JP5032766B2 - Substrate processing apparatus and maintenance method for substrate processing apparatus - Google Patents

Description

The present invention relates to a substrate processing apparatus that etches the surface of a substrate such as a semiconductor wafer or a glass substrate, forms a thin film on the surface, or modifies the surface, and a substrate that maintains such a substrate processing apparatus. The present invention relates to a maintenance method for a processing apparatus .

Technical background

  A substrate processing apparatus, a reaction tube in which an opening portion downward in the gravitational direction is formed, and a furnace port flange that closes the opening portion formed in the reaction tube while supporting the opening portion of the reaction tube from below in the gravity direction A technique having a seal member disposed between a reaction tube and a furnace port flange is known. In this technique, when performing maintenance such as exchanging parts arranged in the substrate processing chamber surrounded by the reaction tube and the furnace port flange, or cleaning the substrate processing chamber, the reaction tube is lifted, etc. The substrate processing apparatus is disassembled into a portion located above the member and a portion located below the seal member.

  However, in the conventional technique, the seal member may adhere to a portion located above the seal member and a portion located below the seal member. In this case, the substrate processing apparatus is disassembled. There is a problem that the work is difficult and the maintenance of the substrate processing apparatus may not be easily performed.

It is an object of the present invention to provide a substrate processing apparatus and a substrate processing apparatus maintenance method that can solve the above-described problems and facilitate maintenance.

A feature of the present invention is that a reaction tube formed with an open portion downward in the direction of gravity is fixed to the reaction tube using a reaction tube fixing ring, and the reaction tube is supported from below in the direction of gravity. A reactor port flange that closes the open portion, a seal member disposed between the reaction tube and the furnace port flange, and an adjusting unit that adjusts a pressing force to the seal member, and the reaction The tube forms at least a part of an upper part located above the seal member, and the furnace port flange forms at least a part of a lower part located below the seal member, and the adjusting means Has a bolt that is screwed into one of the upper part and the lower part in a state in which the tip part can protrude and presses the other of the upper part and the lower part with the tip part. It is in the substrate processing apparatus. Further, the present invention is characterized in that a reaction tube having a downward opening in the direction of gravity is formed and a reaction tube fixing ring is used to fix the reaction tube from below in the direction of gravity. However, it has a furnace port flange that closes the open portion, and a seal member disposed between the reaction tube and the furnace port flange, and the reaction tube is located above the seal member. A maintenance method for a substrate processing apparatus, comprising at least a part of a part, wherein the furnace port flange forms at least a part of a lower part located below the seal member, the upper part and the lower part Rotate a bolt screwed in a state in which the tip part can protrude into one of the parts, and move the bolt in the direction of gravity, so that the tip part of the bolt presses the other of the upper part and the lower part, in front In maintenance method of a substrate processing apparatus, characterized by removing the upper portion from the lower portion. Therefore, the substrate processing apparatus is disassembled into a portion positioned above the seal member and a lower portion than the seal member by adjusting the pressing force to the seal member with the adjusting means and weakening the pressing force applied to the seal member. It becomes easy.

  Preferably, the adjustment includes an upper portion including at least the reaction tube and positioned above the seal member, and a lower portion including at least the furnace port flange and positioned below the seal member. The means includes separation means for separating the upper part and the lower part. Therefore, the substrate processing apparatus is separated into the upper part and the lower part by the separating means.

  Preferably, the adjustment includes an upper portion including at least the reaction tube and positioned above the seal member, and a lower portion including at least the furnace port flange and positioned below the seal member. The means comprises moving means for moving the upper part upward in the gravity direction with respect to the lower part. Therefore, the upper part moves upward with respect to the lower part by the moving means, and the substrate processing apparatus is easily separated into the upper part and the lower part.

Preferably, the adjustment includes an upper portion including at least the reaction tube and positioned above the seal member, and a lower portion including at least the furnace port flange and positioned below the seal member. The means includes pressing means that is provided on one of the upper part and the lower part and presses the other of the upper part and the lower part. Therefore, either the upper part or the lower part is pressed by the pressing means, and the pressing force applied to the seal member is reduced, and the substrate processing apparatus is easily separated into the upper part and the lower part.

Preferably, the adjustment includes an upper portion including at least the reaction tube and positioned above the seal member, and a lower portion including at least the furnace port flange and positioned below the seal member. The means includes a bolt that is screwed into one of the upper part or the lower part and presses the other of the upper part or the lower part in a state where the tip part can protrude. Accordingly, one of the upper part and the lower part is pressed against the other of the upper part and the lower part by the tip of the bolt, and the substrate processing apparatus is easily separated into the upper part and the lower part.

