JP2010033761A - Transfer device, transfer method, transfer body, and method of manufacturing organic electroluminescent display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a transfer device with simplification of a structure and improvement of a product yield aimed at; a transfer method; a transfer body; and a method of manufacturing an organic electroluminescent display. <P>SOLUTION: The transfer device includes a laser oscillation means, and a first intensity distribution control means controlling an intensity distribution of laser light irradiated from the laser oscillation means. The first intensity distribution control means is equipped with a first transmitting part for transmitting the laser light irradiating a center part of the irradiation range against the transfer body with a transfer film, and a second transmitting part for transmitting the laser light irradiating a peripheral edge part of the irradiation range, with a transmittance of the second transmitting part to be relatively higher than that of the first transmitting part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a transfer device, a transfer method, a transfer body, and a method for manufacturing an organic electroluminescent display.

2. Description of the Related Art Organic EL (Electroluminescence) elements using organic electroluminescence are attracting attention as light emitting elements that can emit light with high luminance by low-voltage direct current drive.
An organic electroluminescent display using such an organic EL element (hereinafter referred to as an organic EL display) is a light emitting layer made of an organic light emitting material that emits light in R (red), G (green), and B (blue) colors. Is manufactured by patterning each light emitting element.

  As one of the pattern forming methods, a transfer method using thermal energy, that is, a thermal transfer method has been proposed. A technique using a laser light source as a thermal energy source in the thermal transfer method is known, and a laser is used to suppress fluctuations in the transfer width due to fluctuations in the laser light intensity and to make the temperature distribution in the irradiation range uniform. A technique for controlling the light intensity distribution has been proposed (see Patent Document 1).

  According to the technique disclosed in Patent Document 1, it is possible to improve the dimensional accuracy of the transfer and to uniformize the temperature distribution of the transfer film that is the object of irradiation. However, no consideration is given to cutting at the peripheral portion (edge portion) of the irradiation range, which may cause transfer failure or damage to the transfer film.

For this reason, there has been proposed a technique for suppressing damage to the transfer film by irradiating the peripheral portion (edge portion) of the irradiation range with high-intensity laser light (see Patent Document 2).
However, according to the technique disclosed in Patent Document 2, it is necessary to irradiate a peripheral portion (edge portion) of an irradiation range with a high intensity laser beam using a mask having an optical lens. There is a risk of increasing the cost and cost.
In addition, no consideration has been given to the mixing of gas when the base material provided with the transfer film is bonded to the glass substrate, and the countermeasure when a transfer failure occurs. For this reason, problems remain in improving the product yield.
JP 2003-257541 A JP 2006-93077 A

  The present invention provides a transfer device, a transfer method, a transfer body, and an organic electroluminescent display manufacturing method capable of simplifying the configuration and improving the product yield.

  According to one aspect of the present invention, the first intensity distribution control means comprises: laser oscillation means; and first intensity distribution control means for controlling the intensity distribution of laser light emitted from the laser oscillation means. The first transmission part that transmits the laser beam that irradiates the central part of the irradiation range with respect to the transfer body having the transfer film, and the second transmission part that transmits the laser beam that irradiates the peripheral part of the irradiation range The transfer device is characterized in that the transmittance of the second transmission part is relatively higher than the transmittance of the first transmission part.

  According to another aspect of the invention, there is provided a second intensity distribution comprising: laser oscillation means; and second intensity distribution control means for controlling the intensity distribution of laser light emitted from the laser oscillation means. The distribution control means has an opening through which the laser beam is transmitted, and is relative to the intensity of the laser beam at the central portion of the opening due to diffraction and interference of the laser beam at the peripheral portion of the opening. A transfer device characterized in that a strong laser beam is formed.

  According to another aspect of the present invention, a transfer member having a transfer film is placed facing the object to be processed, and the transfer member is irradiated with laser light to place the transfer film on the object to be processed. A transfer method for transferring, wherein the intensity of the laser beam at the peripheral portion of the irradiation range with respect to the transfer body is higher than the intensity of the laser beam at the central portion of the irradiation range using the transfer device according to any one of the above. There is provided a transfer method characterized by irradiating with laser light.

