JP2010028113A5 - - Google Patents

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Publication number
JP2010028113A5
JP2010028113A5 JP2009163556A JP2009163556A JP2010028113A5 JP 2010028113 A5 JP2010028113 A5 JP 2010028113A5 JP 2009163556 A JP2009163556 A JP 2009163556A JP 2009163556 A JP2009163556 A JP 2009163556A JP 2010028113 A5 JP2010028113 A5 JP 2010028113A5
Authority
JP
Japan
Prior art keywords
layer
providing
backing plate
hot melt
melt adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009163556A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010028113A (ja
JP5634687B2 (ja
Filing date
Publication date
Priority claimed from US12/175,992 external-priority patent/US7820005B2/en
Application filed filed Critical
Publication of JP2010028113A publication Critical patent/JP2010028113A/ja
Publication of JP2010028113A5 publication Critical patent/JP2010028113A5/ja
Application granted granted Critical
Publication of JP5634687B2 publication Critical patent/JP5634687B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009163556A 2008-07-18 2009-07-10 複数層化学機械研磨パッド製造方法 Active JP5634687B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/175,992 US7820005B2 (en) 2008-07-18 2008-07-18 Multilayer chemical mechanical polishing pad manufacturing process
US12/175,992 2008-07-18

Publications (3)

Publication Number Publication Date
JP2010028113A JP2010028113A (ja) 2010-02-04
JP2010028113A5 true JP2010028113A5 (enExample) 2012-08-23
JP5634687B2 JP5634687B2 (ja) 2014-12-03

Family

ID=41203874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009163556A Active JP5634687B2 (ja) 2008-07-18 2009-07-10 複数層化学機械研磨パッド製造方法

Country Status (6)

Country Link
US (1) US7820005B2 (enExample)
EP (1) EP2145732B1 (enExample)
JP (1) JP5634687B2 (enExample)
KR (1) KR101620636B1 (enExample)
CN (1) CN101628398B (enExample)
TW (1) TWI458590B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8297606B2 (en) * 2009-08-06 2012-10-30 Michael Stanley Phillips Cutting board apparatus
CN103313845B (zh) * 2011-01-12 2015-04-29 株式会社普利司通 橡胶构件接合装置
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP5893413B2 (ja) 2012-01-17 2016-03-23 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
TWI607499B (zh) * 2013-01-31 2017-12-01 Ebara Corp Polishing device, polishing pad attachment method, and polishing pad replacement method
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN111923447A (zh) * 2020-10-09 2020-11-13 山东国维复合材料科技有限公司 一种纤维热固性树脂单向带预浸机及其生产工艺

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5222331A (en) * 1990-04-10 1993-06-29 Minnesota Mining And Manufacturing Company Abrading assembly
US5507906A (en) * 1990-04-13 1996-04-16 M. J. Woods, Inc. Method for making multilayer pad
JPH0579174A (ja) * 1991-09-25 1993-03-30 Matsushita Electric Works Ltd 床材及び床材の製造方法
JPH09302905A (ja) * 1996-05-09 1997-11-25 Koei Shoji:Kk カーペットの敷き詰め方法
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JP2000306870A (ja) * 1999-04-22 2000-11-02 Sumitomo Metal Ind Ltd 研磨パッド及び試料吸着パッド並びにこれらを用いた試料研磨装置及び試料研磨方法
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US7077733B1 (en) * 2000-08-31 2006-07-18 Micron Technology, Inc. Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
US6616519B2 (en) * 2001-09-14 2003-09-09 Saint-Gobain Abrasives Technology Company Sanding system
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
JP4181930B2 (ja) * 2003-06-27 2008-11-19 東洋インキ製造株式会社 研磨パッド積層体
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US7160413B2 (en) * 2004-01-09 2007-01-09 Mipox International Corporation Layered support and method for laminating CMP pads
US20060135051A1 (en) * 2004-12-20 2006-06-22 Cabot Microelectronics Corporation Polishing pad with removal features
JP2007203394A (ja) * 2006-01-31 2007-08-16 Nitta Haas Inc 研磨パッド
JPWO2008114520A1 (ja) * 2007-03-19 2010-07-01 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法

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