CN102523711B - 用于电气部件物理防护的方法和装置 - Google Patents
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Abstract
本发明涉及用于电气部件物理防护的方法和装置,具体而言,提供了一种用于保护热敏性部件免受高温、震动和湿气影响的方法和装置。罩包括环绕构造成在其中容纳热敏性部件的内腔的外壳,以及盖,该盖构造成配合地接合该外壳,以便该内腔对该罩的外部环境密封,其中外壳和盖中的至少一个由陶瓷材料形成。
Description
本申请是于2009年7月30日提交的专利申请(中国国家申请号为200910165829.6,发明名称为“用于电气部件物理防护的方法和装置”)的分案申请。
技术领域
本发明一般地涉及用于电气部件的防护罩,且特别涉及用于保护数据记录设备免受交通工具撞毁影响的方法和装置。
背景技术
用于飞行数据记录器(FDR)的至少某些已知防撞毁的记录器(CPM)装甲利用了金属复合物,例如但不限于钢,钛和合金,以便在诸如交通工具撞毁的渗漏和撞毁事件时提供对隔绝和记忆组件的保护。然而,金属通常相对较重且由于其相对高的热传导性,因而在起火时仅能提供有限的保护。除此之外,金属复合物具有的热膨胀系数明显不同于在固态CPM中典型找到的隔绝材料的热膨胀系数。在火灾中,金属装甲罩和隔绝材料之间具有显著不同的热膨胀系数会导致罩和隔绝材料之间的间隙。这样的间隙会影响隔绝材料保护CPM装甲内存储器部件的能力。
发明内容
在一个实施例中,一种用来保护热敏性部件免受高温、机械冲击和湿气影响的罩包括环绕构造成在其中容纳热敏性部件的内腔的外壳,构造成配合地结合该外壳以便将该内腔对罩的外部环境密封的盖,其中外壳和盖中的至少一个由陶瓷材料形成。
在另一个实施例中,一种部件撞毁保护方法包括形成第一陶瓷材料的壳体,该壳体包括构造成容纳部件的空腔,形成第二陶瓷材料的盖,该盖构造成配合地接合该壳体,以便空腔被陶瓷材料密封地环绕,将部件定位在空腔内,以及接合壳体和盖,使得壳体和盖的配合接合将空腔对该壳体和盖的外部环境密封隔离。
在又一实施例中,一种用于交通工具的撞毁可生存罩包括形成空腔的陶瓷壳体,其中该壳体包括至少部分地限定空腔的边界的密封边缘。该罩还包括陶瓷盖,该陶瓷盖包括密封边缘的互补边缘,在组装之后,该壳体和盖形成环绕空腔的防火罩。
附图说明
图1-2示出了本文所述的方法和装置的示范性实施例。
图1是根据本发明的一个示范性实施例的撞毁可生存罩的透视图;以及
图2是根据本发明的一个实施例的部件撞毁保护方法的示范性方法的流程图。
部件列表
100 罩
102 外壳
104 内腔
106 密封边缘
108 盖
110 边缘
112 隔热层
114 内表面
116 电插塞
118 电力端子
120 数据端子
121 部件
122,124,126 层
200 方法
202 形成壳体
204 形成盖
206 放置部件
208 连接壳体和盖
具体实施方式
以下具体实施方式通过例示而非限制的方式说明了本发明的实施例。预期本发明对用于保护部件免受工业、商业和住宅应用中的严苛环境影响的设备和方法具有普遍的应用。
如本文所用,以单数形式叙述和前接用词“一”或“一个”的构件或步骤应被理解为并不排除复数构件或步骤,除非明确叙述了这种排除。此外,对本发明的“一个实施例”的引用并不意在被解释为排除也结合了所述特征的其它实施例的存在。
图1是根据本发明的一个示范性实施例的撞毁可生存罩100的透视图。在该示范性实施例中,罩100构造成携带在交通工具上并保护部件,该部件例如但不限于如用于飞行数据记录器的固态存储器。预期罩100将被用在如飞行器或航天器的交通工具上,在撞毁期间,罩100会面临火灾和冲击的极端情况。罩100包括形成空腔104的陶瓷壳体102。壳体102包括至少部分地限定空腔104的边界的密封边缘106。罩100还包括陶瓷盖108,该陶瓷盖包括与密封边缘106互补的边缘110。在组装之后,壳体102和盖108形成环绕空腔104的防火罩。