  According to another aspect of the present invention, the base material, the transfer film provided on one main surface of the base material, and the ventilation means provided outside the laser light irradiation range of the base material And a transfer body characterized by comprising:

  According to another aspect of the present invention, the transfer body is placed facing the object to be processed, and is provided on the substrate of the transfer body when the transfer body is brought into close contact with the object to be processed. The transferred body is discharged so that the mixed gas is discharged through the ventilation means, and the intensity of the laser beam at the peripheral portion of the irradiation range with respect to the transfer body is higher than the intensity of the laser beam at the central portion of the irradiation range. A method for producing an organic electroluminescence display is provided, which is characterized by irradiating the laser beam with the laser beam.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the transfer apparatus which can aim at simplification of a structure and improvement of a product yield, the transfer method, a transfer body, and an organic electroluminescent display is provided.

Hereinafter, embodiments of the present invention will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic view for illustrating the transfer device according to the first embodiment.
As shown in FIG. 1, the transfer apparatus 1 is provided with a laser oscillation means 2, an imaging optical means 3, an intensity distribution control means 4, a moving means 5, and a laser control means 6.

The laser oscillation means 2 can oscillate semiconductor laser light, YAG laser light, or the like, for example. However, it is not necessarily limited to these and can be changed as appropriate.
The imaging optical means 3 can be provided with a condensing lens (not shown) for condensing the laser light L emitted from the laser oscillation means 2, a reflecting mirror (not shown) for changing the optical path, and the like. The pattern shape on the mask (for example, on the intensity distribution control unit 4) can be imaged on the laser irradiation surface (for example, on the transfer body 10) through the imaging optical unit 3. Yes.

  The moving means 5 can be, for example, an XY table, and can move the workpiece 100 (for example, an acceptor substrate) placed on the upper surface within a horizontal plane. In addition, a holding unit (not shown) is provided on the surface on which the workpiece 100 is placed so that the placed workpiece 100 can be held. As a holding means (not shown), for example, an electrostatic chuck can be exemplified. In addition, a means for holding the peripheral edge can be provided so that the mutual positions of the transfer body 10 and the object to be processed 100 do not deviate from each other.

  In addition, although the moving means 5 which moves the to-be-processed object 100 side was illustrated as a moving means to change the irradiation position to the to-be-processed object 100, the emission side (for example, the laser oscillation means 2, imaging optics, etc.) of the laser beam L was illustrated. The means 3 and the intensity distribution control means 4) may be moved.

The laser control means 6 drives the laser oscillation means 2 on / off (pulse drive) in synchronization with the movement of the moving means 5. Then, the laser beam L can be irradiated to an arbitrary position of the workpiece 100 at a desired timing.
In the case of irradiating laser light through a mask or the like (for example, intensity distribution control means 4), a portion that does not need to be irradiated can be shielded by the mask or the like, and thus it is not always necessary to perform pulse driving. For example, continuous irradiation can be performed on the mask (on the intensity distribution control means 4). However, energy loss can be suppressed by pulse driving.

The intensity distribution control unit 4 controls the intensity distribution of the laser light L emitted from the laser oscillation unit 2.
Here, before illustrating the intensity distribution control of the laser light L, the relationship between the intensity distribution of the laser light L and the transfer will be described.
FIG. 2 is a schematic diagram for illustrating the relationship between the intensity distribution of laser light and transfer. 2A is a schematic cross-sectional view for illustrating the state of transfer, FIG. 2B is a schematic graph for illustrating the intensity distribution of laser light, and FIG. 2C is a transfer defect. It is a schematic cross section for illustrating the situation in the case of.

As shown in FIG. 2A, when a light emitting layer made of an organic light emitting material is patterned for each light emitting element, the light emitting layer is opposed to an object 100 (for example, an acceptor substrate) on which an anode electrode 101 is formed. A transfer body 10 (for example, a donor substrate) is placed and adhered.
An anode electrode 101 and a partition wall 103 are provided on the main surface of the glass substrate 102 of the workpiece 100. The partition wall 103 has a lattice shape and surrounds each anode electrode 101 to form a pixel region and prevent an electrical short circuit between the pixels.

  A transfer film 12 is provided on the main surface of the substrate 11 of the transfer body 10. The transfer film 12 includes at least a light emitting layer made of an organic light emitting material. The base material 11 is provided with a light-heat conversion layer (not shown) for converting the light energy of the laser light L into heat energy. In addition to the light emitting layer, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and the like can also be included. In addition, a cathode electrode that is paired with the anode electrode 101 can be provided together with a light emitting layer or the like.