Preferably, there is provided a relaxation member for relaxing concentration of stress applied to one of the upper side portion and the lower side portion from the tip end portion of the bolt. Accordingly, the stress applied to the upper part or the lower part from the pressing means or the bolt is prevented from being concentrated on a part, and the problem that the upper container or the lower container is damaged by the concentrated stress is generated. It becomes difficult.

Preferably, the stress relaxation member is made of a metal ring. Therefore, the stress relaxation member itself is hardly damaged.

  Preferably, an adhesion preventing member for preventing adhesion between the relaxation member and one of the upper part or the lower part is provided. Therefore, even if the relaxation member and the upper member, or the relaxation member and the lower member are made of a material that easily adheres to each other, the stress relaxation member and the upper portion or the lower portion are less likely to adhere to each other. Becomes easier.

  Preferably, the adhesion preventing member is made of a heat resistant resin. Preferably, the seal member is an O-ring. Preferably, the seal member is made of perfluoro fluororubber. Preferably, the upper reaction tube is made of quartz.

ADVANTAGE OF THE INVENTION According to this invention, the maintenance method of a substrate processing apparatus and a substrate processing apparatus which makes it possible to perform maintenance more easily than the prior art is provided.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a substrate processing apparatus 10 according to an embodiment of the present invention. The substrate processing apparatus 10 is a vertical type and has a housing 12 in which main parts are arranged. A pod stage 14 is connected to the housing 12, and the pod 16 is conveyed to the pod stage 14. For example, 25 substrates (wafers) are stored in the pod 16 and set on the pod stage 14 with a lid (not shown) closed.

  A pod transfer device 18 is disposed on the front side in the housing 12 and at a position facing the pod stage 14. Further, a pod shelf 20, a pod opener 22, and a substrate number detector 24 are arranged in the vicinity of the pod transfer device 18. The pod shelf 20 is disposed above the pod opener 22, and the substrate number detector 24 is disposed adjacent to the pod opener 22. The pod carrying device 18 carries the pod 16 among the pod stage 14, the pod shelf 20, and the pod opener 22. The pod opener 22 opens the lid of the pod 16, and the number of substrates in the pod 16 with the lid opened is detected by the substrate number detector 24.

  Furthermore, a substrate support (boat) 30 used as a support for supporting the substrate transfer machine 26, the notch aligner 28, and a plurality of substrates is disposed in the housing 12. The substrate transfer machine 26 has, for example, an arm (tweezer) 32 that can take out five substrates. By moving this arm 32, the pod placed at the position of the pod opener 22, the notch aligner 28, and the substrate. The substrate is transferred between the supports 30. The notch aligner 28 detects notches or orientation flats formed on the substrate and aligns the notches or orientation flats of the substrate at a certain position. Further, a reaction furnace 50 is disposed at the upper part on the back side in the housing 12. The substrate support 30 loaded with a plurality of substrates is loaded into the reaction furnace 50 and subjected to heat treatment.

  2 and 3, a reactor 50 is shown. The reaction furnace 50 includes a reaction tube 52 in which an opening 54 that is downward in the direction of gravity is formed, a furnace port flange 68 that closes the opening 54 while supporting the reaction tube 52 from below in the direction of gravity, and the reaction tube 52 and the furnace. An O-ring 60 used as a seal member disposed between the mouth flange 68, a push bolt 62 used as an adjusting means for adjusting the pressing force to the O-ring 60, and the reaction tube 52 from the push bolt 62. It has a spacer ring 64 used as a relaxation member for reducing stress concentration, and a heat-resistant resin ring 66 used as an adhesion preventing member for preventing adhesion between the spacer ring 64 and the reaction tube 52.

  The reaction tube 52 is made of quartz, the upper end portion is closed, an open portion 54 is formed at the lower end portion, and a flange 52 a is formed around the open portion 54. The reaction tube 52 is used as an upper portion that includes at least the reaction tube 52 and is located above the O-ring 60.

  The furnace port flange 68 is made of metal, and is formed so that an open part having substantially the same diameter as the open part 54 formed in the reaction tube 52 penetrates from the upper end part to the lower end part. The furnace port flange 68 is disposed at the lower part of the reaction tube 52 so that the opening 6 and the open part 54 overlap each other. On the upward surface of the furnace port flange 68, the downward surface of the flange 52 a of the reaction tube 52 is placed via the spacer ring 64 and the heat-resistant resin ring 66. The reaction tube 52 and the furnace port flange 68 are fixed using the reaction tube fixing ring 72 in a state where the flange 52 a is placed on the furnace port flange 68.

