oscillator 20 of this embodiment, the piezoelectric vibrator 21 and the circuit module 13 are electrically connected via the lead frame 22 and are operated by the oscillation circuit and the temperature compensation circuit of the circuit module 13. First, the first electrode portion 211 and the second electrode portion 222 of the lead frame 22 are connected to an external power source (not shown). Here, the pair of first electrode portions 211 is electrically connected to the circuit module 13 by a pair of outer first lead portions 221 </ b> A, and the pair of second electrode portions 122 is electrically connected by a pair of second lead portions 123. The circuit module 13 and the piezoelectric vibrator 21 transmit signals through a pair of first lead portions 221 </ b> B inside the lead frame 22 and a pair of connection terminals 212 provided on the piezoelectric vibrator 21. Therefore, the piezoelectric oscillator 20 oscillates the piezoelectric vibrating reed 114 by the oscillation circuit or the temperature compensation circuit of the circuit module 13 and performs temperature compensation.

<About the manufacturing method of the piezoelectric oscillator 20>
FIG. 8 is a flowchart showing the manufacturing process of the piezoelectric oscillator 20 according to this embodiment. Hereinafter, the manufacturing method of the piezoelectric oscillator 20 of the present embodiment will be described in the order shown in FIG.

  First, the piezoelectric vibrator 21 is prepared (step S21). As shown by the broken line S21 in FIG. 8, the following steps are included.

  With the conductive adhesive (not shown), the piezoelectric vibrating reed 114 is fixed and accommodated on the inner bottom surface of the package 216 in a vacuum or inert gas state (step S211). Here, the package 216 is made of ceramic or the like, and has a wiring pattern constituting an oscillation circuit and a temperature compensation circuit.

  A pair of connection terminals 212 is formed near the center of the side surface of the piezoelectric vibrator 21 (step S212). Here, the connection terminal 212 is formed by digging into the long side surface of the piezoelectric vibrator 21 so as to form a cylindrical shape or a quadrangular prism.

  Next, a lead frame 22 for connecting the piezoelectric vibrator 21 and the circuit module 13 is prepared (step S22). As shown by the broken line S22 in FIG. 8, in step S22, the first electrode portion 211 and the first lead portion 221 are formed by a mold (step S221), and the second electrode portion 122 and the second lead portion are formed by the mold. 123 is formed (step S222). Here, in view of thermal expansion, electrical characteristics, and strength, the first electrode portion 211 and the first lead portion 221 are widely used Fe-Ni alloys, and form a shape as shown in FIG. Further, the plurality of first electrode portions 211 and the first lead portion 221 are connected by the first base material 224, and the plurality of second electrode portions 122 and the second lead portion 123 are connected by the second base material 125 to be simultaneously manufactured. .

  Further, a circuit module 13 including a circuit element such as an IC, a transistor, a resistor, a capacitor, and a thermistor and including an oscillation circuit and a temperature compensation circuit is prepared (step S23). As indicated by the broken line S23 in FIG. 8, in step S23, the circuit element is fixed by solder (step S231), and a connection terminal to which the terminal of the REIT frame 22 is connected is formed on the bottom surface (step S232). The circuit element is covered with resin.

  Thereafter, the piezoelectric vibrator 21 is fixed to the lead frame 22 with a conductive adhesive or solder (step S24). At this time, the piezoelectric vibrator 21 is mounted on the outer pair of first lead portions 221A, and the connection terminals 212 of the piezoelectric vibrator 21 are brought into contact with the inner pair of first lead portions 221B, thereby making the piezoelectric vibrator 21 is fixed to the lead frame 22.

  Further, the circuit module 13 is fixed to the lead frame 22 so as to be arranged in the same plane as the piezoelectric vibrator 21 (step S25). Here, as shown in FIG. 4, the circuit module 13 is fixed to the lead frame 22 so that the six terminals of the circuit module 13 and the terminals of the lead frame 22 are aligned.