  When the transfer film 12 is transferred by a thermal transfer method (Laser Induced Thermal Imaging) using the laser beam L, the laser beam L is irradiated to a predetermined region (irradiation range) of the transfer body 10. The light energy of the irradiated laser beam L is absorbed by a light-to-heat conversion layer (not shown) provided on the substrate 11 and converted into heat energy. Due to this thermal energy, the transfer film 12 is detached from the substrate 11 and transferred onto the anode electrode 101 defined by the partition wall 103.

  Here, the energy required to break the bond of the transfer film 12 is higher than the energy required to separate the transfer film 12 from the substrate 11. However, in general, the intensity distribution of the laser light L tends to be weak in the vicinity of the end portion (periphery portion of the irradiation range) as shown in FIG. For this reason, the energy at the portion where the bond of the transfer film 12 is cut is lowered, and a cutting failure (transfer failure) may occur as shown in part A of FIG.

  In this case, if the energy of the laser beam L itself is increased, cutting defects (transfer defects) can be suppressed. However, if the energy of the laser beam L is too high, the transfer film 12 may be damaged or the quality of the transferred transfer film 12 may be deteriorated.

  Therefore, if the intensity of the laser beam is increased at the portion where the bonding of the transfer film 12 is cut (peripheral portion of the irradiation range), the occurrence of cutting failure (transfer failure) while suppressing damage to the transfer film 12 and deterioration in quality. Can be suppressed.

  In this case, if the technique disclosed in Patent Document 2 is used, it is possible to increase the laser light intensity at a portion (periphery portion of the irradiation range) where the coupling of the transfer film 12 is cut. However, an optical lens for increasing the intensity of the laser beam is required, and there is a risk that the transfer apparatus becomes complicated and expensive. Further, since the pixels tend to be finer, it may be difficult to design and manufacture an optical lens to cope with this.

Next, the intensity distribution control means 4 shown in FIG. 1 will be further illustrated.
FIG. 3 is a schematic diagram for illustrating the intensity distribution control means. 3A is a schematic cross-sectional view for illustrating the intensity distribution control means, and FIG. 3B is a schematic graph for illustrating the intensity distribution of laser light.
As shown in FIG. 3A, the intensity distribution control means 4a is provided with a light shielding portion 13 that shields the laser light L, a transmission portion 14 that transmits the laser light L, and a transmission portion 15. The light shielding portion 13 can be formed of a metal material such as chromium (Cr), for example. Further, the transmissive portion 14 and the transmissive portion 15 can be formed of a semi-transparent material so that the transmission of the laser light can be controlled. As the translucent material, for example, a metal silicide-based material containing metal and silicon (for example, molybdenum silicide (MoSi), tantalum silicide (TaSi), titanium silicide (TiSi), tungsten silicide (WSi), etc.) ) And the like. However, it is not necessarily limited to the material illustrated to these, It can change suitably.

  In this case, the transmittance of the transmissive portion 15 is set to be higher than the transmittance of the transmissive portion 14. In addition, the transmission part 14 having a low transmittance is provided in the central part of the irradiation range, and the transmission part 15 having a high transmittance is provided in the peripheral part of the irradiation range. That is, the intensity distribution control means 4a includes a transmission unit 14 that transmits laser light that irradiates the central portion of the irradiation range on the transfer body 10, a transmission unit 15 that transmits laser light that irradiates the peripheral portion of the irradiation range, and , And the transmittance of the transmissive portion 15 is higher than the transmittance of the transmissive portion 14. Therefore, the intensity of the laser beam Lb that passes through the peripheral portion can be made higher than the intensity of the laser beam La that passes through the central portion of the irradiation range. As a result, as shown in FIG. 3B, it is possible to increase the laser beam intensity at the portion (periphery portion of the irradiation range) where the bonding of the transfer film 12 is cut.

  In addition, although the case where the laser beam intensity in the part (periphery part of irradiation range) which cut | disconnects the coupling | bonding of the transfer film 12 by changing the transmittance | permeability of a translucent material was illustrated, it is not necessarily limited to this. . It is sufficient that the transmittance of the laser beam in the irradiation range can be partially controlled. For example, the transmittance of the laser beam may be controlled by providing a plurality of fine slits to block a part of the transmitted laser beam, or this and the above-described semi-transparent material. You may combine with a permeation | transmission part.