  Below the furnace port flange 68, a seal cap 70 is disposed with the O-ring 61 open. The seal cap 70 supports the furnace port flange 68 with an upward surface and seals the open portion of the furnace port flange 68. Since the open portion of the furnace port flange 68 is sealed by the seal cap 70, the open portion 54 of the reaction tube 52 can be closed using the furnace port flange 68. The lower container 56 used as a lower portion located below the O-ring 60 including at least the furnace port flange 68 is formed by the seal cap 70, the furnace port flange 68, and an O-ring 61 described later.

A substrate processing chamber 58 is formed in a space surrounded by the furnace port flange 68, the seal cap 70, the O-ring 61, and the reaction tube 52, and the substrate 150 is processed in the substrate processing chamber 58. Further, the reaction tube 52, the furnace port flange 68, and the seal cap 70 form a substrate processing container 74 that forms the substrate processing chamber 58.

  A substrate support 30 that supports the substrate 150 to be processed is inserted into the substrate processing chamber 58. The substrate support 30 supports a large number of, for example, about 25 to 100 substrates 150 in a substantially horizontal state with gaps in multiple stages.

  A supply pipe 80 for supplying a reaction gas into the substrate processing chamber 58 and a discharge pipe 82 for discharging the reaction gas from the substrate processing chamber 58 are attached to the reaction tube 52 so as to penetrate the reaction tube 52. A nozzle 84 for blowing reactive gas to the substrate 150 supported in multiple stages by the substrate support 30 is connected to an end portion of the supply pipe 80 located inside the substrate processing chamber 58, and the outside of the substrate processing chamber 58 of the supply pipe 80. A gas cylinder (not shown) that is used as a reaction gas supply means is connected to the end located at the position. Further, a suction pump (not shown) used as suction means is connected to the end of the discharge pipe 82 located outside the substrate processing chamber 58.

  Around the substrate processing container 74 forming the substrate processing chamber 58, a heater 88 used as a heating means for heating the substrate 150 supported in the substrate processing chamber 58 by the substrate support 30 is disposed. The heater 88 is supported from below by a heater base 90, and the heater base 90 is supported by a top plate 92 and a support member 94. The support member 94 is fixed to the furnace port flange 68 by the fixing bolt 96.

  The O-ring 60 is a seal member that maintains the substrate processing chamber 58 formed by the reaction tube 52, the furnace port flange 68, and the like in a substantially airtight state, and no gap is generated between the reaction tube 52 and the furnace port flange 68. It is the sealing member which seals like this. The O-ring 60 is made of perfluorinated fluororubber and easily adheres to the reaction tube 52 and the furnace port flange 68 due to the influence of gravity applied from the reaction tube 52 or heat from the heater 88.

  The push bolt 62 is screwed into a substantially vertical screw hole 68 b formed in the furnace port flange 68 from below, and a tip end portion 62 a thereof can project from the furnace port flange 68. A plurality of push bolts 62 are provided at equal intervals in the circumferential direction of the furnace port flange 68. For example, eight push bolts 62 are provided at an equal angle of 45 degrees from the center of the open portion of the furnace port flange 68. When the operator rotates the push bolt 62 in the direction to raise, the tip end portion 62a rises, and the raised tip portion 62a causes the reaction tube 52 to move in the direction of gravity via the spacer ring 64 and the heat-resistant resin ring 66. Press from below. As described above, the push bolt 62 is used as a pressing means provided in the lower container 56 for pressing the reaction tube 52.

Further, the push bolt 62 pushes the reaction tube 52 from below in the gravitational direction to separate the reaction tube 52 from the lower container 56 and move the reaction tube 52 from the lower container 56 upward in the gravitational direction. Thus, the push bolt 62 is used not only as an adjusting means for adjusting the pressing force to the O-ring 60 but also as a separating means for separating the reaction tube 52 from the lower container 56, and also for the reaction tube 52. Is used as a moving means for moving the sword upward in the direction of gravity.

  The spacer ring 64 is made of stainless steel that is a metal. The spacer ring 64 is not necessarily circular, and the shape is appropriately selected according to the shape of the reaction tube 52 and the shape of the furnace port flange 68. By providing the spacer ring 64, the tip end portion 62 a of the push bolt 62 does not directly push up the reaction tube 52, but pushes up the reaction tube 52 through the spacer ring 64. For this reason, the stress applied to the reaction tube 52 is distributed over the entire portion of the spacer ring 64 that contacts the reaction tube 52, and the stress of the reaction tube 52 that may occur when the stress concentrates on the tip 62 a of the push bolt 62. Damage is less likely to occur. Note that the spacer ring 64 may be omitted. If there is no risk of damage to the reaction tube 52 due to stress concentration due to the material of the reaction tube, the weight of the reaction tube, the material of the O-ring, the area where the tip 62a of the push bolt 62 is in contact with the reaction tube 52, etc. 64 may not be provided.