罩100还包括环绕空腔104且邻近壳体102的内表面114以及盖108的隔热层112。在该示范性实施例中,隔热层112的热膨胀系数被选择成约等于壳体102和盖108中的至少一个的热膨胀系数。典型地,壳体102和盖108由具有大致相等的热膨胀系数的相似材料形成。在一个备选实施例中,壳体102和盖108由具有不同热膨胀系数的材料形成。壳体102、盖108和隔热层112之间的不同热膨胀会导致壳体102、盖108和隔热层112之间的间隙。在一个备选实施例中,隔热层112与壳体102和/或盖108隔开,以便壳体102和/或盖108以及隔热层112之间的间隙是所期望的。
在该示范性实施例中,壳体102和/或盖108由碳化硼基体形成。碳化硼陶瓷可铸造以形成壳体102和/或盖108,并可在形成过程中包括各种数量的粘合剂。此外,碳化硼可与增塑剂混和以便于降低脆性或增加形成并固化的壳体102和/或盖108的断裂韧度。在各种备选实施例中,碳化硼陶瓷被熔纺以形成陶瓷纤维,陶瓷纤维形成壳体102和/或盖108。在一个备选实施例中,陶瓷材料由多个层122,124和126形成。在各种实施例中,层122,124和126包括各种材料,它们被形成和/或粘附在一起形成可加工的薄片,或可形成可嵌套的形状,以便一层可以套进另一层中,然后再套入另一层中,以此类推。各种嵌套形状之后可被接合或联接在一起以形成壳体102和/或盖108。例如,多个层122,124,126中的一层可包含金属,另一层可包含具有第一成分的第一陶瓷材料,而又一层则可包含具有第二成分的第二陶瓷材料。层122,124,126的顺序基于罩100的预期使用而选择,例如将在其中部署罩100的交通工具的类型。层122,124,126的顺序还可基于所需的防渗透等级,或期望的火焰温度和暴露持续时间来选择。
罩100还包括电插塞116,其通过罩100进入空腔104并穿过壳体102和/或盖108,以便维持空腔104和壳体102和盖108外部的环境之间的密封。电插塞116包括构造成分别传导电力和数据信号到定位于空腔104内的部件121的电力端子118和数据端子120。在该示范性实施例中,部件121为数据记录器的存储器。在各种其他实施例中,部件121可包括另一种电气部件,如处理器或对热、震动和/或湿气敏感的物品。
在各种实施例中,陶瓷罩100的厚度大于等效金属罩的厚度,然而由于陶瓷材料的重量比金属的重量约轻70%,使用陶瓷材料可以实现总重量降低。此外,陶瓷材料表现出比金属更低的热传导性,从而提供了相对金属形成的罩附加的绝热优势。
图2是根据本发明的一个实施例的部件撞毁保护方法的示范性方法200的流程图。在该示范性实施例中,方法200包括在步骤202形成第一陶瓷材料的壳体,其中该壳体包括构造成容纳部件的空腔;以及在步骤204形成第二陶瓷材料的盖,其中该盖构造成配合地接合该壳体,以便空腔被陶瓷材料密封环绕。方法200还包括在步骤206将部件放置在空腔内,以及在步骤208连接壳体和盖,使得壳体和盖的配合接合将空腔与该壳体和盖的外部环境密封隔离。
如本文所用,术语“处理器”指中央处理单元,微处理器,微控制器,精简指令集电路(RISC),专用集成电路(ASIC),逻辑电路,和能够执行本文所述功能的任何其它电路或处理器。
如本文所用,术语“存储器”可包括RAM存储器,ROM存储器,EPOM存储器,EEPROM存储器,以及非易失RAM存储器(NVRAM)。上述的存储器类型仅为示例性的,因此并不限制为可在罩100内使用的存储器类型。
用于部件撞毁保护的方法和装置的上述实施例提供了一种经济而可靠的手段来保护热敏性部件免受高温、震动和湿气的影响。更具体地,本文所述的方法和装置便于降低例如撞毁保护部件的罩的重量。此外,上述方法和装置便于在撞毁期间以及撞毁之后将部件与周围环境隔离,其中机械冲击、火灾和/或湿气会损坏部件。因此,本文所述的方法和装置便于以经济而可靠的方式保护热敏性部件免受高温、震动和湿气的影响。
尽管已经关于各种特定实施例对本公开进行了描述,但将会认识到,本公开可以以在权利要求的精神和范围之内的更改来实施。
Claims (9)