  Further, the first base material 224 is separated from the first electrode portion 211 and the first lead portion 221 (step S26). After the piezoelectric vibrator 21 and the circuit module 13 are fixed by the lead frame 22, the first base material 224 indicated by a one-dot chain line in FIG. 7 is separated from the plurality of first electrode portions 211 and the first lead portions 221.

  Further, the piezoelectric vibrator 21, the lead frame 22, and the circuit module 13 are covered with a sealing material (not shown) so that the pair of first electrode portions 211 and the pair of second electrode portions 122 are exposed on the surface (step S27). ). Since the first electrode portion 211 and the second electrode portion 122 are provided on a lower plane than the first lead portions 221A, 221B and the second lead portion 123, they can be sealed so as to be exposed on the surface. 6A and 6B show a state after sealing with the sealing material 14.

  Finally, the second base material 125 connected to the second electrode portion 122 is separated from the piezoelectric oscillator 20 (step S28). The plurality of piezoelectric oscillators 20 are connected to the second base material 125 through the above-described process. By separating the second base material 125 from the plurality of piezoelectric oscillators 20, the manufacture of the piezoelectric oscillator 20 according to the present embodiment is completed.

  In the piezoelectric oscillator 20 formed by the manufacturing method of the present embodiment, the piezoelectric vibrator 21 and the circuit module 13 are provided on the same plane by the lead frame 22, so that the piezoelectric oscillator 20 can be thinned. Become. The frequency of the piezoelectric vibrator 21 is shifted by the heat from the circuit module 13 and can be prevented from deviating from a desired frequency. In addition, since the piezoelectric vibrator 21 and the circuit module 13 are covered with the sealing material, the influence of moisture or the like can be prevented. Furthermore, since the plurality of piezoelectric oscillators 20 can be manufactured simultaneously by the first base material 224 and the second base material 125, the manufacturing cost can be reduced.

  Compared to the first embodiment, the first electrode portion 211 is manufactured together with the first lead portion 221 instead of providing the first electrode portion 111 and the extraction portion 113 on the bottom surface of the piezoelectric vibrator 11. Furthermore, instead of the four connection terminals 112, only the two connection terminals 212 are formed, and the manufacturing process of the piezoelectric vibrator 21 becomes easier.

  As described above, it is possible to obtain a thin piezoelectric oscillator capable of satisfying various requirements such as stabilization of oscillation frequency, reduction of power consumption, improvement of assembling property, and cost reduction while achieving reduction in thickness.

  Further, although the optimal embodiment of the present invention has been described in detail, it will be apparent to those skilled in the art that the present invention can be implemented with various modifications and variations within the technical scope thereof.

It is a figure which shows the structure of the piezoelectric vibrator which concerns on a 1st Example. Among them, (a) is a bottom view, (b) is a BB cross-sectional view of (a), and (c) is a CC cross-sectional view of (a). It is an assembly exploded view of the piezoelectric oscillator according to the first embodiment. It is a perspective view after assembling the piezoelectric oscillator according to the first embodiment. It is a figure which shows the connection structure of the piezoelectric oscillator which concerns on a 1st Example. Among these, (a) is a bottom view and (b) is a side view. It is a flowchart which shows the manufacturing process of the piezoelectric oscillator which concerns on a 1st Example. It is a figure which shows the state which covered the piezoelectric vibrator and circuit module which concern on this invention with the sealing material. Among them, (a) is a perspective view and (b) is a bottom view. It is an assembly exploded view of the piezoelectric oscillator according to the second embodiment. It is a flowchart which shows the manufacturing process of the piezoelectric oscillator which concerns on a 2nd Example. It is a figure which shows the structure of the conventional piezoelectric oscillator with which the piezoelectric vibrator and the semiconductor component were formed up and down. Among them, (a) is a sectional view of an example, and (b) is a bottom view of (a). It is a figure which shows the structure of the piezoelectric oscillator formed so that the conventional piezoelectric vibrator and the circuit module might adjoin on a circuit board. Among these, (a) is a plan view and (b) is a cross-sectional view.

