JPH03229451A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce a whole packaging area by mounting an article electrically connected to a semiconductor circuit device on the surface or the interior of a single package in which at least one semiconductor circuit device is encapsulated. CONSTITUTION:A semiconductor integrated circuit 30 is connected to a plurality of bonding wires 40 and is provided in a package 10, and photovoltaic cell 50 is fixed onto a principal surface of the package 10 in the state where it is exposed to the outside, using a desired adhesive and is connected to a power supply terminal 20a for supplying operation power to the semiconductor integrated circuit device 30 among a plurality of external connection terminals 20 through a printed wiring structure 60. The operation power of the semiconductor integrated circuit device 30 is supplied with power generated in the photovoltaic cell 50 by irradiating the photovoltaic cell 50 with external light 70. Thus, a package area is sharply reduced, compared with a case where the semiconductor integrated circuit device 30 and the photovoltaic cell 50 are mounted separately on desired packaging board.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and in particular to a technique that is effective when applied to miniaturization of a semiconductor integrated circuit device including accessory parts.

2. Prior Art] For example, in a semiconductor integrated circuit device having a structure in which electrical circuits with desired functions are highly integrated inside one single conductor piece using the well-known IJ lithography technology, There is a demand for miniaturization and multifunctionality.

In response to such demands, techniques disclosed in, for example, Japanese Patent Laid-Open No. 55-61046 have been proposed.

In other words, by dividing the internal space of a single package into multiple areas and encapsulating multiple IC chips with different functions in each area, higher density and multi-functionality of semiconductor integrated circuit devices can be achieved. It is intended to be used.

[Problem to be solved by the invention]

However, the above-mentioned prior art makes no mention of miniaturization of the overall system including the semiconductor integrated circuit element and the components that supply operating power to the element.

For this reason, for example, in applications for mobile terminals such as mobile phones, it is necessary to separately arrange the semiconductor integrated circuit element to be mounted and the power supply part that supplies power to the semiconductor integrated circuit element. Therefore, even if only the semiconductor integrated circuit element part is miniaturized, the overall mounting area becomes larger than necessary due to the separate mounting of these semiconductor integrated circuit elements and the power supply section, which poses the problem of 5). .

In addition, in the conventional technology, all of the multiple IC chips are enclosed and hidden within the package, so for example, it is necessary to replace parts such as batteries, use photovoltaic cells to provide operating power, and connect external parts and parts. For example, light/
There is a problem in that it is not possible to transfer or detect energy such as magnetism, heat, etc.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a single-conductor integrated circuit device that can reduce the overall mounting area including a semiconductor integrated circuit element and parts electrically connected to the semiconductor integrated circuit element. be.

Another object of the present invention is to provide a semiconductor integrated circuit device that is self-sufficient in operating power and can continuously operate autonomously.

Another object of the present invention is to provide a semiconductor integrated circuit device in which maintenance work by replacing parts attached to semiconductor integrated circuit elements is easy.

The above and other objects and novel features of the present invention will be apparent from the description herein and the accompanying drawings.

Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, the semiconductor integrated circuit device according to the present invention has components electrically connected to the semiconductor integrated circuit element mounted on the surface or inside of a single package in which at least one semiconductor integrated circuit element is encapsulated. It is.

2 Functions 2 According to the semiconductor integrated circuit device of the present invention described above, the semiconductor integrated circuit device including the components can be connected by appropriately routing the wiring structure connecting the semiconductor integrated circuit element and the components, for example, on the surface or inside of the package. The mounting area of the element can be reduced.

For example, by mounting a component consisting of a photovoltaic cell so that it is exposed to the outside on the surface of the package, the operating power of the semiconductor integrated circuit element can be self-sufficient by using the electric power obtained by irradiating the photovoltaic cell with external light. Therefore, the semiconductor integrated circuit device can continuously operate independently.

In addition, for example, by integrally mounting components consisting of secondary batteries or secondary batteries on the surface of the package so as to expose them to the outside, maintenance work such as replacing the secondary batteries or secondary batteries can be facilitated. can be done.

Embodiment 1] Hereinafter, a semiconductor integrated circuit device that is an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an external perspective view schematically showing an example of the configuration of a semiconductor integrated circuit device according to an embodiment of the present invention, and FIG. 2 shows a portion indicated by the line ■-■ in FIG. FIG.

The semiconductor integrated circuit device A of this embodiment includes a package 10 made of a desired insulator, and a plurality of external connection terminals 20 arranged to protrude to the outside of the pan cage 10.

In the package IO, a semiconductor integrated circuit element 30 having a desired function is housed inside a recess 10a carved on the front side of the pancake IO, and is sealed with a lid, resin, etc. (not shown). ing.

This semiconductor integrated circuit element 30 is connected to a plurality of external connection terminals 20 via, for example, a plurality of bonding wires 40 and a wiring structure (not shown) provided inside the package 10, and is connected to a plurality of external connection terminals 20 for operation between the semiconductor integrated circuit element 30 and the outside. It has a structure in which signals and operating power are exchanged.

