JP2009532556A - 樹脂におけるグラフト化粒子及び非グラフト化粒子の混合物 - Google Patents
樹脂におけるグラフト化粒子及び非グラフト化粒子の混合物 Download PDFInfo
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249959—Void-containing component is wood or paper
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Abstract
Description
B−N−OH
ここで、ホウ素は大きなナノ粒子の一部である。次いで、ヒドロキシル(OH)基が、樹脂と直接反応するか、又は更に他の中間的な官能基と反応することができる。また別な例は、水素リッチな蒸気中で窒化アルミニウムナノ粒子の表面を変性して、表面NH2反応性基を作るものであり、次いで、これを、LCTエポキシ又はポリイミド樹脂と反応させることができる。更にまた別な具体例では、炭化ケイ素ナノ粒子にプラズマ重合手順を使用する方法であって、表面グラフト化ビニル基を作り、次いで、これをビニルモノマー又はポリブタジエン樹脂と反応させることができる。
グラフト重合反応は、撹拌機、ガス導入チューブ及び温度計を取り付けた、丸底の三口フラスコの中で実施した。2.0gのナノサイズの酸化マグネシウムを25mLの蒸留水の中に分散させ、反応混合物中に窒素ガスをバブリングさせながら、窒素下で、グラフト化反応を行なわせた。次いで、必要量の開始剤溶液(10mLの1N硝酸中に溶解させた0.55gの硝酸セリウムアンモニウム)、次いで6.0mLのメタクリル酸メチルを加えた。40℃で3時間、反応させた。グラフト化生成物をソックスレー抽出器で抽出してポリマーを除去した。
アルミナ−グラフト化−TSPA−オリゴマー(HTCオリゴマー)(2.5g)を、磁器製乳鉢の中で摩砕して細かい粉体とした。LCT−エポキシ樹脂RSS−1407(4.0g)を小さなガラスジャーの中で温めて60℃とした。HTCオリゴマー粉体を樹脂に添加し、混合物を約30分間撹拌して、透明な溶液を得た。硬化触媒として0.1gのナフテン酸亜鉛を加え、更に5分間混合した。次いで、液体を小さなアルミニウム皿に注ぎ、オーブン中に、150℃で4時間置いて、硬化させた。
ビフェノールLCT−エポキシ樹脂RSS−1407(4.0g)を、ホットプレート上で60℃に加温した小さなガラスジャーの中で、1−メチルヘキサヒドロフタル酸無水物(4.0g)に撹拌しながら添加した。溶液が透明になってから、アルミナ−グラフト化−TSPA−オリゴマー(HTCオリゴマー)(3.0g)を添加し、溶液を60℃で更に撹拌して、その溶液を再び透明にした。硬化促進剤として0.1gのナフテン酸亜鉛を加え、更に5分間混合した。次いで液体を小さなアルミニウム皿に注ぎ、オーブン中に、150℃で4時間置いて硬化させた。
31 グラフト化粒子
32 樹脂マトリックス
33 樹脂分子
34 フォノン
36 フォノン
Claims (22)
- ホスト樹脂マトリックス;
ホスト樹脂マトリックスにグラフトされた、第一のクラスの高熱伝導性グラフト化粒子;及び
ホスト樹脂マトリックスに直接的にグラフトされていない、第二のクラスの高熱伝導性非グラフト化粒子;
を含んでなる高熱伝導性樹脂であって:
第一のクラス及び第二のクラスが、高熱伝導性樹脂の約2〜60体積%を占め;
第一のクラスのグラフト化粒子及び第二のクラスの非グラフト化粒子が、長さが1〜1,000nmで3〜100の間のアスペクト比を有する、高熱伝導性充填剤である、高熱伝導性樹脂。 - 第一のクラス及び第二のクラスが約25〜40%を占める、請求項1に記載の樹脂。
- 第二のクラスの非グラフト化粒子が、表面処理されていて、そのクラスの他の粒子と反応しない、請求項1に記載の樹脂。
- 第二のクラスの非グラフト化粒子が、表面処理されていて、そのクラスの他の粒子と反応してホスト樹脂マトリックス中で集積体を形成する、請求項1に記載の樹脂。
- 第一のクラスのグラフト化粒子が、表面処理されていて、第二のクラスの非グラフト化粒子と反応する、請求項1に記載の樹脂。
- 第一のクラスのグラフト化粒子が、第二のクラスの非グラフト化粒子よりも10倍以上大きい平均長さ分布を、有している請求項1に記載の樹脂。
- ホスト樹脂ネットワークが、エポキシ、ポリイミドエポキシ、液晶エポキシ、シアネート−エステル、ポリブタジエン、及びこれらの混合物を含む、請求項1に記載の樹脂。
- 高熱伝導性樹脂が複合体テープ中に含浸される、請求項1に記載の樹脂。
- 第二のクラスの非グラフト化粒子が、高熱伝導性樹脂が複合体テープ中に含浸された後に、高熱伝導性樹脂中に組み入れられる、請求項8に記載の樹脂。
- 非グラフト化物が、温度上昇及び紫外線照射の内の少なくとも一つを適用することにより、ホスト樹脂にグラフトされる、請求項1に記載の樹脂。
- 熱伝導性粒子が、酸化物、窒化物及び炭化物の内の少なくとも一つである、請求項1に記載の樹脂。
- ホスト樹脂マトリックス;
ホスト樹脂マトリックスにグラフトされた、第一のクラスの高熱伝導性グラフト化粒子;及び
ホスト樹脂マトリックスにグラフトされていない、第二のクラスの高熱伝導性非グラフト化粒子;
を含んでなる高熱伝導性樹脂であって:
第一のクラス及び第二のクラスが、高熱伝導性樹脂の約4〜60体積%を占め;
第一のクラスのグラフト化粒子及び第二のクラスの非グラフト化粒子が、長さが5〜1,000nmで3〜100の間のアスペクト比を有する、高熱伝導性充填剤であり:
各粒子のクラスが、それぞれ、高熱伝導性樹脂の少なくとも1体積%を占める、
高熱伝導性樹脂。 - 樹脂が多孔質媒体中に含浸される、請求項12に記載の樹脂。
- 多孔質媒体が紙マトリックスである、請求項13に記載の樹脂。
- 第一のクラスのグラフト化粒子及び第二のクラスの非グラフト化粒子の比率が、多孔質媒体が第二のクラスの非グラフト化粒子に対して有している、より大きな濾過効果のゆえに、多孔質媒体の異なる部分では異なっている、請求項13に記載の樹脂。
- 第一のクラスのグラフト化粒子及び第二のクラスの非グラフト化粒子の比率が、粒子の元々の配置ゆえに、多孔質媒体の異なった部分において異なっている、請求項13に記載の樹脂。
- 第一のクラスのグラフト化粒子が、第二のクラスの非グラフト化粒子よりも、高い機械的強度を有している、請求項12に記載の樹脂。
- ホスト樹脂マトリックス;
ホスト樹脂マトリックスにグラフトされた第一のクラスのグラフト化粒子であって、ホスト樹脂マトリックスの局所的な強度を向上させるグラフト化粒子;及び
ホスト樹脂マトリックスにグラフトされていない、第二のクラスの高熱伝導性非グラフト化粒子;
を含んでなる高熱伝導性樹脂であって:
