JP2010028112A5 - - Google Patents

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Publication number
JP2010028112A5
JP2010028112A5 JP2009163528A JP2009163528A JP2010028112A5 JP 2010028112 A5 JP2010028112 A5 JP 2010028112A5 JP 2009163528 A JP2009163528 A JP 2009163528A JP 2009163528 A JP2009163528 A JP 2009163528A JP 2010028112 A5 JP2010028112 A5 JP 2010028112A5
Authority
JP
Japan
Prior art keywords
backing plate
layer
pressure sensitive
tabs
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009163528A
Other languages
English (en)
Japanese (ja)
Other versions
JP5457093B2 (ja
JP2010028112A (ja
Filing date
Publication date
Priority claimed from US12/175,965 external-priority patent/US7645186B1/en
Application filed filed Critical
Publication of JP2010028112A publication Critical patent/JP2010028112A/ja
Publication of JP2010028112A5 publication Critical patent/JP2010028112A5/ja
Application granted granted Critical
Publication of JP5457093B2 publication Critical patent/JP5457093B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009163528A 2008-07-18 2009-07-10 化学機械研磨パッド製造用組立品 Active JP5457093B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/175,965 US7645186B1 (en) 2008-07-18 2008-07-18 Chemical mechanical polishing pad manufacturing assembly
US12/175,965 2008-07-18

Publications (3)

Publication Number Publication Date
JP2010028112A JP2010028112A (ja) 2010-02-04
JP2010028112A5 true JP2010028112A5 (enExample) 2012-08-23
JP5457093B2 JP5457093B2 (ja) 2014-04-02

Family

ID=41259313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009163528A Active JP5457093B2 (ja) 2008-07-18 2009-07-10 化学機械研磨パッド製造用組立品

Country Status (6)

Country Link
US (2) US7645186B1 (enExample)
EP (1) EP2145731B1 (enExample)
JP (1) JP5457093B2 (enExample)
KR (1) KR101650195B1 (enExample)
CN (1) CN101628395B (enExample)
TW (1) TWI460051B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607499B (zh) * 2013-01-31 2017-12-01 Ebara Corp Polishing device, polishing pad attachment method, and polishing pad replacement method
WO2015120216A1 (en) 2014-02-07 2015-08-13 Gojo Industries, Inc. Compositions and methods with efficacy against spores and other organisms
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2644280A (en) * 1950-09-13 1953-07-07 Carborundum Co Sanding disk accessory
US4263755A (en) * 1979-10-12 1981-04-28 Jack Globus Abrasive product
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4932163A (en) * 1989-08-29 1990-06-12 Chilton Douglas L Dust control system for an abrasive grinder
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5222331A (en) * 1990-04-10 1993-06-29 Minnesota Mining And Manufacturing Company Abrading assembly
US5507906A (en) * 1990-04-13 1996-04-16 M. J. Woods, Inc. Method for making multilayer pad
TW332162B (en) * 1996-02-01 1998-05-21 Yanase Kk The rotary grinding tool composed by central & grinding component, and by screw or other fastening device to hold component with central component together.
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7077733B1 (en) * 2000-08-31 2006-07-18 Micron Technology, Inc. Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
US6616519B2 (en) * 2001-09-14 2003-09-09 Saint-Gobain Abrasives Technology Company Sanding system
JP2006513573A (ja) * 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US7160413B2 (en) * 2004-01-09 2007-01-09 Mipox International Corporation Layered support and method for laminating CMP pads
US20060135051A1 (en) * 2004-12-20 2006-06-22 Cabot Microelectronics Corporation Polishing pad with removal features
US7549914B2 (en) * 2005-09-28 2009-06-23 Diamex International Corporation Polishing system
JP2007203394A (ja) * 2006-01-31 2007-08-16 Nitta Haas Inc 研磨パッド

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