JP2010016080A - Substrate holding fixture attaching jig and semiconductor manufacturing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding fixture attaching jig which can easily attach and detach a substrate holding fixture safely. <P>SOLUTION: This substrate holding fixture attaching jig has: a substrate holding fixture supporting table 53 for supporting a rim of a substrate holding fixture 8; a fall prevention tool 55 provided on the substrate holding fixture supporting table for preventing the substrate holding fixture mounted on the substrate holding fixture supporting table from falling down; and a support 46 for supporting the substrate holding fixture supporting table so as to move freely. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate holder mounting jig used when a substrate holder used in a semiconductor manufacturing apparatus is attached / detached, and a semiconductor manufacturing apparatus capable of attaching / detaching a substrate holder using the substrate holder mounting jig. Is.

  A semiconductor manufacturing apparatus includes a reaction tube that defines a processing chamber, a reaction tube, a heating device that heats the processing chamber, and a gas supply that supplies a gas such as a processing gas to the processing chamber. A processing system comprising an exhaust system for exhausting the gas from the system and the processing chamber, and the processing chamber is loaded with a substrate such as a silicon wafer held by a substrate holder, and a thin film is formed on the substrate surface. A semiconductor device is manufactured by performing processes such as generation, impurity diffusion, etching, and annealing.

  For example, when a film forming process is performed, the reaction product adheres not only to the substrate surface but also to the wall surface of the reaction tube and the substrate holder. The deposited and deposited reaction products are eventually peeled off and become particles, which contaminates the substrate. Therefore, it is necessary to clean and remove regularly or every predetermined operation time.

  When cleaning reaction tubes and substrate holders, the reaction tubes and substrate holders are removed from the semiconductor manufacturing equipment, but the reaction tubes are large and heavy, and work in a narrow space inside the semiconductor manufacturing equipment. As a result, the burden on the operator is large, and there is a risk of damage to the reaction tube.

  Therefore, in Patent Document 1, a carriage for attaching / detaching a reaction tube has been proposed, and the attaching / detaching operation of the reaction tube can be performed safely and easily.

  On the other hand, since the operator directly attaches / detaches the substrate holder by hand in a narrow space, the attachment / detachment of the substrate holder is still inferior in workability and may be damaged. It was.

Japanese Patent Laid-Open No. 2001-23913

  In view of such circumstances, the present invention provides a substrate holder mounting jig capable of safely and easily attaching and detaching a substrate holder, and a semiconductor manufacturing apparatus capable of using the substrate holder mounting jig.

  The present invention provides a substrate holder support table that supports the peripheral edge of the substrate holder, and prevents the substrate holder provided on the substrate holder support table from falling down. And a substrate holder mounting jig having a support unit that supports the substrate holder support table and is movable.

  According to another aspect of the present invention, there is provided a semiconductor manufacturing apparatus using the substrate holder mounting jig according to claim 1, wherein a processing chamber for processing a substrate held by the substrate holder and a spare provided below the processing chamber are provided. A semiconductor device comprising: a chamber; a support that supports a central portion of the bottom surface of the substrate holder; and a transfer device that transfers the substrate holder while supporting the substrate holder between the preliminary chamber and the processing chamber. It concerns the device.

  According to the present invention, the substrate holder support table that supports the peripheral edge of the substrate holder, and the substrate holder that is provided on the substrate holder support table and placed on the substrate holder support table falls over. And a support unit that supports the substrate holder support table and is movable, so that it is not necessary for the operator to bear the support of the substrate holder in a narrow space. In addition, since the substrate holder is stably supported, the attachment and detachment work of the substrate holder becomes easy and safe, and the workability is improved and the occurrence of damage accidents can be prevented.

