JP2009545878A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009545878A5 JP2009545878A5 JP2009522771A JP2009522771A JP2009545878A5 JP 2009545878 A5 JP2009545878 A5 JP 2009545878A5 JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009545878 A5 JP2009545878 A5 JP 2009545878A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- particulate material
- substrate
- thin film
- embedding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (4)
- 電子デバイスの製造方法であって、
ａ）少なくとも１つのプラスチック材料を含む基板を用意する工程と、
ｂ）微粒子材料を前記基板の少なくとも１つの表面内に埋め込む工程と、
ｃ）前記微粒子材料を有する前記表面上で薄膜電子デバイスを形成する工程と、
を含む、方法。 - ｄ）前記微粒子材料を前記基板の第２の表面内に埋め込む工程と、
ｅ）前記埋め込まれた微粒子材料を有する前記第２の表面上に薄膜電子デバイスを形成する工程と、
をさらに含む、請求項１記載の方法。 - 前記電子デバイスは１つまたは複数の薄膜トランジスタを含む、請求項１記載の方法。
- 前記プラスチック材料は実質的に透明である、請求項１記載の方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/461,080 US7678701B2 (en) | 2006-07-31 | 2006-07-31 | Flexible substrate with electronic devices formed thereon |
| PCT/US2007/016085 WO2008016479A1 (en) | 2006-07-31 | 2007-07-16 | Flexible substrate with electronic devices formed thereon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009545878A JP2009545878A (ja) | 2009-12-24 |
| JP2009545878A5 true JP2009545878A5 (ja) | 2011-09-08 |
Family
ID=38669806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009522771A Pending JP2009545878A (ja) | 2006-07-31 | 2007-07-16 | 電子デバイスが形成されたフレキシブル基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7678701B2 (ja) |
| EP (1) | EP2047513A1 (ja) |
| JP (1) | JP2009545878A (ja) |
| TW (1) | TW200814333A (ja) |
| WO (1) | WO2008016479A1 (ja) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7977170B2 (en) * | 2006-10-03 | 2011-07-12 | Eastman Kodak Company | Flexible substrate with electronic devices and traces |
| US7913381B2 (en) * | 2006-10-26 | 2011-03-29 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| KR101408510B1 (ko) * | 2007-05-18 | 2014-06-17 | 삼성전자주식회사 | 표시소자용 연성기판 및 이를 이용한 디스플레이 소자 |
| US8502259B2 (en) | 2008-01-11 | 2013-08-06 | Industrial Technology Research Institute | Light emitting device |
| US20090200543A1 (en) * | 2008-02-08 | 2009-08-13 | Roger Stanley Kerr | Method of forming an electronic device on a substrate supported by a carrier and resultant device |
| US8800138B2 (en) * | 2008-02-08 | 2014-08-12 | Carestream Health, Inc. | Method for conditioning a substrate surface for forming an electronic device thereon and resultant device |
| US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
| TWI400673B (zh) * | 2009-02-18 | 2013-07-01 | Prime View Int Co Ltd | 可撓性顯示面板及其製作方法 |
| US8074349B2 (en) * | 2009-04-16 | 2011-12-13 | Carestream Health, Inc. | Magnetic hold-down for foil substrate processing |
| GB0909721D0 (en) * | 2009-06-05 | 2009-07-22 | Plastic Logic Ltd | Dielectric seed layer |
| TWI387138B (zh) * | 2009-07-10 | 2013-02-21 | Ind Tech Res Inst | 磁性發光元件、磁性發光裝置以及氮化物半導體模板 |
| EP2404650A1 (de) * | 2010-07-09 | 2012-01-11 | Bayer MaterialScience AG | Vorrichtung und Verfahren zur Fest-/Flüssig-Trennung von Fest-Flüssig-Suspensionen |
| JP5899220B2 (ja) * | 2010-09-29 | 2016-04-06 | ポスコ | ロール状の母基板を利用したフレキシブル電子素子の製造方法、フレキシブル電子素子及びフレキシブル基板 |
| USRE49869E1 (en) * | 2015-02-10 | 2024-03-12 | iBeam Materials, Inc. | Group-III nitride devices and systems on IBAD-textured substrates |
| KR20160127892A (ko) * | 2015-04-27 | 2016-11-07 | 삼성디스플레이 주식회사 | 플렉서블 기판 및 이를 포함하는 표시 장치 |
| JP7044802B2 (ja) | 2017-04-04 | 2022-03-30 | ダブリュ．エル．ゴア アンド アソシエーツ，ゲゼルシャフト ミット ベシュレンクテル ハフツング | 強化されたエラストマー及び統合電極を含む誘電複合体 |
| JP2019121734A (ja) * | 2018-01-10 | 2019-07-22 | 株式会社Ｊｏｌｅｄ | 半導体装置および表示装置 |
| EP3791697A1 (en) | 2018-05-08 | 2021-03-17 | W. L. Gore & Associates Inc | Flexible and stretchable printed circuits on stretchable substrates |
