JPS5827992U - Printed wiring board support structure - Google Patents

Printed wiring board support structure

Info

Publication number
JPS5827992U
JPS5827992U JP12191581U JP12191581U JPS5827992U JP S5827992 U JPS5827992 U JP S5827992U JP 12191581 U JP12191581 U JP 12191581U JP 12191581 U JP12191581 U JP 12191581U JP S5827992 U JPS5827992 U JP S5827992U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
support structure
board support
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12191581U
Other languages
Japanese (ja)
Inventor
之久 後藤
Original Assignee
アイホン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アイホン株式会社 filed Critical アイホン株式会社
Priority to JP12191581U priority Critical patent/JPS5827992U/en
Publication of JPS5827992U publication Critical patent/JPS5827992U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は印刷配線板の配設例の説明図、第２図は従来の
印刷配線板の支持構造の説明図、第３図〜第５図は本考
案の支持構造の説明図である。 １、　３．　９．　１θ・・・・・・印刷配線板、２，
１２・・・・・・筐体、２ａ、１２ａ・・・・・・取付
面、４，１３ａ。 １３ｂ・・・・・・スペーサ、５．６・・・・・・ガイ
ド。FIG. 1 is an explanatory diagram of an example of arrangement of a printed wiring board, FIG. 2 is an explanatory diagram of a conventional support structure for a printed wiring board, and FIGS. 3 to 5 are explanatory diagrams of a support structure of the present invention. 1, 3. 9. 1θ...Printed wiring board, 2,
12... Housing, 2a, 12a... Mounting surface, 4, 13a. 13b...Spacer, 5.6...Guide.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 筐体における取付面から離隔するように印刷配線板を支
持するスペーサと、前記筐体内において前記印刷配線板
上に他の印刷配線板を支持するガイドとが一体成形せら
れていることを特徴とする印刷配線板の支持構造。A spacer that supports a printed wiring board so as to be spaced from a mounting surface of the casing, and a guide that supports another printed wiring board on the printed wiring board within the casing are integrally molded. Support structure for printed wiring boards.
JP12191581U 1981-08-18 1981-08-18 Printed wiring board support structure Pending JPS5827992U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12191581U JPS5827992U (en) 1981-08-18 1981-08-18 Printed wiring board support structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12191581U JPS5827992U (en) 1981-08-18 1981-08-18 Printed wiring board support structure

Publications (1)

Publication Number Publication Date
JPS5827992U true JPS5827992U (en) 1983-02-23

Family

ID=29915852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12191581U Pending JPS5827992U (en) 1981-08-18 1981-08-18 Printed wiring board support structure

Country Status (1)

Country Link
JP (1) JPS5827992U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090893U (en) * 1983-11-28 1985-06-21 東芝エンジニアリング株式会社 Storage case for plate-shaped objects
JPS62193781U (en) * 1986-05-30 1987-12-09
JPS6370990U (en) * 1986-10-28 1988-05-12
JPS63102692U (en) * 1986-12-25 1988-07-04
JP2010056377A (en) * 2008-08-29 2010-03-11 Seiko Instruments Inc Electronic component package, and method of manufacturing electronic component package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090893U (en) * 1983-11-28 1985-06-21 東芝エンジニアリング株式会社 Storage case for plate-shaped objects
JPS62193781U (en) * 1986-05-30 1987-12-09
JPS6370990U (en) * 1986-10-28 1988-05-12
JPS63102692U (en) * 1986-12-25 1988-07-04
JP2010056377A (en) * 2008-08-29 2010-03-11 Seiko Instruments Inc Electronic component package, and method of manufacturing electronic component package

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