  According to the invention, there is provided a semiconductor manufacturing apparatus using the substrate holder mounting jig, wherein a processing chamber for processing a substrate held by the substrate holder, and a spare chamber provided below the processing chamber, The substrate holder includes a support that supports a central portion of the bottom surface of the substrate holder, and a transport device that transports the substrate holder while supporting the substrate holder between the preliminary chamber and the processing chamber. The substrate holder can be attached and detached at the time of maintenance to clean the holder, making it easier and safer, improving workability, shortening the maintenance time, and improving the operating rate of the semiconductor manufacturing equipment. Demonstrate.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  First, referring to FIG. 1, an example of a processing furnace provided in a semiconductor manufacturing apparatus will be described.

  The processing furnace 1 is erected above the preliminary chamber 10, the interior of the preliminary chamber 10 and the interior of the processing furnace 1 (processing chamber 7) are communicated, and the processing furnace 1 is a furnace port formed at the lower end. Is hermetically closed by a furnace port shutter (not shown) or a seal lid 13.

  A boat 8 as a substrate holder is accommodated in the processing chamber 7, and wafers 35 as substrates to be processed are held in a plurality of stages in a horizontal posture in the boat 8. Inside the preliminary chamber 10, a boat elevator 26, which is a substrate holder transfer device between the preliminary chamber 10 and the processing chamber 7, is provided. From the boat elevator 26, a lift that is a support for a substrate holding jig is provided. The arm 30 extends in the horizontal direction. The boat 8 is supported by the lift arm 30 via the seal lid 13, and the boat 8 is lifted and lowered by the boat elevator 26, so that the boat 8 is attached to and detached from the processing chamber 7. It has become.

  The processing furnace 1 has a heater 2 as a heating mechanism. The heater 2 has a cylindrical shape and is vertically installed by being supported by a heater base 3 as a holding plate.

  Inside the heater 2, a process tube 4 as a reaction tube is disposed concentrically with the heater 2. The process tube 4 is composed of an inner tube 5 as an internal reaction tube and an outer tube 6 as an external reaction tube provided outside thereof. The inner tube 5 is made of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC), and has a cylindrical shape with upper and lower ends opened. A processing chamber 7 is defined inside the inner tube 5, and a boat 8 is loaded into the processing chamber 7.

  The outer tube 6 is made of a heat-resistant material such as quartz or silicon carbide, and has an inner diameter larger than the outer diameter of the inner tube 5 and has a cylindrical shape with an upper end closed and a lower end opened. It is provided concentrically with the tube 5. A cylindrical space 9 is formed between the inner tube 5 and the outer tube 6.

  Below the outer tube 6, a manifold 11 is disposed concentrically with the outer tube 6. The manifold 11 is made of, for example, stainless steel, and the inner tube 5 and the outer tube 6 are supported by the manifold 11. Has been.

  An O-ring 12 as a seal member is provided between the manifold 11 and the outer tube 6. The manifold 11 is supported by the heater base 3 so that the process tube 4 is installed vertically. A reaction vessel is formed by the process tube 4 and the manifold 11, the lower end opening of the manifold 11 forms a furnace port, and the furnace port is hermetically closed by the seal lid 13. .

  A nozzle 14 as a gas introduction part is connected to the seal lid 13 so as to communicate with the inside of the processing chamber 7, and a gas supply pipe 15 is connected to the nozzle 14. A processing gas supply source and an inert gas supply source (not shown) are connected to the upstream side of the gas supply pipe 15 via a gas flow rate regulator (mass flow controller) 16. A gas flow rate controller 17 is electrically connected to the gas flow rate regulator 16 and is configured to control at a desired timing so that the flow rate of the supplied gas becomes a desired amount.

  An exhaust pipe 18 that exhausts the atmosphere in the processing chamber 7 communicates with the manifold 11. The exhaust pipe 18 communicates with the lower end portion of the cylindrical space 9.

  The exhaust pipe 18 is provided with a pressure sensor 19 and a valve device 20 as a pressure detector toward the downstream side, and the exhaust pipe 18 is connected to a vacuum exhaust device 21 such as a vacuum pump.

