JP2010010478A - 光電変換装置、光電変換装置の製造方法及び撮像装置 - Google Patents
光電変換装置、光電変換装置の製造方法及び撮像装置 Download PDFInfo
- Publication number
- JP2010010478A JP2010010478A JP2008169181A JP2008169181A JP2010010478A JP 2010010478 A JP2010010478 A JP 2010010478A JP 2008169181 A JP2008169181 A JP 2008169181A JP 2008169181 A JP2008169181 A JP 2008169181A JP 2010010478 A JP2010010478 A JP 2010010478A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- forming
- conversion device
- layer
- upper electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008169181A JP2010010478A (ja) | 2008-06-27 | 2008-06-27 | 光電変換装置、光電変換装置の製造方法及び撮像装置 |
| US12/490,920 US8193542B2 (en) | 2008-06-27 | 2009-06-24 | Photoelectric apparatus and imaging apparatus including the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008169181A JP2010010478A (ja) | 2008-06-27 | 2008-06-27 | 光電変換装置、光電変換装置の製造方法及び撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010010478A true JP2010010478A (ja) | 2010-01-14 |
| JP2010010478A5 JP2010010478A5 (enExample) | 2011-03-17 |
Family
ID=41446921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008169181A Withdrawn JP2010010478A (ja) | 2008-06-27 | 2008-06-27 | 光電変換装置、光電変換装置の製造方法及び撮像装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8193542B2 (enExample) |
| JP (1) | JP2010010478A (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011155121A1 (ja) * | 2010-06-08 | 2011-12-15 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| KR101108517B1 (ko) * | 2010-02-01 | 2012-01-30 | 한국과학기술원 | 열구동 전자종이화면 장치 및 그 제조방법 |
| JP2012038784A (ja) * | 2010-08-03 | 2012-02-23 | Brother Ind Ltd | フォトダイオードアレイ、およびフォトダイオードアレイの製造方法 |
| KR20140020674A (ko) * | 2012-08-10 | 2014-02-19 | 엘지디스플레이 주식회사 | 유기발광소자 및 그 제조방법 |
| JP2015056554A (ja) * | 2013-09-12 | 2015-03-23 | ソニー株式会社 | 固体撮像素子および製造方法、並びに電子機器 |
| KR20150099730A (ko) * | 2012-12-26 | 2015-09-01 | 소니 주식회사 | 고체 촬상 소자 및 이것을 구비한 고체 촬상 장치 |
| WO2016185914A1 (ja) * | 2015-05-19 | 2016-11-24 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、固体撮像装置、電子機器、および半導体装置の製造方法 |
| KR20170104086A (ko) * | 2016-03-04 | 2017-09-14 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP2017174903A (ja) * | 2016-03-22 | 2017-09-28 | キヤノン株式会社 | 光電変換装置、及び撮像システム |
| JP2021527235A (ja) * | 2018-06-04 | 2021-10-11 | イソルグ | 画像センサ及びディスプレイスクリーンを備えたデバイス |
| JPWO2020188959A1 (ja) * | 2019-03-20 | 2021-10-14 | 株式会社ジャパンディスプレイ | 検出装置 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9123653B2 (en) * | 2009-07-23 | 2015-09-01 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
| WO2011018110A1 (en) * | 2009-08-12 | 2011-02-17 | X-Fab Semiconductor Foundries Ag | Method of manufacturing an organic light emitting diode by lift-off |
| TWI557875B (zh) * | 2010-07-19 | 2016-11-11 | 晶元光電股份有限公司 | 多維度發光裝置 |
| KR20120081505A (ko) * | 2011-01-11 | 2012-07-19 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| WO2012155142A1 (en) | 2011-05-12 | 2012-11-15 | Olive Medical Corporation | Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects |
| US9224770B2 (en) | 2012-04-26 | 2015-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor device and method |
| US9455288B2 (en) | 2012-05-21 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor structure to reduce cross-talk and improve quantum efficiency |
| US9516239B2 (en) | 2012-07-26 | 2016-12-06 | DePuy Synthes Products, Inc. | YCBCR pulsed illumination scheme in a light deficient environment |
| US10568496B2 (en) | 2012-07-26 | 2020-02-25 | DePuy Synthes Products, Inc. | Continuous video in a light deficient environment |
| BR112015001369A2 (pt) | 2012-07-26 | 2017-07-04 | Olive Medical Corp | sistema de câmera com sensor de imagem cmos monolítico de área mínima |
| CN105246394B (zh) | 2013-03-15 | 2018-01-12 | 德普伊新特斯产品公司 | 无输入时钟和数据传输时钟的图像传感器同步 |
