JP2010042804A5 - - Google Patents
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- Publication number
- JP2010042804A5 JP2010042804A5 JP2009177153A JP2009177153A JP2010042804A5 JP 2010042804 A5 JP2010042804 A5 JP 2010042804A5 JP 2009177153 A JP2009177153 A JP 2009177153A JP 2009177153 A JP2009177153 A JP 2009177153A JP 2010042804 A5 JP2010042804 A5 JP 2010042804A5
- Authority
- JP
- Japan
- Prior art keywords
- containment vessel
- cover
- housing
- cavity
- ceramic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910010293 ceramic material Inorganic materials 0.000 claims 6
- 229910052580 B4C Inorganic materials 0.000 claims 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 230000000295 complement effect Effects 0.000 claims 1
- 230000009970 fire resistant effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/183,260 US7875812B2 (en) | 2008-07-31 | 2008-07-31 | Method and apparatus for electrical component physical protection |
| US12/183,260 | 2008-07-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010042804A JP2010042804A (ja) | 2010-02-25 |
| JP2010042804A5 true JP2010042804A5 (enExample) | 2012-09-13 |
| JP5612838B2 JP5612838B2 (ja) | 2014-10-22 |
Family
ID=41346161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009177153A Expired - Fee Related JP5612838B2 (ja) | 2008-07-31 | 2009-07-30 | 電気部品物理的保護の方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7875812B2 (enExample) |
| EP (1) | EP2150097B1 (enExample) |
| JP (1) | JP5612838B2 (enExample) |
| CN (2) | CN101784174B (enExample) |
| BR (1) | BRPI0902601B8 (enExample) |
| CA (1) | CA2673800C (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8107207B2 (en) * | 2008-08-08 | 2012-01-31 | Surge Suppression Incorporated | Potted electrical circuit with protective insulation |
| EP2369290B1 (en) * | 2010-03-26 | 2012-05-09 | ABB Oy | Outdoor enclosure for electronic equipment and method for providing an outdoor enclosure for electronic equipment |
| US8730656B2 (en) | 2010-11-12 | 2014-05-20 | Apple Inc. | Unitary housing for electronic device |
| US8922986B2 (en) | 2011-05-31 | 2014-12-30 | Honda Motor Co., Ltd. | Data recorder |
| US9089076B2 (en) * | 2012-07-06 | 2015-07-21 | International Business Machines Corporation | Cooling system for electronics |
| US8859063B2 (en) | 2012-07-18 | 2014-10-14 | Honeywell International Inc. | Systems and methods for a protective casing |
| US8723057B2 (en) * | 2012-07-18 | 2014-05-13 | Honeywell International Inc. | Systems and methods for protecting a flight recorder |
| US9785186B2 (en) | 2012-10-16 | 2017-10-10 | Samsung Electronics Co., Ltd. | Package system with cover structure and method of operation thereof |
| EP2918150B1 (en) * | 2012-11-09 | 2020-03-11 | Samsung Electronics Co., Ltd. | Package system with cover strucure and method of operation thereof |
| CN103118509B (zh) | 2013-01-24 | 2014-01-22 | 林万才 | 提高车载数据记录装置防火性能的方法及保护装置 |
| US9449440B2 (en) * | 2014-09-17 | 2016-09-20 | Honeywell International Inc. | Wireless crash survivable memory unit |
| CN105184894A (zh) * | 2015-07-31 | 2015-12-23 | 陕西千山航空电子有限责任公司 | 抗高能量强冲击坠毁保护组件防护方法 |
| US10460966B2 (en) | 2016-06-15 | 2019-10-29 | Kla-Tencor Corporation | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
| DE102016114950B4 (de) * | 2016-08-11 | 2019-02-07 | Schiedel Gmbh | Schutzvorrichtung eines elektrischen Bauteils einer Feuerstättenvorrichtung, insbesondere für den häuslichen Bereich, und eine Feuerstättenvorrichtung, insbesondere für den häuslichen Bereich |
| US10246243B1 (en) * | 2017-10-23 | 2019-04-02 | Honeywell International Inc. | Apparatus and method for active heat removal from a heat resistant container |
| US11794888B1 (en) * | 2018-05-18 | 2023-10-24 | Taylor & Lego Holdings, Llc. | Unmanned aerial vehicle |
| US11118705B2 (en) | 2018-08-07 | 2021-09-14 | General Electric Company | Quick connect firewall seal for firewall |
| CN111128924A (zh) * | 2019-12-20 | 2020-05-08 | 天津智安微电子技术有限公司 | 一种集成电路封装结构 |