FIG. 4 is a schematic diagram for illustrating intensity distribution control means according to another embodiment. 4A is a schematic cross-sectional view for illustrating the intensity distribution control means, and FIG. 4B is a schematic graph for illustrating the intensity distribution of laser light.
As shown in FIG. 4A, the intensity distribution control means 4b is provided with a light shielding portion 13 that shields the laser light L and a transmission portion 16 that transmits the laser light L. The light shielding portion 13 can be formed of a metal material such as chromium (Cr), for example.

  The transmission part 16 is an opening through which the laser light L is transmitted. Therefore, in the peripheral portion of the transmissive portion 16, there is a portion Lc in which the transmitted laser light is expanded by diffraction and the intensity is increased by causing interference. That is, the intensity distribution control means 4b is provided with an opening through which the laser beam L is transmitted. Due to diffraction and interference of the laser beam L at the peripheral portion of the opening, the intensity distribution control means 4b is determined by the intensity of the laser beam L at the center of the opening. A relatively strong laser beam Lc is formed. Therefore, as shown in FIG. 4B, it is possible to increase the laser light intensity at the portion (periphery portion of the irradiation range) where the bonding of the transfer film 12 is cut.

In this case, the laser beam intensity of the portion Lc where the intensity is increased is affected by the opening size of the transmission part 16 and the dimension from the transmission part 16 to the transfer film 12. Therefore, if the opening size of the transmission part 16 is appropriately changed, the intensity of the laser beam at the portion Lc where the intensity is increased can be controlled. Further, since the bond breakage of the transfer film 12 is performed by thermal energy, the influence of thermal diffusion in the substrate 11 is provided. Therefore, it is preferable to determine the opening size of the transmission part 16 in consideration of the material and thickness of the base material 11.
As illustrated above, according to the transfer apparatus according to the present embodiment, the laser beam intensity can be increased at the portion where the transfer film bond is cut (peripheral portion of the irradiation range), It is possible to suppress the occurrence of cutting defects (transfer defects) while suppressing deterioration in quality.

  In addition, since the configuration of the intensity distribution control means can be simplified, it is possible to prevent the transfer apparatus from becoming complicated or expensive. In addition, since the intensity distribution control means can be easily designed and manufactured, it is possible to flexibly cope with pixel miniaturization.

Next, the transfer body according to the present embodiment is illustrated.
FIG. 5 is a schematic diagram for illustrating the transfer body according to the second embodiment. 5A is a schematic plan view of the transfer body, and FIG. 5B is a schematic cross-sectional view for illustrating the case where the transfer body is placed on and closely attached to the object to be processed.

FIG. 6 is a schematic diagram for illustrating gas mixing. FIG. 6A is a schematic cross-sectional view for illustrating gas mixing, and FIG. 6B is a schematic cross-sectional view for illustrating transfer failure due to gas mixing.
First, mixing of gas illustrated in FIG. 6 will be described.
As shown in FIG. 6A, when the transfer body 10 is placed on and closely adhered to the object 100 (for example, an acceptor substrate), that is, when the transfer body 10 is attached to the object 100, the transfer body In some cases, a gas (for example, air) is caught between the object 10 and the workpiece 100 and bubbles 17 are generated in the pixel region.
In this case, when the transfer film 12 is transferred by irradiating the laser beam L in the presence of the bubbles 17, the transfer film 12 is transferred in a curved manner as shown in FIG. May occur, resulting in transfer failure.

  Therefore, the transfer body 18 according to the present embodiment can release the mixed gas by providing the ventilation means 19 outside the laser light irradiation range (outside the pixel region 20).

  As shown in FIG. 5A, the transfer body 18 is provided with a base material 11a, a transfer film 12 provided on one main surface of the base material 11a, and a ventilation means 19. The ventilation means 19 can be a hole penetrating the thickness direction of the base material 11a, for example. Further, it is sufficient that the ventilation means 19 is provided at least on the base material 11a, but if it is provided on the base material 11a and the transfer film 12, it is easy to escape the mixed gas. Further, the ventilation means 19 can be provided substantially evenly outside the laser light irradiation range (outside the pixel region 20).

  Further, as shown in FIG. 5B, it is preferable that a part of the cross section of the ventilation means 19 is provided so as to face the pixel region 20 and a part thereof faces the partition wall 103. By doing so, it becomes easy to escape the mixed gas while suppressing a decrease in strength of the transfer body 18.

  According to the present embodiment, when the transfer body 18 is attached to the object to be processed 100, gas is entrained between the transfer body 18 and the object to be processed 100, and bubbles 17 are generated in the pixel region. However, the gas can be easily released. Further, when the transfer body 18 is attached to the workpiece 100, the transfer body 18 is often pressurized with a roller or the like in order to improve the adhesion, so that the mixed gas can be released more easily. Therefore, transfer failure can be suppressed and the yield of products can be improved.