| JP7089064B2 (ja) | 2018-05-08 | 2022-06-21 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | 皮膚適用のためのフレキシブルプリント回路 |
| JP7085023B2 (ja) | 2018-05-08 | 2022-06-15 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | 伸長性基材及び非伸長性基材上の可撓性かつ耐久性プリント回路 |
| CN109285462B (zh) * | 2018-12-12 | 2021-04-20 | 武汉天马微电子有限公司 | 柔性显示面板及其制作方法、柔性显示装置 |
| KR102084519B1 (ko) * | 2019-07-16 | 2020-03-04 | 주식회사 오플렉스 | 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5237436A (en) * | 1990-12-14 | 1993-08-17 | North American Philips Corporation | Active matrix electro-optic display device with light shielding layer and projection and color employing same |
| US5891552A (en) * | 1996-01-04 | 1999-04-06 | Mobil Oil Corporation | Printed plastic films and method of thermal transfer printing |
| US5817550A (en) | 1996-03-05 | 1998-10-06 | Regents Of The University Of California | Method for formation of thin film transistors on plastic substrates |
| US6492026B1 (en) | 2000-04-20 | 2002-12-10 | Battelle Memorial Institute | Smoothing and barrier layers on high Tg substrates |
| WO2001097974A1 (en) * | 2000-06-19 | 2001-12-27 | Caliper Technologies Corp. | Methods and devices for enhancing bonded substrate yields and regulating temperature |
| JP2002108250A (ja) * | 2000-09-29 | 2002-04-10 | Sharp Corp | アクティブマトリックス駆動型自発光表示装置及びその製造方法 |
| DE10059498A1 (de) * | 2000-11-30 | 2002-06-13 | Infineon Technologies Ag | Substrat mit einer halbleitenden Schicht, elektronisches Bauelement mit diesem Substrat, elektronische Schaltung mit mindestens einem solchen elektronischen Bauelement, druckbare Zusammensetzung sowie Verfahren zur Herstellung eines Substrats |
| US6762124B2 (en) | 2001-02-14 | 2004-07-13 | Avery Dennison Corporation | Method for patterning a multilayered conductor/substrate structure |
| US7535624B2 (en) * | 2001-07-09 | 2009-05-19 | E Ink Corporation | Electro-optic display and materials for use therein |
| US7110163B2 (en) * | 2001-07-09 | 2006-09-19 | E Ink Corporation | Electro-optic display and lamination adhesive for use therein |
| JP2003045234A (ja) * | 2001-07-26 | 2003-02-14 | Dainippon Printing Co Ltd | 透明導電性フィルム |
| TWI308231B (en) * | 2001-08-28 | 2009-04-01 | Sipix Imaging Inc | Electrophoretic display |
| US20030193796A1 (en) * | 2002-04-15 | 2003-10-16 | Heeks Stephen K. | Light-emitting devices |
| US7223672B2 (en) * | 2002-04-24 | 2007-05-29 | E Ink Corporation | Processes for forming backplanes for electro-optic displays |
| EP1362682A1 (en) * | 2002-05-13 | 2003-11-19 | ZBD Displays Ltd, | Method and apparatus for liquid crystal alignment |
| JP2004140267A (ja) | 2002-10-18 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2004200365A (ja) * | 2002-12-18 | 2004-07-15 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ素子 |
| TWI330269B (en) | 2002-12-27 | 2010-09-11 | Semiconductor Energy Lab | Separating method |
| US20050216075A1 (en) * | 2003-04-08 | 2005-09-29 | Xingwu Wang | Materials and devices of enhanced electromagnetic transparency |
| JP4233433B2 (ja) * | 2003-11-06 | 2009-03-04 | シャープ株式会社 | 表示装置の製造方法 |
| JP4554344B2 (ja) * | 2003-12-02 | 2010-09-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1707590B1 (en) * | 2003-12-26 | 2008-12-10 | Toyo Boseki Kabushiki Kaisha | Polyimide film |
| US8053171B2 (en) * | 2004-01-16 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television |
| US20050163968A1 (en) * | 2004-01-20 | 2005-07-28 | Hanket Gregory M. | Microfiller-reinforced polymer film |
| EP1737053B1 (en) * | 2004-03-25 | 2012-02-29 | National Institute of Advanced Industrial Science and Technology | Thermoelectric conversion element and thermoelectric conversion module |
