JP2010032372A - エッジ検出方法 - Google Patents

エッジ検出方法 Download PDF

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Publication number
JP2010032372A
JP2010032372A JP2008195017A JP2008195017A JP2010032372A JP 2010032372 A JP2010032372 A JP 2010032372A JP 2008195017 A JP2008195017 A JP 2008195017A JP 2008195017 A JP2008195017 A JP 2008195017A JP 2010032372 A JP2010032372 A JP 2010032372A
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JP
Japan
Prior art keywords
region
peripheral region
main surface
main
peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008195017A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010032372A5 (enExample
Inventor
Masayuki Doi
雅之 土肥
Itsuko Sakai
伊都子 酒井
Takayuki Sakai
隆行 酒井
Shunji Kikuchi
俊司 菊池
Takuto Inoue
拓人 井上
Tetsuhiro Hori
哲浩 堀
Masayuki Narita
昌幸 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Semiconductor Corp
Original Assignee
Toshiba Corp
Iwate Toshiba Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Iwate Toshiba Electronics Co Ltd filed Critical Toshiba Corp
Priority to JP2008195017A priority Critical patent/JP2010032372A/ja
Priority to US12/510,591 priority patent/US8339615B2/en
Publication of JP2010032372A publication Critical patent/JP2010032372A/ja
Publication of JP2010032372A5 publication Critical patent/JP2010032372A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008195017A 2008-07-29 2008-07-29 エッジ検出方法 Pending JP2010032372A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008195017A JP2010032372A (ja) 2008-07-29 2008-07-29 エッジ検出方法
US12/510,591 US8339615B2 (en) 2008-07-29 2009-07-28 Edge detection method for transparent substrate by detecting non-light-emitting region of transparent substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008195017A JP2010032372A (ja) 2008-07-29 2008-07-29 エッジ検出方法

Publications (2)

Publication Number Publication Date
JP2010032372A true JP2010032372A (ja) 2010-02-12
JP2010032372A5 JP2010032372A5 (enExample) 2011-09-08

Family

ID=41608018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008195017A Pending JP2010032372A (ja) 2008-07-29 2008-07-29 エッジ検出方法

Country Status (2)

Country Link
US (1) US8339615B2 (enExample)
JP (1) JP2010032372A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011181721A (ja) * 2010-03-02 2011-09-15 Yaskawa Electric Corp ウエハアライメント装置
JP2015102389A (ja) * 2013-11-22 2015-06-04 株式会社ディスコ ウェーハの検出方法
JP2022516137A (ja) * 2019-01-07 2022-02-24 アプライド マテリアルズ インコーポレイテッド 遮光エッジ除外ゾーンを備えた透明な基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481852B (zh) * 2012-03-22 2015-04-21 Hiti Digital Inc 用來偵測透光介質邊緣之偵測裝置與偵測方法
TWI497103B (zh) * 2013-03-15 2015-08-21 Hiti Digital Inc 透明介質偵測技術及應用
WO2015058795A1 (en) 2013-10-23 2015-04-30 Hewlett-Packard Development Company, L.P. Edge detector
TWI563451B (en) * 2015-02-04 2016-12-21 Hiti Digital Inc Identifying method and device for detecting specific regions of transparent material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001108406A (ja) * 1999-10-07 2001-04-20 Nsk Ltd 板状体の端面位置測定装置
JP2005109376A (ja) * 2003-10-02 2005-04-21 Canon Inc 透明基板の位置合わせ方法
JP2007165655A (ja) * 2005-12-14 2007-06-28 Varian Semiconductor Equipment Associates Inc ウエハ方向センサー

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5115142A (en) * 1989-08-18 1992-05-19 Central Glass Company, Limited Device for detecting edge of transparent sheet of laminated transparent and translucent sheet assembly
CH693468A5 (de) * 1998-12-16 2003-08-15 Hera Rotterdam Bv Verfahren und Vorrichtung für die Detektion oder Lagebestimmung von Kanten.
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
JP4942129B2 (ja) * 2000-04-07 2012-05-30 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド ＧａＡｓウエハ用のウエハ方向センサー
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
JP4744458B2 (ja) * 2007-01-31 2011-08-10 東京エレクトロン株式会社 基板位置決め装置および基板位置決め方法
JP4468427B2 (ja) * 2007-09-27 2010-05-26 株式会社東芝 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001108406A (ja) * 1999-10-07 2001-04-20 Nsk Ltd 板状体の端面位置測定装置
JP2005109376A (ja) * 2003-10-02 2005-04-21 Canon Inc 透明基板の位置合わせ方法
JP2007165655A (ja) * 2005-12-14 2007-06-28 Varian Semiconductor Equipment Associates Inc ウエハ方向センサー

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011181721A (ja) * 2010-03-02 2011-09-15 Yaskawa Electric Corp ウエハアライメント装置
JP2015102389A (ja) * 2013-11-22 2015-06-04 株式会社ディスコ ウェーハの検出方法
JP2022516137A (ja) * 2019-01-07 2022-02-24 アプライド マテリアルズ インコーポレイテッド 遮光エッジ除外ゾーンを備えた透明な基板
JP7520017B2 (ja) 2019-01-07 2024-07-22 アプライド マテリアルズ インコーポレイテッド 遮光エッジ除外ゾーンを備えた透明な基板

Also Published As

Publication number Publication date
US20100027032A1 (en) 2010-02-04
US8339615B2 (en) 2012-12-25

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