1.一种撞毁保护部件的方法,所述方法包括:
形成第一陶瓷材料的壳体,所述壳体包括构造成容纳部件的空腔;
形成第二陶瓷材料的盖,所述盖构造成配合地接合所述壳体,以便所述空腔被陶瓷材料密封地环绕;
将所述部件定位在所述空腔内;
用具有大约等于所述第一陶瓷材料和所述第二陶瓷材料的至少其中一种的膨胀系数的热膨胀系数的隔热层垫衬所述空腔;以及
接合所述壳体和所述盖,使得所述壳体和所述盖的配合接合将所述空腔对所述壳体和所述盖的外部环境密封隔离。
2.根据权利要求1所述的方法,其特征在于,形成第二陶瓷材料的盖包括形成其中所述第二陶瓷材料不同于所述第一陶瓷材料的第二陶瓷材料的盖。
3.根据权利要求1所述的方法,其特征在于,所述方法还包括:
形成通过所述壳体和所述盖的至少其中一个的孔;以及
将电插塞联接到所述壳体和所述盖的至少其中一个上并覆盖所述孔,使得所述空腔和所述壳体和所述罩外部的环境之间的密封被维持。
4.根据权利要求1所述的方法,其特征在于,所述方法还包括通过所述电插塞将电力和数据信号中的至少一个传导至所述部件。
5.根据权利要求1所述的方法,其特征在于,所述形成包括形成包含碳化硼基体的陶瓷材料的所述壳体和所述盖的至少其中一个。
6.根据权利要求1所述的方法,其特征在于,所述形成包括形成包含碳化硼的陶瓷材料的所述壳体和所述盖的至少其中一个,所述碳化硼包含由纤维形成的陶瓷。
7.根据权利要求1所述的方法,其特征在于,所述形成包括形成陶瓷材料铸件的所述壳体。
8.根据权利要求1所述的方法,其特征在于,所述形成包括形成包含多个层的陶瓷材料的所述壳体和所述盖的至少其中一个。
9.根据权利要求1所述的方法,其特征在于,所述形成包括形成包含至少一个金属层的陶瓷材料的所述壳体和所述盖的至少其中一个。
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US12/183,260 US7875812B2 (en) | 2008-07-31 | 2008-07-31 | Method and apparatus for electrical component physical protection |
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EP (1) | EP2150097B1 (zh) |
JP (1) | JP5612838B2 (zh) |
CN (2) | CN101784174B (zh) |
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CN102523711A (zh) | 2012-06-27 |
CA2673800A1 (en) | 2010-01-31 |
JP5612838B2 (ja) | 2014-10-22 |
US8474125B2 (en) | 2013-07-02 |
CN101784174B (zh) | 2014-04-23 |
JP2010042804A (ja) | 2010-02-25 |
EP2150097A3 (en) | 2010-09-15 |
US20110079426A1 (en) | 2011-04-07 |
EP2150097A2 (en) | 2010-02-03 |
BRPI0902601B8 (pt) | 2019-09-03 |
US7875812B2 (en) | 2011-01-25 |
EP2150097B1 (en) | 2012-09-12 |
CA2673800C (en) | 2016-05-03 |
US20100025101A1 (en) | 2010-02-04 |
BRPI0902601B1 (pt) | 2019-08-20 |
CN101784174A (zh) | 2010-07-21 |
BRPI0902601A2 (pt) | 2010-05-25 |
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