In this case, the photovoltaic cell 50 is fixed to the other main surface of the package 10 with a desired adhesive or the like in an exposed state, and the photovoltaic cell 50 is fixed to the other main surface of the package 10 via a printed wiring structure 60 formed in advance on the main surface. , multiple external connection terminals 2
0 is connected to the IF source terminal 20a which supplies operating power to the semiconductor integrated circuit element 30.

The operating power of the semiconductor integrated circuit element 30 is provided by the power generated in the photovoltaic cell 50 by irradiating the photovoltaic cell 50 with the external light 70 .

2, in this embodiment, together with the semiconductor integrated circuit element 30 sealed inside the package 10, the photovoltaic cell 50 is mounted on the outer surface of the package 10, and the photovoltaic cell 50 and the semiconductor integrated circuit element For example, the semiconductor integrated circuit element 30 and the photovoltaic cell 5
The mounting area can be significantly reduced compared to the case where the 0 and 0 are individually mounted on a desired mounting board.

Furthermore, since the operating power of the semiconductor integrated circuit element 30 is self-sufficiently provided by the power obtained by irradiating the photovoltaic cell 50 with the external light 70, the semiconductor integrated circuit device A can continuously operate independently. becomes possible.

As a result, for example, by mounting the semiconductor integrated circuit device A in a mobile communication terminal, etc., the mobile communication terminal itself can be significantly downsized, and a special power source is not required to operate the mobile communication terminal. Therefore, operating costs of mobile communication terminals can be reduced.

Alternatively, instead of the photovoltaic cell 50, a desired sensor may be mounted on the package 10, and the photovoltaic cell 50 may be mounted on the printed wiring structure 6.
0 to the desired external connection terminal 2 other than the power supply terminal 20a.
By connecting it to 0, the mounting area of the circuit configuration consisting of the sensor and the semiconductor integrated circuit element 30 can be reduced.

[Embodiment 2] FIG. 3 is an external perspective view schematically showing an example of the configuration of a semiconductor integrated circuit device B which is another embodiment of the present invention, and FIG. FIG. 2 is a schematic cross-sectional view schematically showing a portion indicated by -rV.

In the case of this second embodiment, in the package 10, a recess 1[11b is carved in the main surface opposite to the recess 10a in which the semiconductor integrated circuit element 30 is sealed, and inside the recess 10b, for example, - Secondary battery or secondary battery 8
The structure is equipped with 0.

That is, the package lO in which the recessed portion 10b is carved
A wiring structure 61 and a wiring structure 62 connected to the power supply terminal 20a that supplies operating power to the semiconductor integrated circuit element 30 are provided on the main surface of the semiconductor integrated circuit element 30.

In this case, one end of one wiring structure 62 is the power supply terminal 20a.
The other end extends to the bottom of the recess 10b. Further, one end of the other wiring structure 61 is connected to the power supply terminal 20H, and the other end is in contact with the upper center of the battery 80 housed inside the recess 10b.

By sandwiching the battery 80 between these wiring structures 61 and 62, the wiring structure is completed! 61 and 6
2 and the battery 80, and the elasticity of the end of the wiring structure 61 that abuts the center of the upper part of the recess 10b allows the battery 80 to be stably held in the recess 10b in a detachable manner. It is something.

As described above, in the case of the second embodiment, together with the single conductor integrated circuit element 30 sealed inside the package 10, the battery 8 that supplies operating power to the semiconductor integrated circuit element 30 is installed.
0 is mounted in a part of the package 10 in a state exposed to the outside, and the battery 80 and the power terminal 20a are connected by the wiring structures 61 and 62 routed inside the package 10. For example, battery 80. Compared to the case where the semiconductor integrated circuit element 30 and the semiconductor integrated circuit element 30 are individually mounted, the mounting area for both can be significantly reduced, and the battery 80 can be easily replaced.

As a result, for example, semiconductor integrated circuit devices such as mobile communication terminals can be used! By implementing A, the mobile communication terminal itself can be significantly downsized, and maintenance and management of the mobile communication terminal can be easily performed.

[Embodiment 3] FIG. 5 is a schematic cross-sectional view schematically showing an example of the configuration of a semiconductor integrated circuit device C which is still another embodiment of the present invention.

In the case of this third embodiment, in the package 10, the photovoltaic cell 51 is housed inside the recess 10C formed on the main surface opposite to the recess 10a in which the semiconductor integrated circuit element 30 is sealed, and the transparent body 90 is It is designed to be sealed by.

Further, this photovoltaic cell 51 is connected to a power terminal 20a among the plurality of external connection terminals 20 by a bonding wire 41.

With such a configuration, the photovoltaic cell 51 is housed inside the package 10, and the semiconductor integrated circuit element 30
It is possible to reduce the mounting area of the photovoltaic cell 51, etc., and further downsize the semiconductor integrated circuit device C, and since the photovoltaic cell 51 is protected by the transparent body 90, the photovoltaic cell 51, the semiconductor integrated circuit element 30, etc. Improved operational reliability and durability.