  A pressure control unit 22 is electrically connected to the valve device 20 and the pressure sensor 19, and the pressure control unit 22 performs the processing by the valve device 20 based on the pressure detected by the pressure sensor 19. Control is performed at a desired timing so that the pressure in the chamber 7 becomes a desired pressure (degree of vacuum).

  The seal lid 13 that opens and closes the furnace port portion is made of a metal such as stainless steel and is formed in a disc shape. An O-ring 23 is provided on the upper surface of the seal lid 13 as a seal member that contacts the lower end of the manifold 11.

  A rotating mechanism 24 that rotates the boat 8 is installed below the seal lid 13. A rotating shaft 25 of the rotating mechanism 24 passes through the seal lid 13 and is connected to the boat 8 so that the boat 8 can rotate.

  The seal lid 13 is supported by the elevating arm 30, and the elevating arm 30 is supported by the boat elevator 26 so that the elevating arm 30 is raised and lowered by the boat elevator 26. The processing chamber 7 can be loaded and unloaded. A drive control unit 27 is electrically connected to the rotation mechanism 24 and the boat elevator 26, and is configured to control at a desired timing so as to perform a desired operation. Here, the rotating shaft 25, the seal lid 13, the lifting arm 30 and the like constitute a boat support portion.

  The boat 8 is made of a heat-resistant material such as quartz or silicon carbide, and is configured to hold a plurality of wafers 35 in a horizontal posture and in a state where the centers are aligned with each other and held in multiple stages. In addition, at the lower part of the boat 8, a heat insulating portion 29 is configured in which a plurality of heat insulating plates 28 as a disk-shaped heat insulating member made of a heat resistant material such as quartz or silicon carbide are arranged in a horizontal posture in multiple stages. The heat from the heater 2 is not easily transmitted to the manifold 11 side.

  A temperature sensor 31 is installed in the process tube 4, and a temperature control unit 32 is electrically connected to the temperature sensor 31 and the heater 2, and the temperature information detected by the temperature sensor 31 is displayed. On the basis of this, by adjusting the energization condition to the heater 2, the temperature of the processing chamber 7 is controlled at a desired timing so as to have a desired temperature distribution.

  The gas flow rate control unit 17, the pressure control unit 22, the drive control unit 27, the temperature control unit 32, an operation unit (not shown), and an input / output unit are electrically connected to a main controller 33 that controls the entire substrate processing apparatus. It is connected.

  Next, a method of forming a thin film on the wafer 35 by the CVD method as one step of the semiconductor device manufacturing process using the processing furnace 1 having the above configuration will be described. In the following description, the operation of each part constituting the substrate processing apparatus is controlled by the main controller 33.

  When a predetermined number of wafers 35 are loaded into the boat 8, the boat 8 is loaded into the processing chamber 7 by the boat elevator 26 (boat loading). In this state, the seal lid 13 hermetically closes the furnace port portion via the O-ring 23.

  The processing chamber 7 is evacuated by the evacuation device 21 so as to have a desired pressure (degree of vacuum). At this time, the pressure in the processing chamber 7 is measured by the pressure sensor 19, and the pressure control unit 22 feedback-controls the valve device 20 based on the measured pressure.

  Further, the processing chamber 7 is heated by the heater 2 so as to reach a desired temperature. At this time, the power supply to the heater 2 is feedback-controlled based on the temperature information detected by the temperature sensor 31 so that the processing chamber 7 has a desired temperature distribution. Subsequently, the boat 8 is rotated by the rotating mechanism 24 and the wafer 35 is simultaneously rotated.

  Next, a processing gas is supplied from a processing gas supply source (not shown), and the gas controlled to have a desired flow rate by the gas flow rate regulator 16 is circulated through the gas supply pipe 15 from the nozzle 14. It is introduced into the processing chamber 7. The introduced gas rises in the processing chamber 7, turns over the upper end opening of the inner tube 5, flows down the cylindrical space 9, and is exhausted from the exhaust pipe 18. The gas contacts the surface of the wafer 35 as it passes through the processing chamber 7, and at this time, a thin film is deposited on the surface of the wafer 35 by a thermal CVD reaction.