Next, the transfer method according to this embodiment is illustrated.
FIG. 7 is a flowchart for illustrating the transfer method according to the third embodiment. First, a transfer body (donor substrate) having a transfer film is placed opposite to an object to be processed (acceptor substrate) on which an anode electrode is formed (step S1).
At this time, if the transfer body provided with the above-described ventilation means is used, even if a gas is caught between the transfer body and the object to be processed, the transfer is performed when the transfer body is brought into close contact with the object to be processed. The mixed gas can be discharged through the ventilation means provided on the body substrate. Therefore, transfer defects can be suppressed.

Next, the transfer film is detached from the substrate by irradiating the irradiation range of the transfer body with the laser beam L, and transferred onto the anode electrode (step S2).
At this time, if the intensity distribution control means (transfer device) described above is used, the laser beam intensity can be increased at the portion where the transfer film bond is cut (periphery of the irradiation range), so that the transfer film is damaged. In addition, it is possible to suppress occurrence of cutting defects (transfer defects) while suppressing deterioration in quality. That is, since the laser beam can be irradiated so that the intensity of the laser beam at the peripheral part of the irradiation range with respect to the transfer body is higher than the intensity of the laser beam at the central part of the irradiation range, the transfer film is damaged or the quality is lowered It is possible to suppress the occurrence of cutting defects (transfer defects) while suppressing the above.
Thus, the transfer to the object to be processed (acceptor substrate) can be completed.

Next, the transfer body is peeled from the object to be processed (acceptor substrate) (step S3).
The inspection of the transferred portion thus transferred is generally performed after the transfer portion is hermetically sealed. When a defective portion such as a transfer failure is found in the inspection of the transfer portion, the electrode of the defective portion is irradiated with a laser beam so that the electrode of the portion is dissolved and evaporated. However, even if such repair processing is performed, only the so-called dark spot processing is performed on the defective portion, and the normal light emitting function cannot be recovered. Therefore, a repair process that can restore the normal light emitting function has been desired.

  Therefore, in the present embodiment, after the transfer body is peeled off from the object to be processed (acceptor substrate), a defective portion is identified by inspecting the defective transfer, and after the portion is cleaned, the transfer is performed again. I am doing so. Although such a repair process is not necessarily required, the quality and function of a product (for example, an organic electroluminescence display) in which an object to be processed (acceptor substrate) is used can be recovered if the light emitting function of the defective transfer portion can be recovered. Improvements can be made.

FIG. 8 is a schematic process diagram for illustrating the repair process according to the present embodiment.
As shown in FIG. 8A, after the transfer body is peeled from the object to be processed (acceptor substrate), the transfer portion is inspected (step S4). That is, after the transfer body is peeled from the object to be processed (acceptor substrate), the transfer film transferred from the transfer body is inspected.
An image processing method can be used for the inspection of the transfer portion. For example, a transfer failure can be determined by imaging a transfer portion with a CCD (charge coupled device) camera 21 and analyzing the data.

When a defective transfer portion 12a is found in the transfer portion inspection, a cleaning process is performed as shown in FIG. 8B (step S5).
An example of the cleaning treatment is one that dissolves and evaporates the defective transfer portion 12a by irradiating the laser beam L. That is, the defective portion is removed by irradiating the defective portion in the inspection with laser light.

  After the cleaning process is completed, as shown in FIG. 8C, the process returns to the above-described step S1, and the transfer is performed again only on the cleaned part (removed part) (step S6).

  According to this embodiment, the normal light emitting function can be recovered by repairing the defective transfer portion. Further, if the transfer and the repair process are integrated, the productivity and the product yield can be improved.

Next, the manufacturing method of the organic electroluminescence display according to the present embodiment will be illustrated.
The manufacturing process of the organic electroluminescence display is a process of forming an acceptor substrate provided with an anode electrode, a partition wall, etc., and a transfer body (donor substrate) is placed on the acceptor substrate and brought into close contact with the laser beam to be transferred. A transfer process for forming a sealing substrate, a step for forming a sealing substrate having a sealing portion made of frit, a sealing step for sealing the acceptor substrate and the sealing substrate by irradiating the frit with laser, and the like.
Here, the transfer apparatus, transfer method, transfer body, repair process, and the like according to the present embodiment described above can be used in the transfer process. Since the transfer apparatus, transfer method, transfer body, and repair process other than those described above according to the present embodiment can apply the techniques of each known process, description thereof will be omitted.
According to the method of manufacturing an organic electroluminescence display according to the present embodiment, it is possible to suppress transfer defects, improve quality, improve product yield, improve productivity, and the like.