第一のクラス及び第二のクラスは、高熱伝導性樹脂の約2〜60体積%を占め;
第二クラスの非グラフト化粒子が、長さが1〜1,000nmで、3〜100の間のアスペクト比を有する、高熱伝導性充填剤である、
高熱伝導性樹脂。 - 第二のクラスの非グラフト化粒子が、第一のクラスのグラフト化粒子の2〜10倍の平均長さを有している、請求項18に記載の樹脂。
- 第一のクラスのグラフト化粒子の少なくとも一部が、長さが1〜1,000nmで3〜100の間のアスペクト比を有する、高熱伝導性充填剤である、請求項18に記載の樹脂。
- 高熱伝導性粒子ではない第三のクラスの非グラフト化粒子が、ホスト樹脂マトリックスの中に、存在する、請求項18に記載の樹脂。
- グラフト化粒子がホスト樹脂マトリックスの絶縁耐力を向上させる、請求項18に記載の樹脂。
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US11/396,989 | 2006-04-03 | ||
US11/396,989 US7655295B2 (en) | 2005-06-14 | 2006-04-03 | Mix of grafted and non-grafted particles in a resin |
PCT/US2007/000081 WO2007114873A1 (en) | 2006-04-03 | 2007-01-03 | Mix of grafted and non-grafted particles in a resin |
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JP2009532556A true JP2009532556A (ja) | 2009-09-10 |
JP5574703B2 JP5574703B2 (ja) | 2014-08-20 |
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US (2) | US7655295B2 (ja) |
EP (1) | EP2001945A1 (ja) |
JP (1) | JP5574703B2 (ja) |
KR (1) | KR101405836B1 (ja) |
CN (1) | CN101479332B (ja) |
WO (1) | WO2007114873A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011093079A1 (ja) * | 2010-01-28 | 2011-08-04 | 三井化学株式会社 | 金属樹脂複合体 |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7781063B2 (en) * | 2003-07-11 | 2010-08-24 | Siemens Energy, Inc. | High thermal conductivity materials with grafted surface functional groups |
US7033670B2 (en) | 2003-07-11 | 2006-04-25 | Siemens Power Generation, Inc. | LCT-epoxy polymers with HTC-oligomers and method for making the same |
US8216672B2 (en) | 2004-06-15 | 2012-07-10 | Siemens Energy, Inc. | Structured resin systems with high thermal conductivity fillers |
US7553438B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
US7592045B2 (en) * | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
US20050277721A1 (en) | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials aligned within resins |
US20080050580A1 (en) * | 2004-06-15 | 2008-02-28 | Stevens Gary C | High Thermal Conductivity Mica Paper Tape |
US20050274774A1 (en) | 2004-06-15 | 2005-12-15 | Smith James D | Insulation paper with high thermal conductivity materials |
US7776392B2 (en) * | 2005-04-15 | 2010-08-17 | Siemens Energy, Inc. | Composite insulation tape with loaded HTC materials |
US7553781B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Fabrics with high thermal conductivity coatings |
US7425296B2 (en) | 2004-12-03 | 2008-09-16 | Pressco Technology Inc. | Method and system for wavelength specific thermal irradiation and treatment |
US10857722B2 (en) | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
US7651963B2 (en) | 2005-04-15 | 2010-01-26 | Siemens Energy, Inc. | Patterning on surface with high thermal conductivity materials |
US7846853B2 (en) | 2005-04-15 | 2010-12-07 | Siemens Energy, Inc. | Multi-layered platelet structure |
US7955661B2 (en) | 2005-06-14 | 2011-06-07 | Siemens Energy, Inc. | Treatment of micropores in mica materials |