  When a preset processing time has passed, an inert gas is supplied from an inert gas supply source (not shown), and when the processing chamber 7 is replaced with an inert gas, the valve device 20 is closed, and the processing chamber The pressure of 7 is returned to normal pressure.

  Thereafter, the seal lid 13 is lowered by the boat elevator 26 to open the furnace opening, and the processed wafer 35 is pulled out of the processing chamber 7 while being held by the boat 8. Thereafter, the processed wafer 35 is discharged from the boat 8 by a substrate transfer device (not shown).

  After the substrate processing is repeatedly performed, the deposits deposited on the process tube 4, the inner tube 5, and the boat 8 are cleaned to remove the deposits.

  For the attachment / detachment of the process tube 4, the inner tube 5, and the boat 8 accompanying the cleaning operation, a reaction tube attachment / detachment carriage and a substrate holder attachment jig are used.

  First, referring to FIG. 2, the reaction tube attaching / detaching carriage 38 and the substrate holder mounting jig 39 will be outlined.

  In FIG. 2, reference numeral 41 denotes a semiconductor manufacturing apparatus, and 42 denotes a frame. The frame 42 is configured to form a space 43 having a required height and a required width at the bottom of the semiconductor manufacturing apparatus 41.

  The reaction tube attachment / detachment carriage 38 is attached to a main frame 44, a support leg 45 extending from the main frame 44 along the floor surface, and attached to the upper surface of the main frame 44, and extends parallel to the floor surface, that is, horizontally. A reaction tube support table 46 is provided. The reaction tube support table 46 is cantilevered above the support leg 45.

  A small-diameter wheel 47 is provided at the distal end of the support leg 45, and a large-diameter wheel 48 is provided on the lower surface of the main frame 44, so that the reaction tube attaching / detaching carriage 38 can run freely. The support leg 45 can enter the space 43, and the reaction tube support table 46 can enter the semiconductor manufacturing apparatus 41. In FIG. 2, 49 is a handle.

  When the reaction tube attachment / detachment carriage 38 is advanced so that the support leg 45 enters the space 43, the reaction tube support table 46 supported by the reaction tube attachment / detachment carriage 38 also enters the semiconductor manufacturing apparatus 41. However, it can be located directly under the processing furnace 1. Therefore, the process tube 4 and the inner tube 5 can be placed on the reaction tube support table 46 (see Patent Document 1).

  In the present invention, the substrate holder mounting jig 39 can be attached to and detached from the reaction tube support table 46, and the boat 8 can be attached and detached by attaching the substrate holder mounting jig 39 to the reaction tube support table 46. It is possible.

  The substrate holder mounting jig 39 will be described with reference to FIGS.

  The support leg 45 has a bifurcated fork shape so that it does not interfere with members of the boat elevator 26 such as the rotating mechanism 24 when the elevating arm 30 is lowered. The reaction tube support table 46 is formed with a U-shaped notch 51, and the notch 51 has a size that allows the process tube 4 and the inner tube 5 to freely advance and retract.

  The substrate holder mounting jig 39 is attached to the reaction tube support table 46. The reaction tube support table 46 is a part of the movable reaction tube attaching / detaching carriage 38 and is a support portion for supporting the substrate holder mounting jig 39.

  The substrate holder mounting jig 39 mainly supports a jig base 52 attached to the reaction tube support table 46, a substrate holder support table 53 for supporting the boat 8, and the substrate holder support table 53 for supporting the reaction tube. The table 46 mainly includes a support leg 54 that supports the table 46 at a predetermined height, and a fall prevention tool 55 provided on the substrate holder support table 53.

  The jig base 52 is concentric with the notch 51 and has the same shape or the same notch 56. The support leg 54 is erected on the jig base 52, and the substrate holder support table 53 is attached to the upper end of the support leg 54.