Heretofore, the present embodiment has been illustrated. However, the present invention is not limited to these descriptions.
As long as the features of the present invention are provided, those skilled in the art appropriately modified the design of the above-described embodiments are also included in the scope of the present invention.
For example, the shape, dimensions, material, arrangement, and the like of each element included in the transfer body, the transfer device, the organic electroluminescence display, and the like are not limited to those illustrated, and can be changed as appropriate.
Moreover, each element with which each embodiment mentioned above is combined can be combined as much as possible, and what combined these is also included in the scope of the present invention as long as the characteristics of the present invention are included.

It is a schematic diagram for illustrating the transfer device according to the first embodiment. It is a schematic diagram for illustrating the relationship between the intensity distribution of laser light and transfer. It is a schematic diagram for illustrating an intensity distribution control means. It is a schematic diagram for illustrating the intensity distribution control means according to another embodiment. It is a schematic diagram for demonstrating about the transfer body which concerns on 2nd Embodiment. It is a schematic diagram for illustrating mixing of gas. 10 is a flowchart for illustrating a transfer method according to a third embodiment; It is a schematic process diagram for illustrating repair processing according to the present embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Transfer apparatus, 2 Laser oscillation means, 3 Imaging optical means, 4 Intensity distribution control means, 4a Intensity distribution control means, 4b Intensity distribution control means, 5 Moving means, 6 Laser control means, 10 Transfer body, 11 Base material, 11a base material, 12 transfer film, 13 light shielding part, 14 transmission part, 15 transmission part, 16 transmission part, 18 transfer body, 19 ventilation means, 100 object to be processed, 101 anode electrode, 102 glass substrate, 103 partition, L laser Light, La laser light, Lb laser light

Claims (7)

Laser oscillation means;
First intensity distribution control means for controlling the intensity distribution of the laser light emitted from the laser oscillation means;
With
The first intensity distribution control means includes a first transmission portion that transmits the laser beam that irradiates a central portion of an irradiation range with respect to a transfer body having a transfer film, and the laser beam that irradiates a peripheral portion of the irradiation range. A second transmission part that transmits the light,
The transfer device characterized in that the transmittance of the second transmission part is relatively higher than the transmittance of the first transmission part. Laser oscillation means;
Second intensity distribution control means for controlling the intensity distribution of the laser light emitted from the laser oscillation means;
With
The second intensity distribution control means has an opening for transmitting the laser beam,
A transfer apparatus, wherein a laser beam relatively stronger than an intensity of the laser beam at a central portion of the opening is formed by diffraction and interference of the laser beam at a peripheral portion of the opening. A transfer body having a transfer film is placed facing the object to be processed,
A transfer method for transferring the transfer film onto the object to be processed by irradiating the transfer body with laser light,
Using the transfer device according to claim 1 or 2, the laser beam is irradiated so that the intensity of the laser beam at the peripheral portion of the irradiation range with respect to the transfer body is higher than the intensity of the laser beam at the central portion of the irradiation range. And a transfer method characterized by: A substrate;
A transfer film provided on one main surface of the substrate;
Ventilation means provided outside the laser beam irradiation range of the substrate;
A transfer body characterized by comprising: The transfer body according to claim 4 is placed so as to face a workpiece,
When the transfer body is brought into close contact with the object to be treated, the mixed gas is discharged through the ventilation means provided on the base material of the transfer body,
Irradiating the transfer body with the laser light such that the intensity of the laser light at the peripheral part of the irradiation range with respect to the transfer body is higher than the intensity of the laser light at the central part of the irradiation range. Manufacturing method of electroluminescent display.   The method for producing an organic electroluminescence display according to claim 5, wherein the laser beam is irradiated onto the transfer body using the transfer device according to claim 1. Peeling off the transfer body from the object to be treated;
Inspect the transfer film transferred from the transfer body,
The defective portion is removed by irradiating the defective portion in the inspection with a laser beam,
The method for producing an organic electroluminescence display according to claim 5, wherein the transfer film is transferred to the removed portion.

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