US7655295B2 (en) | 2005-06-14 | 2010-02-02 | Siemens Energy, Inc. | Mix of grafted and non-grafted particles in a resin |
US7781057B2 (en) | 2005-06-14 | 2010-08-24 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
US7851059B2 (en) | 2005-06-14 | 2010-12-14 | Siemens Energy, Inc. | Nano and meso shell-core control of physical properties and performance of electrically insulating composites |
US8357433B2 (en) | 2005-06-14 | 2013-01-22 | Siemens Energy, Inc. | Polymer brushes |
US20070258190A1 (en) * | 2006-05-05 | 2007-11-08 | Irwin Patricia C | High temperature capacitors and method of manufacturing the same |
US7547847B2 (en) | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
US8182859B2 (en) * | 2007-03-30 | 2012-05-22 | Boston Scientific Scimed, Inc. | Using magnetism to prepare a medical device |
JP2010528906A (ja) * | 2007-06-08 | 2010-08-26 | プレスコ テクノロジー インコーポレーテッド | 波長特定熱照射および処理用の方法およびシステム |
WO2010117023A1 (ja) * | 2009-04-09 | 2010-10-14 | 日本発條株式会社 | 金属ベース回路基板およびその製造方法 |
EP2417171B1 (en) * | 2009-04-10 | 2018-01-24 | Rensselaer Polytechnic Institute | Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation |
CA2771578A1 (en) * | 2009-09-16 | 2011-03-24 | Greatpoint Energy, Inc. | Processes for hydromethanation of a carbonaceous feedstock |
JP2014129466A (ja) * | 2012-12-28 | 2014-07-10 | Hitachi Industrial Equipment Systems Co Ltd | 高電圧機器用絶縁樹脂材およびそれを用いた高電圧機器 |
US9928935B2 (en) | 2013-05-31 | 2018-03-27 | General Electric Company | Electrical insulation system |
US9879163B2 (en) | 2014-06-06 | 2018-01-30 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
US10472472B2 (en) | 2014-09-23 | 2019-11-12 | The Boeing Company | Placement of modifier material in resin-rich pockets to mitigate microcracking in a composite structure |
US9845556B2 (en) | 2014-09-23 | 2017-12-19 | The Boeing Company | Printing patterns onto composite laminates |
US10160840B2 (en) | 2014-09-23 | 2018-12-25 | The Boeing Company | Polymer nanoparticles for controlling permeability and fiber volume fraction in composites |
US10808123B2 (en) | 2014-09-23 | 2020-10-20 | The Boeing Company | Nanoparticles for improving the dimensional stability of resins |
US9862828B2 (en) | 2014-09-23 | 2018-01-09 | The Boeing Company | Polymer nanoparticle additions for resin modification |
US10662302B2 (en) | 2014-09-23 | 2020-05-26 | The Boeing Company | Polymer nanoparticles for improved distortion capability in composites |
US9587076B2 (en) | 2014-09-23 | 2017-03-07 | The Boeing Company | Polymer nanoparticles for controlling resin reaction rates |
US10072126B2 (en) | 2014-09-23 | 2018-09-11 | The Boeing Company | Soluble nanoparticles for composite performance enhancement |
CN109111742B (zh) * | 2018-07-10 | 2021-09-10 | 江门市硅成新材料有限公司 | 一种计算机cpu用导热硅脂及其制备方法 |
CN117285046B (zh) * | 2023-11-24 | 2024-01-26 | 四川大学 | 一种改性云母纳米片、云母@纳米纤维素纤维的制备方法、柔性绝缘纸及制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008502816A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | ナノフィラーのダイヤモンドライクコーティング |