  The substrate holder support table 53 is partially cut out in a ring shape and has the same shape as the notch 56. The cross section of the substrate holder support table 53 has a rectangular inner edge cut out. It has an L shape, and a holder receiver 57 is fitted and fixed to the cut portion. The holder receiver 57 has a shape similar to that of the substrate holder support table 53 and a part of the ring is cut off. A non-metallic material such as a fluororesin is used as the material, and the holder 8 is in contact with the boat 8. Therefore, the boat 8 is made of a protective material so as not to be damaged.

  The cross section of the holder receiver 57 is also L-shaped like the substrate holder support table 53, and the cut portion 59 of the holder receiver 57 is a step that supports the flange periphery of the boat 8 as will be described later. It has a surface 58 (see FIG. 5). The upper part of the inner edge adjacent to the cut portion 59 of the holder receiver 57 is chamfered 61, and serves as a guide when the flange of the boat 8 is fitted to and detached from the cut portion 59. The upper end of the holder holder 57 protrudes upward from the upper surface of the substrate holder support table 53, the inner edge of the holder holder 57 protrudes to the center side from the inner edge of the substrate holder support table 53, and The flange of the boat 8 does not directly contact the metal substrate holder support table 53.

  On the upper surface of the substrate holder support table 53, a required number of counterbore portions 53a are provided at equal intervals along an arc. The counterbore part 53a is provided with a required number (four in the figure) of the overturn prevention tools 55 at equal intervals along the arc. The fall prevention tool 55 is positioned by the counterbore 53a. The fall prevention tool 55 is provided only on the front side of the substrate holder support table 53 in the traveling direction (the side with the handle 49). Thereby, even within the space where the inside width of the substrate processing apparatus is small and maintenance is difficult, the operator can easily access the fall prevention tool 55 from outside the apparatus.

  The tipping prevention tool 55 is made of a non-metallic material such as fluororesin so that the boat 8 is not damaged by contact with the boat 8. The fall prevention tool 55 is attached to the substrate holder support table 53 by a knurled bolt 62, and the fall prevention tool 55 can be rotated by loosening the knurled bolt 62. Further, the lower surface of the tip of the tipping prevention tool 55 is cut out so as to form a predetermined distance from the upper surface of the substrate holder support table 53. Further, when the boat 8 is supported on the upper surface of the substrate holder support table 53, a gap S (see FIG. 6) is formed between the lower surface of the tip of the tipping prevention device 55 and the upper surface of the boat 8 bottom plate 64. It is configured to be. Due to the existence of this gap, even if the boat 8 placed on the substrate holder support table 53 is transported by the reaction tube attachment / detachment carriage 38, the fall between the substrate holder support table 53 and the bottom surface of the boat 8 occurs. The problem of rubbing between the prevention tool 55 and the upper surface of the boat 8 bottom plate 64 can be suppressed. The knurled bolt 62 preferably uses a retaining screw in order to prevent loss.

  Next, an outline of the boat 8 supported by the substrate holder mounting jig 39 will be described.

  The boat 8 includes a substrate holding portion 63 that holds the wafer 35 and a heat insulating portion 29 that is positioned below the substrate holding portion 63 and suppresses heat radiation from the furnace opening. The required number of plates 28 is loaded.

  The boat 8 includes a structure in which the substrate holding portion 63 and the heat insulating portion 29 are integrally formed, and a boat 8 in which the substrate holding portion 63 and the heat insulating portion 29 are separated. In the illustrated boat 8, the substrate holding portion 63 and the heat insulating portion 29 are integrally structured. In the integrally structured structure, the boat 8 is supported by the seal lid 13.

  Moreover, the boat 8 shown in FIG. 2 has shown the case where the said heat insulation part 29 is another structure. In the boat 8 having the separation structure, the boat 8 is placed on the heat insulating portion 29 and supported by the seal lid 13 through the heat insulating portion 29. The boat 8 has a bottom plate 64 at the lower end. The outer diameter of the bottom plate 64 is larger than the outer diameter of the upper end of the heat insulating portion 29, and the periphery of the bottom plate 64 projects outward.

