JP2009534817A - 並行管を備えたマルチステージ熱交換管 - Google Patents
並行管を備えたマルチステージ熱交換管 Download PDFInfo
- Publication number
- JP2009534817A JP2009534817A JP2009505784A JP2009505784A JP2009534817A JP 2009534817 A JP2009534817 A JP 2009534817A JP 2009505784 A JP2009505784 A JP 2009505784A JP 2009505784 A JP2009505784 A JP 2009505784A JP 2009534817 A JP2009534817 A JP 2009534817A
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- JP
- Japan
- Prior art keywords
- heat exchanger
- heat exchange
- channel
- heat
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/06—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits forming part of, or being attached to, the tank containing the body of fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
- F28F2009/222—Particular guide plates, baffles or deflectors, e.g. having particular orientation relative to an elongated casing or conduit
- F28F2009/228—Oblique partitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【選択図】 図3
Description
WF=α*A*ΔT
Claims (15)
- 熱交換チャネル(11、21、31)を備え、前記熱交換チャネルはその中を流れる媒体用の注入口(9)と排出口(33)を有する、熱交換器であって、
前記媒体が流れる方向において連続的に配置され、それぞれ熱交換チャネル(11、21、31)を有する少なくとも2つのステージ(10、20、30)を備え、
最初の前記ステージ(10)は、前記熱交換チャネル(11)に並行に配置された少なくとも1つの案内チャネル(12)を含み、
前記熱交換チャネル(11、21)は、各ステージ(10、20)の終端において少なくとも1つの排出口(13、23)を有し、
前記各ステージ(10、20)の前記案内チャネル(12、22)は、後続のステージ(20、30)の前記熱交換チャネル(21、31)と流体接続する、熱交換器。 - 前記個々のステージ(10、20、30)は、前記媒体の分離された部分流(14、24、34)があるよう交差流部(7、8)により接続される、請求項1に記載の熱交換器。
- 前記ステージ(10、20、30)は、プラグ接続により互いに接続される、請求項1又は2に記載の熱交換器。
- 前記熱交換チャネル(11、21、31)及び前記案内チャネル(12、22、32)は、直方体形状に設計される、請求項1乃至3のうちいずれか一項に記載の熱交換器。
- 前記個々のステージ(10、20、30)は、互いに接着される、請求項1、2、4、又は5に記載の熱交換器。
- プラスチック又は金属から作製される、請求項1乃至5のうちいずれか一項に記載の熱交換器。
- 3以上のステージ(10、20、30)を備える、請求項1乃至7のうちいずれか一項に記載の熱交換器。
- 前記個々のステージ(10、20、30)は、モジュラー式に設計される、請求項7に記載の熱交換器。
- 全てのステージ(10、20、30)を覆い、追加の案内チャネル(44)を形成する上壁(18)を備え、
最後のステージ(30)以外の全てのステージ(10、20)の前記排出口(13、23)は、前記案内チャネル(44)につながる、請求項1乃至9のうちいずれか一項に記載の熱交換器。 - 少なくとも1つの熱交換チャネル(11、21)は、その下流端において、前記媒体を、前記各熱案内チャネル(11、21)の側壁(4、5)に設けられた開口(13、23)を通り排出させる案内プレート(40、29)を有する、請求項1に記載の熱交換器。
- 一又は複数の前記開口(13、23)の断面積は、前記割り当てられた案内チャネル(11、21)の断面積に対応する、請求項10に記載の熱交換器。
- 前記案内プレート(40、29)は、先端部を形成するよう配置される2つのブラケットを含む、請求項10又は11に記載の熱交換器。
- 前記案内プレート(40、29)の前記ブラケットは、湾曲される、請求項12に記載の熱交換器。
- 前記案内プレート(29)は、前記熱案内チャネル(11、21)の中央に対して上から見た場合に鏡対称に配置される、請求項10乃至14のうちいずれか一項に記載の熱交換器。
- 前記開口(13、23)に煙突型の突起物(13'、23')が接続され、
前記突起物は、前記開口(13、23)から排出される前記媒体を、前記熱交換器を通る主流方向に垂直であり、且つ、前記開口(13、23)からの排出方向に垂直である流れ成分を前記媒体が少なくとも含むよう偏向させる、請求項10乃至14のうちいずれか一項に記載の熱交換器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200610018709 DE102006018709B3 (de) | 2006-04-20 | 2006-04-20 | Wärmetauscher |
DE200610035552 DE102006035552A1 (de) | 2006-04-20 | 2006-07-27 | Wärmetauscher |
PCT/EP2007/003444 WO2007121925A1 (de) | 2006-04-20 | 2007-04-19 | Mehrstufiger wärmetauschkanal mit parallel angeordnetem leitkanal |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009534817A true JP2009534817A (ja) | 2009-09-24 |
Family
ID=38513706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009505784A Pending JP2009534817A (ja) | 2006-04-20 | 2007-04-19 | 並行管を備えたマルチステージ熱交換管 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9022098B2 (ja) |
EP (1) | EP2010853B1 (ja) |
JP (1) | JP2009534817A (ja) |
DE (2) | DE102006018709B3 (ja) |
WO (1) | WO2007121925A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006018709B3 (de) | 2006-04-20 | 2007-10-11 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
KR101446828B1 (ko) * | 2008-06-18 | 2014-10-30 | 브루사 일렉트로닉 아게 | 전자소자용의 냉각장치 |
