JP2010010717A - 研磨剤および研磨方法 - Google Patents

研磨剤および研磨方法 Download PDF

Info

Publication number
JP2010010717A
JP2010010717A JP2009236024A JP2009236024A JP2010010717A JP 2010010717 A JP2010010717 A JP 2010010717A JP 2009236024 A JP2009236024 A JP 2009236024A JP 2009236024 A JP2009236024 A JP 2009236024A JP 2010010717 A JP2010010717 A JP 2010010717A
Authority
JP
Japan
Prior art keywords
polishing
abrasive
component
polished
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009236024A
Other languages
English (en)
Japanese (ja)
Inventor
Satoshi Takemiya
聡 竹宮
Yukie Mamaru
幸恵 真丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Seimi Chemical Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
AGC Seimi Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, AGC Seimi Chemical Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2009236024A priority Critical patent/JP2010010717A/ja
Publication of JP2010010717A publication Critical patent/JP2010010717A/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009236024A 2004-03-08 2009-10-13 研磨剤および研磨方法 Pending JP2010010717A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009236024A JP2010010717A (ja) 2004-03-08 2009-10-13 研磨剤および研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004063366 2004-03-08
JP2009236024A JP2010010717A (ja) 2004-03-08 2009-10-13 研磨剤および研磨方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004305238A Division JP2005294798A (ja) 2004-03-08 2004-10-20 研磨剤および研磨方法

Publications (1)

Publication Number Publication Date
JP2010010717A true JP2010010717A (ja) 2010-01-14

Family

ID=37859592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009236024A Pending JP2010010717A (ja) 2004-03-08 2009-10-13 研磨剤および研磨方法

Country Status (3)

Country Link
JP (1) JP2010010717A (zh)
CN (1) CN100468647C (zh)
TW (1) TW200535215A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015178476A1 (ja) * 2014-05-22 2015-11-26 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102101980B (zh) * 2009-12-18 2015-12-02 安集微电子（上海）有限公司 一种化学机械抛光液
US10647900B2 (en) * 2013-07-11 2020-05-12 Basf Se Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
JP6788988B2 (ja) * 2016-03-31 2020-11-25 株式会社フジミインコーポレーテッド 研磨用組成物
US11608451B2 (en) * 2019-01-30 2023-03-21 Versum Materials Us, Llc Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038883A1 (fr) * 2001-10-31 2003-05-08 Hitachi Chemical Co., Ltd. Fluide et procede de polissage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038883A1 (fr) * 2001-10-31 2003-05-08 Hitachi Chemical Co., Ltd. Fluide et procede de polissage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015178476A1 (ja) * 2014-05-22 2015-11-26 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法

Also Published As

Publication number Publication date
TW200535215A (en) 2005-11-01
CN100468647C (zh) 2009-03-11
CN1930664A (zh) 2007-03-14

Similar Documents

Publication Publication Date Title
EP1724819B1 (en) Polishing agent and polishing method
JP4576117B2 (ja) 研磨剤、その製造方法及び研磨方法
JP5472049B2 (ja) 化学機械研磨用研磨剤
EP1909312A1 (en) Abrasive and process for producing semiconductor integrated-circuit unit
US20050076579A1 (en) Bicine/tricine containing composition and method for chemical-mechanical planarization
JPWO2008132983A1 (ja) 研磨剤組成物および半導体集積回路装置の製造方法
US20070049025A1 (en) Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
JP4206233B2 (ja) 研磨剤および研磨方法
US20080171441A1 (en) Polishing compound and method for producing semiconductor integrated circuit device
US20080148652A1 (en) Compositions for chemical mechanical planarization of copper
JP2010010717A (ja) 研磨剤および研磨方法
JP2009272418A (ja) 研磨剤組成物および半導体集積回路装置の製造方法
WO2011152356A1 (ja) 研磨剤および研磨方法
US8551887B2 (en) Method for chemical mechanical planarization of a copper-containing substrate
JP2006191131A (ja) 化学機械研磨用研磨剤及び基板の研磨法
JP2006191132A (ja) 化学機械研磨用研磨剤及び基板の研磨法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091023

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091023

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120228

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120626