  First, the case where the substrate holder mounting jig 39 of the present invention is implemented in the mounting and detaching of the boat 8 having the separation configuration shown in FIG. 2 will be described. Note that the height of the support leg 54 is set corresponding to the height of the heat insulating portion 29.

  The boat elevator 26 lowers the elevating arm 30 to the preliminary chamber 10 to bring the boat 8 into a lowered state.

  The reaction tube attaching / detaching carriage 38 is inserted into the semiconductor manufacturing apparatus 41 and positioned so that the centers of the notch 51 and the notch 56 coincide with the center of the processing furnace 1. At this time, the fall prevention tool 55 is rotated so that the tip portion is on the outside.

  Further, when the reaction tube attaching / detaching carriage 38 enters, the vertical positional relationship between the substrate holder supporting table 53 and the bottom plate 64 is such that the lower surface of the bottom plate 64 is placed on the holder receiver 57 as shown in FIG. It is set so as to be located above the upper end of. The vertical position is set by adjusting the vertical position of the lift arm 30 by the boat elevator 26.

  Further, the relationship between the inner diameter D1 of the holder receiver 57, the outer diameter D2 of the upper end of the heat insulating portion 29, and the outer diameter D3 of the bottom plate 64 is D2 <D1 <D3.

  The substrate holding part 63 enters the notch 51 and the notch 56 and does not interfere with the reaction tube support table 46 and the jig base 52.

  The boat elevator 26 lowers the lifting arm 30 by a predetermined amount. The bottom plate 64 is fitted to the cut portion 59 and is further lifted in a state where the substrate holder 63 is supported by the holder receiver 57. The bottom plate 64 is separated from the upper end of the heat insulating portion 29. In general, the substrate holding part 63 is supported by the holder receiver 57, and the substrate holding part 63 is separated from the heat insulating part 29.

  The fall prevention tool 55 is rotated, the bottom plate 64 is clamped between the fall prevention tool 55 and the holder receiver 57, and the knurled bolt 62 is fastened and fixed. By fixing the bottom plate 64 with each of the overturn prevention tools 55, the boat 8 is prevented from overturning (see FIG. 6).

  In addition, attachment / detachment of the heat insulating portion 29 is appropriately performed manually by an operator. About this heat insulation part 29, it is small and lightweight, and there is little burden on an operator.

  Next, the substrate holding part 63, that is, the boat 8 can be taken out from the semiconductor manufacturing apparatus 41 by retracting the reaction tube attaching / detaching carriage 38. Even if there is vibration or the like when the reaction tube attaching / detaching carriage 38 is moved backward, the boat 8 is fixed to the substrate holder supporting table 53 by the tipping prevention tool 55, so that the tipping is prevented. .

  Carrying in when the boat 8 is mounted is performed in the reverse procedure of the carrying out.

  Next, as shown in FIG. 1, when the substrate holding portion 63 and the heat insulating portion 29 are integrated, the substrate holder mounting jig 39 has the support leg 54 removed. The substrate holder support table 53 is directly attached to the jig base 52 or the reaction tube support table 46.

  For example, the substrate holder support table 53 is directly fixed to the reaction tube support table 46, and the holder receiver 57 and the overturn prevention tool 55 are attached to the substrate holder support table 53, respectively.

  When removing the boat 8, the reaction tube support table 46 is inserted between the bottom plate 64 of the boat 8 and the seal lid 13, and the bottom plate 64 of the boat 8 is fitted with the holder receiver 57. The boat 8 is supported by the holder receiver 57 by lowering the boat 8 by the boat elevator 26. The fall prevention tool 55 prevents the fall by fixing the bottom plate 64 of the boat 8. When the boat 8 and the seal lid 13 are separated from each other, the integrated boat 8 can be carried out of the semiconductor manufacturing apparatus 41 by retracting the reaction tube attaching / detaching carriage 38.

  FIG. 7 shows another embodiment.

