JP2010007161A5 - - Google Patents

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Publication number
JP2010007161A5
JP2010007161A5 JP2008170806A JP2008170806A JP2010007161A5 JP 2010007161 A5 JP2010007161 A5 JP 2010007161A5 JP 2008170806 A JP2008170806 A JP 2008170806A JP 2008170806 A JP2008170806 A JP 2008170806A JP 2010007161 A5 JP2010007161 A5 JP 2010007161A5
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JP
Japan
Prior art keywords
electrode
discharge
discharge circuit
discharge current
electrodes
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JP2008170806A
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English (en)
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JP5429772B2 (ja
JP2010007161A (ja
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Priority claimed from JP2008170806A external-priority patent/JP5429772B2/ja
Priority to JP2008170806A priority Critical patent/JP5429772B2/ja
Priority to CN2009801254002A priority patent/CN102084024B/zh
Priority to KR1020117002276A priority patent/KR101298167B1/ko
Priority to US13/001,454 priority patent/US9210788B2/en
Priority to PCT/JP2009/060988 priority patent/WO2010001723A1/ja
Priority to TW098120658A priority patent/TWI500799B/zh
Publication of JP2010007161A publication Critical patent/JP2010007161A/ja
Publication of JP2010007161A5 publication Critical patent/JP2010007161A5/ja
Publication of JP5429772B2 publication Critical patent/JP5429772B2/ja
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Description

上記課題を解決するために、本発明の電源装置は、プラズマに接触する一対の電極に対して所定の周波数で交互に極性を反転させて所定の電位を印加し、一の電極から他の電極に交互に放電電流を流す第１の放電回路と、前記一対の電極のうち、前記第１の放電回路により放電電流が流れ込む他の電極とグランドとの間で所定の電位を印加し、グランドから前記他の電極に放電電流を流す第２の放電回路と、を備えることを特徴とする。

Claims (1)

  1. プラズマに接触する一対の電極に対して所定の周波数で交互に極性を反転させて所定の
    電位を印加し、一の電極から他の電極に交互に放電電流を流す第１の放電回路と、
    前記一対の電極のうち、前記第１の放電回路により放電電流が流れ込む他の電極とグラ
    ンドとの間で所定の電位を印加し、グランドから前記他の電極に放電電流を流す第２の放電回路と、を備えることを特徴とする電源装置。
JP2008170806A 2008-06-30 2008-06-30 電源装置 Active JP5429772B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008170806A JP5429772B2 (ja) 2008-06-30 2008-06-30 電源装置
PCT/JP2009/060988 WO2010001723A1 (ja) 2008-06-30 2009-06-17 電源装置
KR1020117002276A KR101298167B1 (ko) 2008-06-30 2009-06-17 전원 장치
US13/001,454 US9210788B2 (en) 2008-06-30 2009-06-17 Power supply apparatus
CN2009801254002A CN102084024B (zh) 2008-06-30 2009-06-17 电源装置
TW098120658A TWI500799B (zh) 2008-06-30 2009-06-19 Power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008170806A JP5429772B2 (ja) 2008-06-30 2008-06-30 電源装置

Publications (3)

Publication Number Publication Date
JP2010007161A JP2010007161A (ja) 2010-01-14
JP2010007161A5 true JP2010007161A5 (ja) 2011-06-30
JP5429772B2 JP5429772B2 (ja) 2014-02-26

Family

ID=41465824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008170806A Active JP5429772B2 (ja) 2008-06-30 2008-06-30 電源装置

Country Status (6)

Country Link
US (1) US9210788B2 (ja)
JP (1) JP5429772B2 (ja)
KR (1) KR101298167B1 (ja)
CN (1) CN102084024B (ja)
TW (1) TWI500799B (ja)
WO (1) WO2010001723A1 (ja)

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US11508554B2 (en) 2019-01-24 2022-11-22 Applied Materials, Inc. High voltage filter assembly
CN109811324B (zh) * 2019-03-14 2021-02-09 哈尔滨工业大学 基于异质双靶高功率脉冲磁控溅射制备掺杂类薄膜的装置及方法
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US11901157B2 (en) 2020-11-16 2024-02-13 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US11798790B2 (en) 2020-11-16 2023-10-24 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US11495470B1 (en) 2021-04-16 2022-11-08 Applied Materials, Inc. Method of enhancing etching selectivity using a pulsed plasma
US11948780B2 (en) 2021-05-12 2024-04-02 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
US11791138B2 (en) 2021-05-12 2023-10-17 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
US11967483B2 (en) 2021-06-02 2024-04-23 Applied Materials, Inc. Plasma excitation with ion energy control
US20220399185A1 (en) 2021-06-09 2022-12-15 Applied Materials, Inc. Plasma chamber and chamber component cleaning methods
US11810760B2 (en) 2021-06-16 2023-11-07 Applied Materials, Inc. Apparatus and method of ion current compensation
US11569066B2 (en) 2021-06-23 2023-01-31 Applied Materials, Inc. Pulsed voltage source for plasma processing applications
US11776788B2 (en) 2021-06-28 2023-10-03 Applied Materials, Inc. Pulsed voltage boost for substrate processing
US11476090B1 (en) 2021-08-24 2022-10-18 Applied Materials, Inc. Voltage pulse time-domain multiplexing
US11694876B2 (en) 2021-12-08 2023-07-04 Applied Materials, Inc. Apparatus and method for delivering a plurality of waveform signals during plasma processing
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