JP2008502782A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高熱伝導性充填剤を有する構造化樹脂系 |
JP2008504378A (ja) * | 2004-06-15 | 2008-02-14 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂に組込まれた高熱伝導性材料 |
JP2008507594A (ja) * | 2004-06-15 | 2008-03-13 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂内に配列した高熱伝導性材料 |
Family Cites Families (108)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB881036A (en) | 1957-02-27 | 1961-11-01 | Mc Graw Edison Co | Improvements relating to insulated electrical conductors |
US3246271A (en) | 1965-04-16 | 1966-04-12 | Westinghouse Electric Corp | Paper insulation for transformers |
JPS5232062B2 (ja) | 1972-12-25 | 1977-08-19 | ||
CA1016586A (en) | 1974-02-18 | 1977-08-30 | Hubert G. Panter | Grounding of outer winding insulation to cores in dynamoelectric machines |
US3974302A (en) | 1974-11-26 | 1976-08-10 | Westinghouse Electric Corporation | Method of making patterned dry resin coated sheet insulation |
US4160926A (en) | 1975-06-20 | 1979-07-10 | The Epoxylite Corporation | Materials and impregnating compositions for insulating electric machines |
US4760296A (en) | 1979-07-30 | 1988-07-26 | General Electric Company | Corona-resistant insulation, electrical conductors covered therewith and dynamoelectric machines and transformers incorporating components of such insulated conductors |
US4335367A (en) | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
US4361661A (en) | 1980-05-22 | 1982-11-30 | Western Electric Company, Incorporated | Thermal backfill composition method |
US4491618A (en) * | 1980-11-08 | 1985-01-01 | Hitachi Chemical Company, Ltd. | Reconstituted mica materials, reconstituted mica prepreg materials, reconstituted mica products and insulated coils |
US4400226A (en) | 1981-07-16 | 1983-08-23 | General Electric Company | Method of making an insulated electromagnetic coil |
US4427740A (en) | 1982-04-09 | 1984-01-24 | Westinghouse Electric Corp. | High maximum service temperature low cure temperature non-linear electrical grading coatings resistant to V.P.I. resins containing highly reactive components |
US4634911A (en) | 1985-04-16 | 1987-01-06 | Westinghouse Electric Corp. | High voltage dynamoelectric machine with selectively increased coil turn-to-turn insulation strength |
US4694064A (en) | 1986-02-28 | 1987-09-15 | The Dow Chemical Company | Rod-shaped dendrimer |
US4704322A (en) | 1986-09-22 | 1987-11-03 | Essex Group, Inc. | Resin rich mica tape |
SE455246B (sv) | 1986-10-22 | 1988-06-27 | Asea Ab | Herva for anordnande i spar i en stator eller rotor i en elektrisk maskin och sett att tillverka en sadan herva |
US5011872A (en) | 1987-12-21 | 1991-04-30 | The Carborudum Company | Thermally conductive ceramic/polymer composites |
FI105605B (fi) | 1989-04-27 | 2000-09-15 | Siemens Ag | Planarisoiva eriste |
US5126192A (en) | 1990-01-26 | 1992-06-30 | International Business Machines Corporation | Flame retardant, low dielectric constant microsphere filled laminate |