  The heat-resistant resin ring 66 is disposed between the spacer ring 64 and the reaction tube 52 and makes it difficult to attach the spacer ring 64 made of stainless steel, which is a metal, and the reaction tube 52 made of quartz. Further, a heat resistant resin ring 98 is disposed between the reaction tube 52 and the reaction tube fixing ring 72. Therefore, even if the reaction tube fixing ring 72 is made of metal, it is difficult to adhere to the reaction tube 52 made of quartz. The heat-resistant resin ring 66 and the heat-resistant resin ring 98 can be omitted. For example, when the combination of the material of the reaction tube 52, the material of the furnace port flange 68, and the material of the reaction tube fixing ring 72 is difficult to adhere to each other, the heat-resistant resin ring 66 and the heat-resistant resin ring 98 are not provided. May be.

Next, the operation of the substrate processing apparatus 10 will be described.
First, when the pod 16 containing a plurality of substrates 150 is set on the pod stage 14, the pod 16 is transferred from the pod stage 14 to the pod shelf 20 by the pod transfer device 18 and stocked on the pod shelf 20. Next, the pod 16 stocked on the pod shelf 20 is transported and set to the pod opener 22 by the pod transport device 18, the lid of the pod 16 is opened by the pod opener 22, and the pod 16 is detected by the substrate number detector 24. The number of substrates 150 accommodated in is detected.

Next, the substrate transfer machine 26 takes out the substrate 150 from the pod 16 at the position of the pod opener 22 and transfers it to the notch aligner 28. The notch aligner 28 detects notches while rotating the substrate 150, and aligns the notches of the plurality of substrates 150 at the same position based on the detected information. Next, the substrate transfer machine 26 takes out the substrate 150 from the notch aligner 28 and transfers it to the substrate support 30.

Thus, when one batch of substrates 150 is transferred to the substrate support 30, a plurality of substrates 150 are loaded into the reaction furnace 50 (substrate processing chamber 58) set to a temperature of about 600 ° C., for example. The substrate support 30 thus prepared is inserted, and the inside of the reaction tube 52 is sealed with a seal cap 70. Next, the furnace temperature is raised to the heat treatment temperature, and the processing gas is introduced into the reaction tube 52 through the supply tube 80. The processing gas includes nitrogen (N2), argon (Ar), hydrogen (H2), oxygen (O2), and the like.

When the heat treatment of the substrate 150 is completed, the temperature in the furnace is lowered to a predetermined temperature, and then the substrate support 30 supporting the heat-treated substrate 150 is unloaded from the reaction furnace 50 and supported by the substrate support 30. The substrate support 30 is put on standby at a predetermined position until all the substrates 150 that have been cooled are cooled. Next, when the substrate 150 of the substrate support 30 that has been put on standby is cooled to a predetermined temperature, the substrate transfer device 26 takes out the substrate 150 from the substrate support 30 and the empty pod set in the pod opener 22. It is conveyed to 16 and accommodated. Next, the pod 16 containing the substrate 150 is transferred to the pod shelf 20 by the pod transfer device 18 and further transferred to the pod stage 14 to complete a series of processes.

  In order to remove the reaction tube 52 from the lower container 56 for maintenance or the like, first, the substrate processing container 74 is detached from the substrate processing apparatus 10 and is transported to, for example, a maintenance area. In the maintenance area, the reaction tube fixing ring 72 is removed from the furnace port flange 68. Thereafter, the operator rotates the push bolt 62 to raise the tip end portion 62 a of the push bolt 62, and the raised tip portion 62 a causes the reaction tube 52 to pass through the spacer ring 64 and the heat-resistant resin ring 66. Is pressed from below in the direction of gravity, and the reaction tube 52 is moved upward in the direction of gravity to separate the reaction tube 52 from the lower container 56.

When operating the plurality of push bolts 62, the operation of each push bolt 62 is performed so that the opening portion of the furnace port flange 68 is even in the circumferential direction. For example, immediately after an operation to raise a certain push bolt 62, the push bolt 62 on the opposite side to the center of the open portion of the furnace port flange 68 (the angle from the center of the open portion of the furnace port flange 68 is 180 degrees). The push bolt 62) at the position is operated. By operating the push bolt 62 in this order, the reaction tube 52 can be raised while maintaining a state substantially parallel to the furnace port flange 68.