| WO2014144986A1 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Scope sensing in a light controlled environment |
| WO2014145248A1 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Minimize image sensor i/o and conductor counts in endoscope applications |
| WO2014145008A2 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Viewing trocar with intergrated prism for use with angled endoscope |
| CA2906798A1 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Super resolution and color motion artifact correction in a pulsed color imaging system |
| US9777913B2 (en) | 2013-03-15 | 2017-10-03 | DePuy Synthes Products, Inc. | Controlling the integral light energy of a laser pulse |
| DE102013205714A1 (de) | 2013-03-28 | 2014-10-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organisches bauelement und herstellungsverfahren |
| WO2014156018A1 (ja) * | 2013-03-29 | 2014-10-02 | パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカ | 推定装置、推定方法、集積回路およびプログラム |
| KR102197069B1 (ko) | 2014-02-04 | 2020-12-30 | 삼성전자 주식회사 | 이미지 센서 및 이미지 처리 장치 |
| EP3119265B1 (en) | 2014-03-21 | 2019-09-11 | DePuy Synthes Products, Inc. | Card edge connector for an imaging sensor |
| CN104795433B (zh) * | 2015-05-08 | 2016-07-13 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
| US10636826B2 (en) * | 2015-10-26 | 2020-04-28 | Sony Semiconductor Solutions Corporation | Solid-state imaging device, manufacturing method thereof, and electronic device |
| DE102015225797B3 (de) * | 2015-12-17 | 2017-05-04 | Robert Bosch Gmbh | Optischer Detektor |
| US10038033B2 (en) * | 2015-12-29 | 2018-07-31 | Industrial Technology Research Institute | Image sensor |
| US10038019B2 (en) | 2015-12-29 | 2018-07-31 | Industrial Technology Research Institute | Image sensor and manufacturing method thereof |
| DE112017006908T5 (de) * | 2017-01-24 | 2019-10-02 | Sony Semiconductor Solutions Corporation | Lichtempfangselement, verfahren zum produzieren eines lichtempfangselements, bildgebungselement und elektronische vorrichtung |
| CN106784389A (zh) * | 2017-02-17 | 2017-05-31 | 京东方科技集团股份有限公司 | 一种复合透明电极、有机发光二极管及其制备方法 |
| US12185018B2 (en) | 2019-06-28 | 2024-12-31 | Apple Inc. | Stacked electromagnetic radiation sensors for visible image sensing and infrared depth sensing, or for visible image sensing and infrared image sensing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4868664A (en) * | 1984-05-04 | 1989-09-19 | Energy Conversion Devices, Inc. | Contact type image replication employing a light piping faceplate |
| JPH02275670A (ja) * | 1989-01-18 | 1990-11-09 | Canon Inc | 光電変換装置および画像読取装置 |
| DE4005494C2 (de) * | 1989-02-21 | 1994-10-20 | Canon Kk | Halbleiter-Vorrichtung sowie Bildlesegerät mit dieser Halbleitervorrichtung mit optimierten elektrischen Eigenschaften |
| AU2492399A (en) | 1998-02-02 | 1999-08-16 | Uniax Corporation | Image sensors made from organic semiconductors |
| KR100717667B1 (ko) * | 2000-09-18 | 2007-05-11 | 신닛뽄세이테쯔 카부시키카이샤 | 반도체용 본딩 와이어 및 그 제조 방법 |
| US6765187B2 (en) * | 2001-06-27 | 2004-07-20 | Canon Kabushiki Kaisha | Imaging apparatus |
| JP2005311315A (ja) | 2004-03-23 | 2005-11-04 | Matsushita Electric Ind Co Ltd | 有機情報読み取りセンサとその製造方法、及びそれを用いた情報読み取り装置 |
| JP2006049834A (ja) * | 2004-06-30 | 2006-02-16 | Fuji Film Microdevices Co Ltd | 固体撮像素子およびその製造方法 |
| US7410906B2 (en) * | 2004-07-16 | 2008-08-12 | Fujifilm Corporation | Functional device and method for producing the same, and image pickup device and method for producing the same |
| JP2008277511A (ja) * | 2007-04-27 | 2008-11-13 | Fujifilm Corp | 撮像素子及び撮像装置 |
| JP2009088292A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 光電変換素子、撮像素子及び光センサー |
-
2008
- 2008-06-27 JP JP2008169181A patent/JP2010010478A/ja not_active Withdrawn