US5352493A (en) | 1991-05-03 | 1994-10-04 | Veniamin Dorfman | Method for forming diamond-like nanocomposite or doped-diamond-like nanocomposite films |
US5281388A (en) | 1992-03-20 | 1994-01-25 | Mcdonnell Douglas Corporation | Resin impregnation process for producing a resin-fiber composite |
US5409968A (en) * | 1992-11-06 | 1995-04-25 | Minnesota Mining And Manufacturing Company | Controlled conductivity antistatic articles |
DE4244298C2 (de) | 1992-12-28 | 2003-02-27 | Alstom | Isolierband und Verfahren zu seiner Herstellung |
US5510174A (en) | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
US5578901A (en) | 1994-02-14 | 1996-11-26 | E. I. Du Pont De Nemours And Company | Diamond fiber field emitters |
JP3033445B2 (ja) * | 1994-07-05 | 2000-04-17 | 信越化学工業株式会社 | 樹脂用無機質充填剤及びエポキシ樹脂組成物 |
US5723920A (en) | 1994-10-12 | 1998-03-03 | General Electric Company | Stator bars internally graded with conductive binder tape |
NL9500509A (nl) | 1995-03-14 | 1996-10-01 | Vicair B V | Ondersteuningsinrichting zoals bijvoorbeeld een kussen. |
US5801334A (en) | 1995-08-24 | 1998-09-01 | Theodorides; Demetrius C. | Conductor (turn) insulation system for coils in high voltage machines |
WO1997020982A1 (en) | 1995-12-01 | 1997-06-12 | E.I. Du Pont De Nemours And Company | Diamond-like-carbon coated aramid fibers having improved mechanical properties |
US5780119A (en) | 1996-03-20 | 1998-07-14 | Southwest Research Institute | Treatments to reduce friction and wear on metal alloy components |
US6130495A (en) | 1996-05-15 | 2000-10-10 | Siemens Aktiengesellschaft | Supporting element for an electric winding, turbogenerator and method of producing a corona shield |
JP3201262B2 (ja) | 1996-05-30 | 2001-08-20 | 株式会社日立製作所 | 熱硬化性樹脂組成物,電機絶縁線輪,回転電機及びその製造方法 |
US6344271B1 (en) | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
US6255738B1 (en) | 1996-09-30 | 2001-07-03 | Tessera, Inc. | Encapsulant for microelectronic devices |
US5904984A (en) * | 1996-10-17 | 1999-05-18 | Siemens Westinghouse Power Corporation | Electrical insulation using liquid crystal thermoset epoxy resins |
US6359232B1 (en) | 1996-12-19 | 2002-03-19 | General Electric Company | Electrical insulating material and stator bar formed therewith |
US5878620A (en) | 1997-01-23 | 1999-03-09 | Schlege Systems, Inc. | Conductive fabric sensor for vehicle seats |
US6103382A (en) * | 1997-03-14 | 2000-08-15 | Siemens Westinghouse Power Corporation | Catalyzed mica tapes for electrical insulation |
US6160042A (en) | 1997-05-01 | 2000-12-12 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
DE19720555A1 (de) | 1997-05-16 | 1998-11-19 | Abb Research Ltd | Statorwicklungsisolierung |
RU2114210C1 (ru) | 1997-05-30 | 1998-06-27 | Валерий Павлович Гончаренко | Способ формирования углеродного алмазоподобного покрытия в вакууме |
US6821672B2 (en) * | 1997-09-02 | 2004-11-23 | Kvg Technologies, Inc. | Mat of glass and other fibers and method for producing it |
