JP2010034429A5 - - Google Patents

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Publication number
JP2010034429A5
JP2010034429A5 JP2008197159A JP2008197159A JP2010034429A5 JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5 JP 2008197159 A JP2008197159 A JP 2008197159A JP 2008197159 A JP2008197159 A JP 2008197159A JP 2010034429 A5 JP2010034429 A5 JP 2010034429A5
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JP
Japan
Prior art keywords
polishing
roller
wafer
peripheral portion
rotating
Prior art date
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Granted
Application number
JP2008197159A
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English (en)
Japanese (ja)
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JP5386874B2 (ja
JP2010034429A (ja
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Priority to JP2008197159A priority Critical patent/JP5386874B2/ja
Priority claimed from JP2008197159A external-priority patent/JP5386874B2/ja
Publication of JP2010034429A publication Critical patent/JP2010034429A/ja
Publication of JP2010034429A5 publication Critical patent/JP2010034429A5/ja
Application granted granted Critical
Publication of JP5386874B2 publication Critical patent/JP5386874B2/ja
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JP2008197159A 2008-07-31 2008-07-31 半導体ウェーハ周辺部の研磨装置及びその方法 Active JP5386874B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008197159A JP5386874B2 (ja) 2008-07-31 2008-07-31 半導体ウェーハ周辺部の研磨装置及びその方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008197159A JP5386874B2 (ja) 2008-07-31 2008-07-31 半導体ウェーハ周辺部の研磨装置及びその方法

Publications (3)

Publication Number Publication Date
JP2010034429A JP2010034429A (ja) 2010-02-12
JP2010034429A5 true JP2010034429A5 (enrdf_load_stackoverflow) 2011-09-15
JP5386874B2 JP5386874B2 (ja) 2014-01-15

Family

ID=41738534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008197159A Active JP5386874B2 (ja) 2008-07-31 2008-07-31 半導体ウェーハ周辺部の研磨装置及びその方法

Country Status (1)

Country Link
JP (1) JP5386874B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102282647A (zh) * 2008-11-19 2011-12-14 Memc电子材料有限公司 剥除半导体晶片边缘的方法和系统
KR101089480B1 (ko) * 2010-06-01 2011-12-07 주식회사 엘지실트론 웨이퍼 연마장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04129656A (ja) * 1990-09-19 1992-04-30 Kawasaki Steel Corp 半導体ウエハの面取加工装置
JP3256808B2 (ja) * 1991-04-30 2002-02-18 東芝セラミックス株式会社 半導体ウエーハの周縁ポリシング装置
JP2542445Y2 (ja) * 1992-07-14 1997-07-30 信越半導体株式会社 バフ溝加工装置
JPH11297665A (ja) * 1998-04-06 1999-10-29 Takahiro Oishi ウエハ端面処理装置
JPH11300587A (ja) * 1998-04-15 1999-11-02 Mitsubishi Materials Corp 半導体ウエハー研磨装置
JP4743951B2 (ja) * 2000-11-13 2011-08-10 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウエハのノッチ部分の研磨装置及び研磨加工方法
JP2007248812A (ja) * 2006-03-16 2007-09-27 Bridgestone Corp 導電性ローラ
JP2008023603A (ja) * 2006-07-18 2008-02-07 Nippon Seimitsu Denshi Co Ltd ２層構造のリテーナリング

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