Further, the operating power of the semiconductor integrated circuit element 30 can be covered by the power obtained by the photovoltaic cell 51 by the irradiation of the external light 70, and the semiconductor integrated circuit device A can continuously operate independently. Become.

[Embodiment 4] FIG. 6 is a sectional view schematically showing an example of the configuration of a semiconductor integrated circuit device according to another embodiment of the present invention.

The fourth embodiment differs from the third embodiment in that a convex lens 91 is provided in place of the transparent body 90 described above.

That is, the diameter of this convex lens 91 is set to be sufficiently larger than the width of the light receiving area of the photovoltaic cell 52, and
The photovoltaic cell 52 is arranged at a position where the external light 70 is converged by the convex lens 91.

Thereby, more electric power can be obtained than when the photovoltaic cells 5 and 2 are used alone, and there are advantages such as, for example, the circuit scale of the semiconductor integrated circuit element 30 can be made larger.

As a result, for example, by installing a semiconductor integrated circuit device in a mobile communication terminal, it is possible to improve the performance of the mobile communication terminal, such as the transmission output.

Moreover, when a photosensor is mounted instead of the photocell 52, the detection sensitivity of the photosensor is improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, components include not only photocells and batteries that supply operating power to semiconductor integrated circuit elements, but also semiconductor integrated circuit elements that convert light, magnetism, heat, distortion, and other physical quantities into electrical signals. It may also be a desired sensor that provides the information.

Further, the structure of the semiconductor integrated circuit device is not limited to those exemplified in Examples 1 to 4 above, and may be, for example, a structure in which a plurality of semiconductor integrated circuit elements are sealed inside a package. .

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

That is, according to the single conductor integrated circuit device of the present invention,
Because it has a structure in which components electrically connected to the semiconductor integrated circuit element are mounted on the surface or inside of a single package in which at least one semiconductor integrated circuit element is encapsulated, for example, the surface or inside of the package is In this case, the mounting area of the semiconductor integrated circuit element including the components can be reduced by appropriately routing the wiring structure that connects the semiconductor integrated circuit element and the components.

For example, by mounting a component consisting of a photovoltaic cell so that it is exposed to the outside on the surface of the package, the operating power of the semiconductor integrated circuit element can be self-sufficient by using the electric power obtained by irradiating the photovoltaic cell with external light. Therefore, the semiconductor integrated circuit device can continuously operate independently.

In addition, for example, by integrally mounting a component consisting of a secondary battery or a secondary battery so that it is exposed to the outside on the surface of the pancage, maintenance work such as replacing the secondary battery or secondary battery is facilitated. can be done.

[Brief explanation of drawings]

FIG. 1 is an external perspective view schematically showing an example of the configuration of a semiconductor integrated circuit device that is an embodiment of the present invention, and FIG. 2 is a schematic cross-section of the portion indicated by the line ]-■ in FIG. 1. 3 is an external perspective view schematically showing an example of the configuration of a semiconductor integrated circuit device according to another embodiment of the present invention, and FIG. 4 is a portion indicated by line IV-IV in FIG. 3. FIG. 5 is a schematic cross-sectional view schematically showing an example of the configuration of a semiconductor integrated circuit device according to another embodiment of the present invention; FIG. FIG. 3 is a cross-sectional view schematically showing an example of the configuration of a semiconductor integrated circuit device according to another embodiment of the present invention. 10...Package, lOa~IOC...Concavity, 2
0...External connection terminal, 20a...Power terminal, 30.
...Semiconductor integrated circuit element, 40°41...Bonding wire, 50.51.52...Photovoltaic cell (parts), 6
0...Printed wiring structure, 61.62...Wiring structure, 70...Outside light, 80...Battery (parts), 90...
・Transparent body, 91... Convex lens, A, B, C, D...
Semiconductor integrated circuit device.

Claims (1)

[Claims] 1. A semiconductor integrated circuit in which components electrically connected to the semiconductor integrated circuit element are mounted on or inside a single package in which at least one semiconductor integrated circuit element is encapsulated. Device. 2. The semiconductor integrated circuit device according to claim 1, wherein the component is a photovoltaic cell that supplies power to the semiconductor integrated circuit device. 3. The semiconductor integrated circuit device according to claim 1, wherein the component is a primary battery or a secondary battery that supplies power to the semiconductor integrated circuit device. 4. The semiconductor integrated circuit device according to claim 1, wherein the component is a conversion element that converts a desired physical quantity into an electrical signal and provides the electrical signal to the semiconductor integrated circuit element. 5. The semiconductor integrated circuit device according to claim 1, 2 or 4, wherein a convex lens for converging external light is provided in a part of the package, and the component is located at a convergence portion of the external light by the convex lens. 6. The semiconductor integrated circuit device according to claim 1, 2, 3 or 5, wherein the semiconductor integrated circuit device is installed in a mobile communication terminal.