Explanation of symbols

10, 20 ... Piezoelectric oscillators 11, 21 ... Piezoelectric vibrators 12, 22 ... Lead frame 13 ... Circuit module 14 ... Sealing material 111, 211 ... First electrode portions 112, 112A, 112B, 212 ... ... Connection terminal 113 ... Leading part 114 ... Piezoelectric vibrating piece 115 ... Conductive adhesive 116, 216 ... Package 121, 121A, 121B, 221, 221A, 221B ... First lead part 122 ... Second electrode part 123 ...... Second lead portion 124, 224 ...... First base material 125 ...... Second base material 40 ...... Package 41 ...... Piezoelectric vibrating piece 42 ...... Semiconductor component 43 ...... Lid 44 ... Electrode 45 ...... Circuit board 46 ... Piezoelectric vibrator 47 ... Module board 48 ... Circuit element 49 ... Sealing material

Claims (10)

A piezoelectric vibrator including a piezoelectric vibrating piece and a package for housing the piezoelectric vibrating piece,
On the side, at least four connection terminals are formed,
The piezoelectric vibrator according to claim 1, wherein the bottom surface includes a pair of electrode portions and a lead portion that connects the pair of connection terminals of the connection terminals and the pair of electrode portions. A piezoelectric vibrator containing a piezoelectric vibrating piece and having a pair of first electrode portions provided on the bottom surface;
A circuit module in which circuit elements are mounted and arranged in the same plane as the piezoelectric vibrator;
While electrically connecting the piezoelectric vibrator and the circuit module, a lead frame provided with a pair of second electrode portions,
A piezoelectric oscillator comprising: The side surface of the piezoelectric vibrator includes four connection terminals connected to the circuit module via the lead frame,
3. The piezoelectric oscillator according to claim 2, wherein a bottom surface of the piezoelectric vibrator includes a lead portion that connects a pair of connection terminals of the four connection terminals and the pair of first electrode portions, respectively. .   4. The piezoelectric device according to claim 3, wherein the lead frame includes a first lead portion connected to a connection terminal of the piezoelectric vibrator and a second lead portion connected to the second electrode portion. Oscillator.   The piezoelectric oscillator according to claim 4, wherein the piezoelectric vibrator and the circuit module are covered with a sealing material.   The first lead portion and the second lead portion are covered with the sealing material, and the pair of first electrode portions and the pair of second electrode portions are not covered with the sealing material. The piezoelectric oscillator according to claim 5. Preparing a piezoelectric vibrator having a pair of first electrode parts;
Preparing a circuit module on which circuit elements are mounted;
Preparing a lead frame in which a pair of second electrode portions are formed;
Arranging and electrically connecting the circuit module in the same plane as the piezoelectric vibrator via the lead frame;
Covering the piezoelectric vibrator and the circuit module with a sealing material so that the pair of first electrode portions and the pair of second electrode portions are exposed on the surface;
A method for manufacturing a piezoelectric oscillator, comprising: The step of preparing the piezoelectric vibrator includes
Forming four connection terminals connected to the circuit module on a side surface;
Forming the pair of first electrode portions and the pair of lead portions connected to the first electrode portion on the bottom surface;
The manufacturing method of the piezoelectric oscillator of Claim 7 characterized by the above-mentioned. The step of preparing the lead frame includes
Forming a first lead portion connected to the connection terminal;
Forming a second lead portion connected to the second electrode portion;
The manufacturing method of the piezoelectric oscillator of Claim 7 characterized by the above-mentioned. A plurality of the first lead parts are formed on the first base material, and a plurality of the second electrode parts and the second lead parts are formed on the second base material,
The first base material is separated from the first electrode portion and the first lead portion before being covered with the sealing material,
The method for manufacturing a piezoelectric oscillator according to claim 9, wherein the second base material is separated from the second electrode portion after being covered with the sealing material.