US8155922B2 (en) * | 2009-06-04 | 2012-04-10 | Eaton Corporation | Electrical device cooling efficiency monitoring |
DE102010050519A1 (de) | 2010-11-08 | 2012-05-10 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
TW201442610A (zh) * | 2013-04-30 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | 機箱 |
CN105101734B (zh) | 2014-04-22 | 2017-12-05 | 华为技术有限公司 | 散热装置及具有该散热装置的机柜 |
US9871358B2 (en) * | 2015-01-30 | 2018-01-16 | Abb Schweiz Ag | Electrical switchgear system |
US20170099746A1 (en) * | 2015-10-01 | 2017-04-06 | Microsoft Technology Licensing, Llc | Layered airflow cooling for electronic components |
EP3381248B1 (en) * | 2016-02-23 | 2023-07-26 | Hewlett Packard Enterprise Development LP | Deflection of heated air from a posterior electrical component |
US11248854B2 (en) | 2018-03-09 | 2022-02-15 | Bae Systems Plc | Heat exchanger |
EP3537087A1 (en) * | 2018-03-09 | 2019-09-11 | BAE SYSTEMS plc | Heat exchanger |
WO2019171078A1 (en) * | 2018-03-09 | 2019-09-12 | Bae Systems Plc | Heat exchanger |
EP3537086A1 (en) * | 2018-03-09 | 2019-09-11 | BAE SYSTEMS plc | Heat exchanger |
ES2956274T3 (es) * | 2018-03-09 | 2023-12-18 | Bae Systems Plc | Intercambiador de calor |
IT201800010006A1 (it) * | 2018-11-02 | 2020-05-02 | Sumitomo Riko Co Ltd | Scambiatore di calore interno |
Citations (2)
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JPS538765A (en) * | 1976-07-13 | 1978-01-26 | Tokyo Shibaura Electric Co | Forced cooling device |
JPH02210898A (ja) * | 1989-02-10 | 1990-08-22 | Fujitsu Ltd | 電子機器の冷却システム |
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JPH07114250B2 (ja) * | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 熱伝達システム |
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JP3441702B2 (ja) * | 2000-06-28 | 2003-09-02 | 株式会社栗田工業 | 室内冷暖房システム及び空気循環パネル |
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DE102004030675A1 (de) * | 2004-06-24 | 2005-11-10 | Nft Nanofiltertechnik Gmbh | Kühleinrichtung für elektronische Bauelemente |
US7259961B2 (en) | 2004-06-24 | 2007-08-21 | Intel Corporation | Reconfigurable airflow director for modular blade chassis |
EP1727411A3 (de) | 2005-05-23 | 2008-08-06 | Brüco Swiss AG | Kühlvorrichtung für Serverschrank |
US20070215336A1 (en) * | 2006-03-17 | 2007-09-20 | Inventec Corporation | Mesh-type heat dissipating structure |
DE102006018709B3 (de) | 2006-04-20 | 2007-10-11 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
-
2006
- 2006-04-20 DE DE200610018709 patent/DE102006018709B3/de not_active Expired - Fee Related
- 2006-07-27 DE DE200610035552 patent/DE102006035552A1/de not_active Withdrawn
-
2007
- 2007-04-19 JP JP2009505784A patent/JP2009534817A/ja active Pending
- 2007-04-19 EP EP07724381.4A patent/EP2010853B1/de not_active Not-in-force
- 2007-04-19 WO PCT/EP2007/003444 patent/WO2007121925A1/de active Application Filing
- 2007-04-19 US US12/297,698 patent/US9022098B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS538765A (en) * | 1976-07-13 | 1978-01-26 | Tokyo Shibaura Electric Co | Forced cooling device |
JPH02210898A (ja) * | 1989-02-10 | 1990-08-22 | Fujitsu Ltd | 電子機器の冷却システム |
Also Published As
Publication number | Publication date |
---|---|
US9022098B2 (en) | 2015-05-05 |
US20090101313A1 (en) | 2009-04-23 |
DE102006035552A1 (de) | 2008-01-31 |
EP2010853A1 (de) | 2009-01-07 |
DE102006018709B3 (de) | 2007-10-11 |
WO2007121925A1 (de) | 2007-11-01 |
EP2010853B1 (de) | 2016-02-17 |
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