  A bottomed spring storage hole 65 is formed in the fall prevention tool 55 concentrically with the through hole of the knurled bolt 62, and the coil spring 66 is fitted into the spring storage hole 65 in a compressed state. The knurled bolt 62 is screwed to the substrate holder support table 53 through a spring retainer 67. It should be noted that a necessary gap is left between the spring retainer 67 and the top surface of the overturn prevention tool 55.

  The pressing force of the toppling prevention tool 55 against the bottom plate 64 is the urging force of the coil spring 66, and when the upward force is applied to the toppling prevention tool 55 by tilting the boat 8 or the like, the coil spring 66 is bent. Thus, the fall prevention tool 55 escapes upward and prevents an excessive load from acting on the bottom plate 64.

  Further, since the overturn prevention tool 55 can be displaced in the vertical direction, it is easy to make fine adjustments, and it is easy to visually recognize the displacement state, and the boat elevator 26 positions the boat 8 in the vertical direction. Matching work becomes easier.

  The coil spring 66 is a pressing member that presses the fall prevention tool 55 against the bottom plate 64. The pressing member may be a stack of a plurality of disc springs instead of the coil spring. May be a highly elastic material such as rubber.

(Appendix)
The present invention includes the following embodiments.

  (Supplementary Note 1) While supporting the periphery of the substrate holder with the substrate holder support table, the substrate holder is prevented from being overturned by the tipping prevention tool provided on the substrate holder support table. A step of moving a support portion that supports the holder support table, a step of transferring the substrate holder from the substrate support table to a support that supports a bottom center portion of the substrate holder, and a support that supports the support Mounting the substrate on the substrate holder, transporting the substrate into a processing chamber, and processing the substrate.

  (Supplementary Note 2) A substrate holder support table that supports the periphery of the substrate holder, and the substrate holder that is provided on the substrate holder support table and prevents the substrate holder placed on the substrate holder table from falling over. A substrate holder mounting jig comprising a fall prevention tool and a support portion that supports the substrate holder support table and is movable.

  (Additional remark 3) The board | substrate holder mounting jig of Additional remark 2 with which the said fall prevention tool is provided with the press member which regulates the movement of the said substrate holder.

  (Supplementary note 4) The substrate holder mounting jig according to supplementary note 2, wherein a plurality of the overturn prevention tools are provided along an arc of a notch portion of the base holder support table.

It is sectional drawing which shows an example of the processing furnace used for the semiconductor manufacturing apparatus with which this invention is implemented. It is a side view which shows the outline of the board | substrate holder mounting jig which concerns on this invention. It is a disassembled perspective view of this board | substrate holder mounting jig. It is a top view which shows the board | substrate holder support table of this board | substrate holder mounting jig. It is sectional drawing which shows the principal part of this invention and shows the state which has not fixed the boat to the fall prevention tool. It is sectional drawing which shows the principal part of this invention and shows the state which fixed the boat to the fall prevention tool. It is sectional drawing which shows the principal part of other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing furnace 8 Boat 13 Seal lid 26 Boat elevator 29 Heat insulation part 30 Lifting arm 38 Reaction tube attaching / detaching carriage 39 Substrate holder mounting jig 46 Reaction tube support table 52 Jig base 53 Substrate holder support table 55 Fall prevention tool 56 Notch 57 Retaining holder 62 Knurled bolt 64 Bottom plate 66 Coil spring

Claims (2)

  A substrate holder support table that supports the peripheral edge of the substrate holder, and a tipping prevention tool that is provided on the substrate holder support table and prevents the substrate holder placed on the substrate holder support table from falling down And a substrate holder mounting jig that supports the substrate holder support table and is movable.   2. A semiconductor manufacturing apparatus using the substrate holder mounting jig according to claim 1, wherein a processing chamber for processing a substrate held by the substrate holder, a preliminary chamber provided below the processing chamber, and the substrate A semiconductor manufacturing method comprising: a support body that supports a bottom center portion of a holder; and a transfer device that transfers the substrate holder while being supported by the support body between the preliminary chamber and the processing chamber. apparatus.

Images