  In order to attach the reaction tube 52 to the lower container 56 after maintenance or the like is completed, the above operations are performed in the reverse order.

  In the embodiment described above, the push bolt 62 has been described as being operated by an operator. However, a device that rotates the push bolt 62 and raises the tip 62a of the push bolt 62 may be provided. In the present embodiment, the push bolt 62 is used as the separating means for moving the reaction tube 52 upward in the direction of gravity and separating the reaction tube 52 from the lower container 56. Along with the bolt 62, a power source such as an air cylinder or a motor may be used.

  FIG. 4 shows a portion of the substrate processing apparatus 200 according to the comparative example that corresponds to the main part of the present invention shown in FIG. As shown in FIG. 3, the substrate processing apparatus 200 does not have the push bolt 62 that the substrate processing apparatus 10 according to the embodiment of the present invention has. Therefore, after removing the reaction tube fixing ring 72, the operator lifts the reaction tube 52, so that the reaction tube 52 is removed from the lower container 56.

  In this case, the O-ring 60 made of perfluoro fluororubber is attached to the reaction tube 52 made of quartz, and the O-ring 60 is attached to the furnace port flange 68 made of metal, so that the reaction tube 52 and the furnace port flange 68 are attached. Is attached and it is difficult to remove the reaction tube 52. Further, when the operator lifts the reaction tube 52, the reaction tube 52 is inclined, and the flange 52a of the reaction tube 52 may be strongly struck against the furnace port flange 68 made of metal. In this case, there is a high possibility that the reaction tube 52 made of quartz, which is a material that is more easily broken than metal, is damaged. Further, when the reaction tube 52 is lifted in an inclined state, a strong force is applied to the portion of the reaction tube 52 and the furnace port flange 68 attached via the O-ring 60, and the reaction tube 52 or the furnace port flange 68 is applied. May be damaged. In addition, about the same part as the substrate processing apparatus 10 which concerns on embodiment, the same code | symbol is attached | subjected to FIG. 4, and the description is abbreviate | omitted.

  As described above, the present invention can be used for a substrate processing apparatus that etches the surface of a substrate such as a semiconductor wafer or a glass substrate, forms a thin film on the surface, or modifies the surface. .

1 is a perspective view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. It is sectional drawing which shows the processing furnace used for the substrate processing apparatus which concerns on embodiment of this invention. It is sectional drawing which shows the principal part of the processing furnace used for the substrate processing apparatus which concerns on embodiment of this invention, and shows the part enclosed by the dotted line A of FIG. It is sectional drawing which shows in detail the part corresponded to the principal part of this invention shown by FIG. 3 of the processing furnace used for the substrate processing apparatus which concerns on a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 30 Substrate support body 50 Reaction furnace 52 Reaction tube 54 Opening part 56 Lower container 58 Substrate processing chamber 60 O-ring 62 Push bolt 64 Spacer ring 66 Heat-resistant resin ring 68 Furnace port flange 70 Seal cap 74 Substrate processing container 150 substrate

Claims (2)

A reaction tube formed with an open portion downward in the direction of gravity;
A furnace port flange that is fixed to the reaction tube using a reaction tube fixing ring, and supports the reaction tube from below in the direction of gravity, and closes the opening.
A seal member disposed between the reaction tube and the furnace port flange;
Adjusting means for adjusting the pressing force to the seal member;
Have
The reaction tube forms at least a part of an upper portion located above the seal member;
The furnace port flange forms at least a part of a lower part located below the seal member,
The adjusting means includes a bolt that is screwed into one of the upper part and the lower part in a state in which the tip part can protrude and presses the other of the upper part and the lower part with the tip part. A substrate processing apparatus. A reaction tube in which an opening portion downward in the direction of gravity is formed, and a furnace port flange that is fixed to the reaction tube by using a reaction tube fixing ring and closes the opening portion while supporting the reaction tube from below in the direction of gravity And a seal member disposed between the reaction tube and the furnace port flange, wherein the reaction tube forms at least a part of an upper portion located above the seal member, and the furnace port The flange is a maintenance method for a substrate processing apparatus that forms at least a part of a lower portion located below the seal member,
By rotating a bolt screwed in a state where the tip can protrude into one of the upper part and the lower part and moving the bolt in the direction of gravity, the tip of the bolt becomes the upper part and the lower part. A maintenance method for a substrate processing apparatus, wherein the other part is pressed and the upper part is removed from the lower part.

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