-
2009
- 2009-06-24 US US12/490,920 patent/US8193542B2/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101108517B1 (ko) * | 2010-02-01 | 2012-01-30 | 한국과학기술원 | 열구동 전자종이화면 장치 및 그 제조방법 |
| WO2011155121A1 (ja) * | 2010-06-08 | 2011-12-15 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| JP2012038784A (ja) * | 2010-08-03 | 2012-02-23 | Brother Ind Ltd | フォトダイオードアレイ、およびフォトダイオードアレイの製造方法 |
| KR101936774B1 (ko) * | 2012-08-10 | 2019-01-09 | 엘지디스플레이 주식회사 | 유기발광소자 및 그 제조방법 |
| KR20140020674A (ko) * | 2012-08-10 | 2014-02-19 | 엘지디스플레이 주식회사 | 유기발광소자 및 그 제조방법 |
| KR20150099730A (ko) * | 2012-12-26 | 2015-09-01 | 소니 주식회사 | 고체 촬상 소자 및 이것을 구비한 고체 촬상 장치 |
| KR102163307B1 (ko) * | 2012-12-26 | 2020-10-08 | 소니 주식회사 | 고체 촬상 소자 및 이것을 구비한 고체 촬상 장치 |
| JP2015056554A (ja) * | 2013-09-12 | 2015-03-23 | ソニー株式会社 | 固体撮像素子および製造方法、並びに電子機器 |
| US9666643B2 (en) | 2013-09-12 | 2017-05-30 | Sony Semiconductor Solutions Corporation | Solid state image sensor, production method thereof and electronic device |
| US12035549B2 (en) | 2013-09-12 | 2024-07-09 | Sony Semiconductor Solutions Corporation | Solid state image sensor, production method thereof and electronic device |
| US10622563B2 (en) | 2015-05-19 | 2020-04-14 | Sony Semiconductor Solutions Corporation | Semiconductor device, solid-state imaging device, electronic apparatus, and manufacturing method of semiconductor device |
| WO2016185914A1 (ja) * | 2015-05-19 | 2016-11-24 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、固体撮像装置、電子機器、および半導体装置の製造方法 |
| KR20170104086A (ko) * | 2016-03-04 | 2017-09-14 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102610027B1 (ko) * | 2016-03-04 | 2023-12-11 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP2017174903A (ja) * | 2016-03-22 | 2017-09-28 | キヤノン株式会社 | 光電変換装置、及び撮像システム |
| JP2021527235A (ja) * | 2018-06-04 | 2021-10-11 | イソルグ | 画像センサ及びディスプレイスクリーンを備えたデバイス |
| JP7320006B2 (ja) | 2018-06-04 | 2023-08-02 | イソルグ | 画像センサ及びディスプレイスクリーンを備えたデバイス |
| JPWO2020188959A1 (ja) * | 2019-03-20 | 2021-10-14 | 株式会社ジャパンディスプレイ | 検出装置 |
| JP7220775B2 (ja) | 2019-03-20 | 2023-02-10 | 株式会社ジャパンディスプレイ | 検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8193542B2 (en) | 2012-06-05 |
| US20090322923A1 (en) | 2009-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010010478A (ja) | 光電変換装置、光電変換装置の製造方法及び撮像装置 | |
| JP5087304B2 (ja) | 固体撮像素子の製造方法 | |
| US8298855B2 (en) | Photoelectric conversion device, imaging device, and process for producing the photoelectric conversion device | |
| JP4911445B2 (ja) | 有機と無機のハイブリッド光電変換素子 | |
| JP4802286B2 (ja) | 光電変換素子及び撮像素子 | |
| US7659499B2 (en) | Photoelectric conversion device and solid-state imaging device | |
| JP4961111B2 (ja) | 光電変換膜積層型固体撮像素子とその製造方法 | |
| JP2005303266A (ja) | 撮像素子、その電場印加方法および印加した素子 | |
| JP2007067194A (ja) | 有機光電変換素子、および積層型光電変換素子 | |
| US9040973B2 (en) | Organic image sensor and method of producing the same | |
| JP2008258421A (ja) | 有機光電変換素子及びその製造方法 | |
| JP2011233908A (ja) | 光電変換素子及び撮像素子 | |
| JP5492939B2 (ja) | 固体撮像素子の製造方法 | |
| JP2010062380A (ja) | 光電変換装置,光電変換装置の製造方法及び撮像装置 | |
| JP2007324405A (ja) | 固体撮像素子 | |
| JP4719531B2 (ja) | 光電変換素子及び撮像素子 | |
| JP2006237351A (ja) | 光電変換膜、光電変換素子及び光電変換膜の製造方法 | |
| JP2007059483A (ja) | 光電変換素子、撮像素子、並びに、光電変換素子および撮像素子に電場を印加する方法 | |
| JP2008004899A (ja) | 固体撮像装置 | |
| JP2012009910A (ja) | 固体撮像素子 | |
| JP2007073742A (ja) | 光電変換素子及び固体撮像素子 | |
| JP4815233B2 (ja) | 固体撮像素子、その駆動方法、及び固体撮像素子の製造方法 | |
| JP2007088440A (ja) | 光電変換素子及び撮像素子 | |
| JP2007208840A (ja) | 固体撮像素子 | |
| JP2007080936A (ja) | 光電変換素子及び固体撮像素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110202 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20111216 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20120522 |