GB2497246A - Electrochemically powered integrated circuit package - Google Patents

Electrochemically powered integrated circuit package Download PDF

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Publication number
GB2497246A
GB2497246A GB1305369.9A GB201305369A GB2497246A GB 2497246 A GB2497246 A GB 2497246A GB 201305369 A GB201305369 A GB 201305369A GB 2497246 A GB2497246 A GB 2497246A
Authority
GB
United Kingdom
Prior art keywords
package
ics
electrodes
integrated circuit
circuit package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1305369.9A
Other versions
GB2497246B (en
GB201305369D0 (en
Inventor
Thomas J Brunschwiler
Bruno Michel
Patrick Ruch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB201305369D0 publication Critical patent/GB201305369D0/en
Publication of GB2497246A publication Critical patent/GB2497246A/en
Application granted granted Critical
Publication of GB2497246B publication Critical patent/GB2497246B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49593—Battery in combination with a leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/04—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
    • H01M8/04007—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids related to heat exchange
    • H01M8/04029—Heat exchange using liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/04—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
    • H01M8/04276—Arrangements for managing the electrolyte stream, e.g. heat exchange
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H01M8/1097—Fuel cells applied on a support, e.g. miniature fuel cells deposited on silica supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/18—Regenerative fuel cells, e.g. redox flow batteries or secondary fuel cells
    • H01M8/184—Regeneration by electrochemical means
    • H01M8/188—Regeneration by electrochemical means by recharging of redox couples containing fluids; Redox flow type batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Abstract

The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.
GB1305369.9A 2010-09-22 2011-08-04 Electrochemically powered integrated circuit package Active GB2497246B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10178367 2010-09-22
PCT/IB2011/053477 WO2012038843A1 (en) 2010-09-22 2011-08-04 Electrochemically powered integrated circuit package

Publications (3)

Publication Number Publication Date
GB201305369D0 GB201305369D0 (en) 2013-05-08
GB2497246A true GB2497246A (en) 2013-06-05
GB2497246B GB2497246B (en) 2014-07-09

Family

ID=44645154

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1305369.9A Active GB2497246B (en) 2010-09-22 2011-08-04 Electrochemically powered integrated circuit package

Country Status (5)

Country Link
JP (1) JP5815034B2 (en)
CN (1) CN103119713B (en)
DE (1) DE112011102577B4 (en)
GB (1) GB2497246B (en)
WO (1) WO2012038843A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378026A (en) * 2012-04-16 2013-10-30 北京大学 Three-dimensional packaging method having heat radiation function
JP6160128B2 (en) * 2013-03-05 2017-07-12 日本電気株式会社 3D stacked semiconductor device
FR3015777A1 (en) * 2013-12-24 2015-06-26 Rhodia Operations BATTERY, REDOXFLOW, TRANSFORMING CHEMICAL ENERGY IN REVERSIBLE ELECTRICITY
DE102014216953A1 (en) * 2014-08-26 2016-03-03 Siemens Aktiengesellschaft Apparatus and method for cooling a provided for a redox flow battery power electronics
EP4113678A1 (en) * 2021-07-01 2023-01-04 Micro Electrochemical Technologies S.L. Redox microfluidic energy storage system and method
US11909449B1 (en) 2023-05-31 2024-02-20 Microsoft Technology Licensing, Llc Liquid powered and cooled microfluidics photonics architecture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030134172A1 (en) * 2002-01-11 2003-07-17 Grande Wendy C. Integrated fuel cell and electrochemical power system employing the same
US20090286108A1 (en) * 2008-05-15 2009-11-19 Samsung Electronics Co., Ltd. Hybrid electronic device including semiconductor chip and fuel cell, method of fabricating the same and system having the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229451A (en) * 1990-02-02 1991-10-11 Hitachi Ltd Semiconductor integrated circuit device
US5300370A (en) * 1992-11-13 1994-04-05 Ballard Power Systems Inc. Laminated fluid flow field assembly for electrochemical fuel cells
JP2003157883A (en) * 2001-11-21 2003-05-30 Sumitomo Electric Ind Ltd Electrolyte regenerating method for vanadium redox battery
US7557433B2 (en) * 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
EP1905117B1 (en) * 2005-06-20 2019-07-24 NewSouth Innovations Pty Limited Improved perfluorinated membranes and improved electrolytes for redox cells and batteries
EP1961063A2 (en) 2005-12-14 2008-08-27 Wispi.net Integrated self contained sensor assembly
EP1798799B1 (en) 2005-12-16 2008-09-24 STMicroelectronics S.r.l. Fuel cell planarly integrated on a monocrystalline silicon chip and process of fabrication
WO2008133655A2 (en) 2006-11-14 2008-11-06 Richard Clarke Micro gap flow through electrochemical devices with self adjusting reactive surfaces
TWI423403B (en) * 2007-09-17 2014-01-11 Ibm Integrated circuit stack

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030134172A1 (en) * 2002-01-11 2003-07-17 Grande Wendy C. Integrated fuel cell and electrochemical power system employing the same
US20090286108A1 (en) * 2008-05-15 2009-11-19 Samsung Electronics Co., Ltd. Hybrid electronic device including semiconductor chip and fuel cell, method of fabricating the same and system having the same

Also Published As

Publication number Publication date
GB2497246B (en) 2014-07-09
DE112011102577T5 (en) 2013-05-08
WO2012038843A1 (en) 2012-03-29
DE112011102577B4 (en) 2015-02-12
GB201305369D0 (en) 2013-05-08
CN103119713B (en) 2016-01-20
JP5815034B2 (en) 2015-11-17
CN103119713A (en) 2013-05-22
JP2013541841A (en) 2013-11-14

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Effective date: 20140724