CN101628398B - 多层化学机械抛光垫的制造方法 - Google Patents

多层化学机械抛光垫的制造方法 Download PDF

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Publication number
CN101628398B
CN101628398B CN200910160797.0A CN200910160797A CN101628398B CN 101628398 B CN101628398 B CN 101628398B CN 200910160797 A CN200910160797 A CN 200910160797A CN 101628398 B CN101628398 B CN 101628398B
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CN
China
Prior art keywords
layer
hot melt
melt adhesive
reactive hot
subpad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN200910160797.0A
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English (en)
Chinese (zh)
Other versions
CN101628398A (zh
Inventor
M·詹森
J·G·诺兰德
B·哈丁
C·科德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN101628398A publication Critical patent/CN101628398A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN200910160797.0A 2008-07-18 2009-07-17 多层化学机械抛光垫的制造方法 Active CN101628398B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/175,992 US7820005B2 (en) 2008-07-18 2008-07-18 Multilayer chemical mechanical polishing pad manufacturing process
US12/175,992 2008-07-18

Publications (2)

Publication Number Publication Date
CN101628398A CN101628398A (zh) 2010-01-20
CN101628398B true CN101628398B (zh) 2012-02-15

Family

ID=41203874

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910160797.0A Active CN101628398B (zh) 2008-07-18 2009-07-17 多层化学机械抛光垫的制造方法

Country Status (6)

Country Link
US (1) US7820005B2 (enExample)
EP (1) EP2145732B1 (enExample)
JP (1) JP5634687B2 (enExample)
KR (1) KR101620636B1 (enExample)
CN (1) CN101628398B (enExample)
TW (1) TWI458590B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358238A (zh) * 2012-03-22 2013-10-23 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光层的制造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8297606B2 (en) * 2009-08-06 2012-10-30 Michael Stanley Phillips Cutting board apparatus
CN103313845B (zh) * 2011-01-12 2015-04-29 株式会社普利司通 橡胶构件接合装置
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP5893413B2 (ja) 2012-01-17 2016-03-23 東洋ゴム工業株式会社 積層研磨パッドの製造方法
TWI607499B (zh) * 2013-01-31 2017-12-01 Ebara Corp Polishing device, polishing pad attachment method, and polishing pad replacement method
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN111923447A (zh) * 2020-10-09 2020-11-13 山东国维复合材料科技有限公司 一种纤维热固性树脂单向带预浸机及其生产工艺

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US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5222331A (en) * 1990-04-10 1993-06-29 Minnesota Mining And Manufacturing Company Abrading assembly
US5507906A (en) * 1990-04-13 1996-04-16 M. J. Woods, Inc. Method for making multilayer pad
JPH0579174A (ja) * 1991-09-25 1993-03-30 Matsushita Electric Works Ltd 床材及び床材の製造方法
JPH09302905A (ja) * 1996-05-09 1997-11-25 Koei Shoji:Kk カーペットの敷き詰め方法
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JP2000306870A (ja) * 1999-04-22 2000-11-02 Sumitomo Metal Ind Ltd 研磨パッド及び試料吸着パッド並びにこれらを用いた試料研磨装置及び試料研磨方法
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US7077733B1 (en) * 2000-08-31 2006-07-18 Micron Technology, Inc. Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
US6616519B2 (en) * 2001-09-14 2003-09-09 Saint-Gobain Abrasives Technology Company Sanding system
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
JP4181930B2 (ja) * 2003-06-27 2008-11-19 東洋インキ製造株式会社 研磨パッド積層体
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US7160413B2 (en) * 2004-01-09 2007-01-09 Mipox International Corporation Layered support and method for laminating CMP pads
US20060135051A1 (en) * 2004-12-20 2006-06-22 Cabot Microelectronics Corporation Polishing pad with removal features
JP2007203394A (ja) * 2006-01-31 2007-08-16 Nitta Haas Inc 研磨パッド
JPWO2008114520A1 (ja) * 2007-03-19 2010-07-01 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358238A (zh) * 2012-03-22 2013-10-23 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光层的制造方法
CN103358238B (zh) * 2012-03-22 2016-02-24 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光层的制造方法

Also Published As

Publication number Publication date
CN101628398A (zh) 2010-01-20
EP2145732B1 (en) 2014-06-11
US7820005B2 (en) 2010-10-26
JP2010028113A (ja) 2010-02-04
KR101620636B1 (ko) 2016-05-12
US20100012269A1 (en) 2010-01-21
TWI458590B (zh) 2014-11-01
EP2145732A3 (en) 2013-06-19
JP5634687B2 (ja) 2014-12-03
TW201006612A (en) 2010-02-16
EP2145732A2 (en) 2010-01-20
KR20100009504A (ko) 2010-01-27

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.

CP03 Change of name, title or address