| JP5089027B2 (ja) * | 2004-05-28 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| EP1791185A1 (en) * | 2004-07-27 | 2007-05-30 | Quantum 14 KK | Light-emitting element, light-emitting device and information display |
| JP4715149B2 (ja) * | 2004-09-30 | 2011-07-06 | ソニー株式会社 | 薄膜半導体装置の製造方法 |
| US7582904B2 (en) * | 2004-11-26 | 2009-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device and method for manufacturing thereof, and television device |
| US20060180890A1 (en) * | 2005-01-18 | 2006-08-17 | Naugler W E Jr | Top emission flat panel display with sensor feedback stabilization |
| TWI408734B (zh) * | 2005-04-28 | 2013-09-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| TWI402935B (zh) * | 2005-05-17 | 2013-07-21 | Koninkl Philips Electronics Nv | 彩色主動矩陣顯示器 |
| CN101203976B (zh) * | 2005-06-20 | 2011-04-06 | 松下电器产业株式会社 | 膜-电极接合体的制造方法 |
| KR101102152B1 (ko) * | 2005-06-28 | 2012-01-02 | 삼성전자주식회사 | 유기박막 트랜지스터의 제조방법 및 그에 의해 제조된유기박막 트랜지스터 |
| US20070002199A1 (en) * | 2005-06-30 | 2007-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| US20070007579A1 (en) * | 2005-07-11 | 2007-01-11 | Matrix Semiconductor, Inc. | Memory cell comprising a thin film three-terminal switching device having a metal source and /or drain region |
| GB2430547A (en) | 2005-09-20 | 2007-03-28 | Seiko Epson Corp | A method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
| US7235736B1 (en) * | 2006-03-18 | 2007-06-26 | Solyndra, Inc. | Monolithic integration of cylindrical solar cells |
-
2006
- 2006-07-31 US US11/461,080 patent/US7678701B2/en not_active Expired - Fee Related
-
2007
- 2007-07-16 JP JP2009522771A patent/JP2009545878A/ja active Pending
- 2007-07-16 EP EP07796875A patent/EP2047513A1/en not_active Withdrawn
- 2007-07-16 WO PCT/US2007/016085 patent/WO2008016479A1/en active Application Filing
- 2007-07-30 TW TW096127807A patent/TW200814333A/zh unknown
-
2010
- 2010-02-01 US US12/697,522 patent/US7964507B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009545878A5 (ja) | ||
| EP1901123A4 (en) | PHOTOSENSITIVE ADHESIVE COMPOSITION AND ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART OBTAINED BY USING THE SAME | |
| JP2010508794A5 (ja) | ||
| JP2009541939A5 (ja) | ||
| TWI318458B (en) | Thin film transistor substrate and manufacturing method thereof | |
| EP1870945A4 (en) | METHOD FOR PRODUCING AN INGAALN FILM AND LIGHT-EMITTING COMPONENT ON A SILICON SUBSTRATE | |
| JP2006189853A5 (ja) | ||
| GB2439599B (en) | Thin film transistor array substrate and method fabricating the same | |
| JP2010506400A5 (ja) | ||
| EP2319893A4 (en) | LIGHT-SENSITIVE ADHESIVE, ADHESIVE, LACQUER, SHAFT, SEMICONDUCTOR WITH HAZARD AND SEMICONDUCTOR ELEMENT WITH LIGHT SENSITIVE COMPOSITION | |
| JP2009529442A5 (ja) | ||
| JP2008044923A5 (ja) | ||
| WO2008133864A3 (en) | Mass production of micro-optical devices, corresponding tools, and resultant structures | |
| JP2005023300A5 (ja) | ||
| TW200737589A (en) | Electronic device and antenna structure thereof | |
| EP1939319A4 (en) | SEMICONDUCTOR THIN FILM AND METHOD FOR PRODUCING THE SAME | |
| EP1850373A3 (en) | Method of forming highly orientated silicon film, method of manufacturing three-dimensional semiconductor device, and three-dimensional semiconductor device | |
| JP2007129110A5 (ja) | ||
| TW200603270A (en) | Method to form a film | |
| TW200743219A (en) | Thin film transistor array substrate structures and fabrication method thereof | |
| JP2006528430A5 (ja) | ||
| JP2007157787A5 (ja) | ||
| SG149036A1 (en) | A method of fabricating periodic nano-structure arrays with different feature sizes | |
| TW200735271A (en) | Semiconductor device fabrication method | |
| FR2866983B1 (fr) | Realisation d'une entite en materiau semiconducteur sur substrat |