| CN115843159A (zh) * | 2022-12-16 | 2023-03-24 | 江苏泽润新能科技股份有限公司 | 一种组件级快速关断系统接收装置 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2946476A1 (de) * | 1979-11-17 | 1981-05-27 | Consortium für elektrochemische Industrie GmbH, 8000 München | Waermedaemmformkoerper und verfahren zu seiner herstellung |
| DE3112906A1 (de) * | 1981-03-31 | 1982-10-07 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist |
| AU560871B2 (en) | 1981-08-14 | 1987-04-16 | Otis H. Hastings | Insulating apparatus and composite laminates employed therein |
| AU551038B2 (en) * | 1983-09-07 | 1986-04-17 | Sundstrand Data Control, Inc. | Heat shielded flight data memory unit |
| US4694119A (en) * | 1983-09-07 | 1987-09-15 | Sundstrand Data Control, Inc. | Heat shielded memory unit for an aircraft flight data recorder |
| US5001299A (en) * | 1989-04-17 | 1991-03-19 | Explosive Fabricators, Inc. | Explosively formed electronic packages |
| JPH0663804B2 (ja) * | 1989-09-13 | 1994-08-22 | 日本タイラン株式会社 | 質量流量センサ |
| US4944401A (en) * | 1989-09-28 | 1990-07-31 | Sundstrand Data Control, Inc. | Crash survivable enclosure for flight recorder |
| US5115912A (en) * | 1990-03-27 | 1992-05-26 | R. H. Murphy Co., Inc. | Electrical component carrier with shock absorbing means |
| US5123538A (en) * | 1991-04-26 | 1992-06-23 | Sundstrand Corporation | Crash protection enclosure for solid state memory devices |
| JP2673392B2 (ja) * | 1991-05-24 | 1997-11-05 | 松下電器産業株式会社 | 電子機器筐体 |
| JP2599374Y2 (ja) * | 1992-04-09 | 1999-09-06 | 住友電装株式会社 | 電装品収納用ボックス |
| US5365108A (en) * | 1992-11-19 | 1994-11-15 | Sundstrand Corporation | Metal matrix composite semiconductor power switch assembly |
| EP0722624B1 (en) * | 1993-10-07 | 1998-09-02 | N.V. Raychem S.A. | Environmental protection |
| CN1167458A (zh) * | 1994-10-21 | 1997-12-10 | 旭化成工业株式会社 | 合成树脂的模塑法 |
| JPH09123876A (ja) * | 1995-10-30 | 1997-05-13 | Hitachi Ltd | 乗用車の挙動及び運転動作の記録装置 |
| JP2001217331A (ja) * | 2000-01-31 | 2001-08-10 | Kyocera Corp | 半導体素子収納用パッケージ |
| DE10042636C1 (de) * | 2000-08-30 | 2002-04-11 | Epcos Ag | Elektrisches Bauelement und Verfahren zu dessen Herstellung |
| TW497207B (en) * | 2001-04-10 | 2002-08-01 | United Microelectronics Corp | Guard ring structure |
| EP1275747B1 (de) * | 2001-07-11 | 2011-02-23 | Alstom Technology Ltd | Verfahren zur Beschichtung eines Hochtemperatur-beständigen Bauteils mit einer thermischen Schutzschicht und Hochtemperatur-beständiges Bauteil |
| US8029737B2 (en) * | 2002-02-05 | 2011-10-04 | Ibiden Co., Ltd. | Honeycomb filter for exhaust gas decontamination, adhesive, coating material and process for producing honeycomb filter for exhaust gas decontamination |
| DE10223035A1 (de) * | 2002-05-22 | 2003-12-04 | Infineon Technologies Ag | Elektronisches Bauteil mit Hohlraumgehäuse, insbesondere Hochfrequenz-Leistungsmodul |
| US20060272838A1 (en) * | 2003-09-01 | 2006-12-07 | Hans-Joachim Sauerzweig | Protection device for electronic components |
| US7023695B2 (en) * | 2003-09-08 | 2006-04-04 | Honeywell International, Inc. | Air-gap insulator for short-term exposure to a high temperature environment |
| US7318170B2 (en) * | 2004-07-09 | 2008-01-08 | Spyder Navigations, Llc | Protection of non-volatile memory component against data corruption due to physical shock |
| US20070236859A1 (en) * | 2006-04-10 | 2007-10-11 | Borland William J | Organic encapsulant compositions for protection of electronic components |
| US20070291440A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components |
| US8173906B2 (en) * | 2007-02-07 | 2012-05-08 | Raytheon Company | Environmental protection coating system and method |
-
2008
- 2008-07-31 US US12/183,260 patent/US7875812B2/en active Active
-
2009
- 2009-07-23 CA CA2673800A patent/CA2673800C/en active Active
- 2009-07-23 EP EP09166171A patent/EP2150097B1/en active Active
- 2009-07-27 BR BRPI0902601A patent/BRPI0902601B8/pt not_active IP Right Cessation
- 2009-07-30 CN CN200910165829.6A patent/CN101784174B/zh active Active
- 2009-07-30 CN CN201110429906.1A patent/CN102523711B/zh active Active
- 2009-07-30 JP JP2009177153A patent/JP5612838B2/ja not_active Expired - Fee Related
-
2010
- 2010-12-13 US US12/966,746 patent/US8474125B2/en active Active
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