JP2009539270A5 - - Google Patents

Download PDF

Info

Publication number
JP2009539270A5
JP2009539270A5 JP2009513455A JP2009513455A JP2009539270A5 JP 2009539270 A5 JP2009539270 A5 JP 2009539270A5 JP 2009513455 A JP2009513455 A JP 2009513455A JP 2009513455 A JP2009513455 A JP 2009513455A JP 2009539270 A5 JP2009539270 A5 JP 2009539270A5
Authority
JP
Japan
Prior art keywords
precursors
steps
deposition process
precursor
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009513455A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009539270A (ja
Filing date
Publication date
Priority claimed from US11/443,621 external-priority patent/US7867905B2/en
Priority claimed from US11/443,620 external-priority patent/US7442615B2/en
Application filed filed Critical
Priority claimed from PCT/US2007/070082 external-priority patent/WO2007140455A2/en
Publication of JP2009539270A publication Critical patent/JP2009539270A/ja
Publication of JP2009539270A5 publication Critical patent/JP2009539270A5/ja
Pending legal-status Critical Current

Links

JP2009513455A 2006-05-31 2007-05-31 半導体加工のためのシステム及び方法 Pending JP2009539270A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/443,621 US7867905B2 (en) 2001-04-21 2006-05-31 System and method for semiconductor processing
US11/443,620 US7442615B2 (en) 2001-04-21 2006-05-31 Semiconductor processing system and method
PCT/US2007/070082 WO2007140455A2 (en) 2006-05-31 2007-05-31 System and method for semiconductor processing

Publications (2)

Publication Number Publication Date
JP2009539270A JP2009539270A (ja) 2009-11-12
JP2009539270A5 true JP2009539270A5 (zh) 2010-07-22

Family

ID=38779474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009513455A Pending JP2009539270A (ja) 2006-05-31 2007-05-31 半導体加工のためのシステム及び方法

Country Status (4)

Country Link
EP (1) EP2032744A2 (zh)
JP (1) JP2009539270A (zh)
KR (1) KR20090017661A (zh)
WO (1) WO2007140455A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10734195B2 (en) * 2017-06-08 2020-08-04 Lam Research Corporation Systems and methods for transformer coupled plasma pulsing with transformer coupled capacitive tuning switching

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH029789A (ja) * 1988-06-28 1990-01-12 Nec Corp シリコンの成長方法
JPH04162427A (ja) * 1990-10-24 1992-06-05 Fujitsu Ltd 気相成膜装置および気相成膜方法
JP2680202B2 (ja) * 1991-03-20 1997-11-19 国際電気株式会社 気相成長方法及び装置
JPH0574713A (ja) * 1991-09-17 1993-03-26 Nippondenso Co Ltd 非晶質半導体薄膜の製造方法
JPH06291060A (ja) * 1993-03-30 1994-10-18 Nissin Electric Co Ltd 薄膜形成方法
US6326248B1 (en) * 1994-06-02 2001-12-04 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating semiconductor device
JPH08186173A (ja) * 1994-12-28 1996-07-16 Nec Corp 半導体装置の製造方法
US6610169B2 (en) * 2001-04-21 2003-08-26 Simplus Systems Corporation Semiconductor processing system and method
US7713592B2 (en) * 2003-02-04 2010-05-11 Tegal Corporation Nanolayer deposition process
JP2004311955A (ja) * 2003-03-25 2004-11-04 Sony Corp 超薄型電気光学表示装置の製造方法
JP4396547B2 (ja) * 2004-06-28 2010-01-13 東京エレクトロン株式会社 成膜方法、成膜装置及び記憶媒体

Similar Documents

Publication Publication Date Title
WO2010062582A3 (en) Vapor deposition method for ternary compounds
JP2008057042A5 (zh)
JP2006516833A5 (zh)
WO2012047812A3 (en) Atomic layer deposition of silicon nitride using dual-source precursor and interleaved plasma
WO2010045153A3 (en) Method for depositing conformal amorphous carbon film by plasma-enhanced chemical vapor deposition (pecvd)
TW200628629A (en) Method for increasing deposition rates of metal layers from metal-carbonyl precursors
JP2004160977A5 (zh)
JP2012501543A5 (zh)
JP2008538126A5 (zh)
JP2008538129A5 (zh)
JP2009111382A5 (zh)
JP2011181681A (ja) 原子層堆積方法及び原子層堆積装置
TW200606168A (en) Copper (I) compounds useful as deposition precursors of copper thin films
WO2007038050A3 (en) Treatment processes for a batch ald reactor
TW200632126A (en) Method of depositing thin layer using atomic layer deposition
JP2011520251A5 (zh)
JP2009004786A (ja) パルスcvdとaldの併用による薄膜の堆積方法
WO2005087974A3 (en) Cvd processes for the deposition of amorphous carbon films
WO2008121478A3 (en) Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon
JP2012506151A5 (zh)
JP2007277723A5 (zh)
TW200618066A (en) Deposition of ruthenium metal layers in a thermal chemical vapor deposition process
KR101035221B1 (ko) 질화 텅스텐막의 형성 방법
TWI692032B (zh) 鍺沈積技術
EP2058416A3 (en) Preparation of a metal-containing film via ALD or CVD processes