EP1029352A1 (en) | 1997-11-13 | 2000-08-23 | Bp Amoco Corporation | Heat pipe thermal management apparatus |
US6015597A (en) | 1997-11-26 | 2000-01-18 | 3M Innovative Properties Company | Method for coating diamond-like networks onto particles |
US6265068B1 (en) | 1997-11-26 | 2001-07-24 | 3M Innovative Properties Company | Diamond-like carbon coatings on inorganic phosphors |
DE69739076D1 (de) | 1997-12-18 | 2008-12-11 | Mitsubishi Electric Corp | Rotierende elektrische Maschine |
US5938934A (en) | 1998-01-13 | 1999-08-17 | Dow Corning Corporation | Dendrimer-based nanoscopic sponges and metal composites |
US6153721A (en) | 1998-02-26 | 2000-11-28 | Honeywell International Inc. | Preparation of polyindanebisphenols and polymers derived therefrom |
US6288341B1 (en) | 1998-02-27 | 2001-09-11 | Hitachi, Ltd. | Insulating material windings using same and a manufacturing method thereof |
US6396864B1 (en) | 1998-03-13 | 2002-05-28 | Jds Uniphase Corporation | Thermally conductive coatings for light emitting devices |
DE69925528T2 (de) | 1998-03-19 | 2006-01-26 | Hitachi, Ltd. | Wärmeleitfähige, elektrisch nicht leitende Zusammensetzung |
DE19850826A1 (de) | 1998-11-04 | 2000-05-11 | Basf Ag | Als Separatoren in elektrochemischen Zellen geeignete Verbundkörper |
US6242825B1 (en) * | 1998-11-25 | 2001-06-05 | Hitachi, Ltd. | Electric rotating machine with reduced thickness and volume of insulation |
US6048919A (en) | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
ATE464339T1 (de) | 1999-02-16 | 2010-04-15 | Dendritic Nanotechnologies Inc | Kern-schale tectodendrimere |
US6572935B1 (en) | 1999-03-13 | 2003-06-03 | The Regents Of The University Of California | Optically transparent, scratch-resistant, diamond-like carbon coatings |
US6238790B1 (en) * | 1999-05-26 | 2001-05-29 | Siemens Westinghouse Power Corporation | Superdielectric high voltage insulation for dynamoelectric machinery |
CN1215490C (zh) | 1999-08-27 | 2005-08-17 | 株式会社日立制作所 | 绝缘材料和电机绕组及其制造方法 |
US6572937B2 (en) * | 1999-11-30 | 2003-06-03 | The Regents Of The University Of California | Method for producing fluorinated diamond-like carbon films |
US6510059B2 (en) * | 1999-12-17 | 2003-01-21 | Matsushita Electric Industrial Co., Ltd. | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
WO2001061719A1 (en) | 2000-02-16 | 2001-08-23 | Fullerene International Corporation | Diamond/carbon nanotube structures for efficient electron field emission |
US6190775B1 (en) * | 2000-02-24 | 2001-02-20 | Siemens Westinghouse Power Corporation | Enhanced dielectric strength mica tapes |
TW555794B (en) | 2000-02-29 | 2003-10-01 | Shinetsu Chemical Co | Method for the preparation of low specific gravity silicone rubber elastomers |
AU2001247491A1 (en) | 2000-03-16 | 2001-09-24 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
FR2808622B1 (fr) | 2000-05-04 | 2006-09-08 | Bollore | Generateur electrochimique a electrolyte polymerique comprenant des polymeres fluores |
US20020058140A1 (en) * | 2000-09-18 | 2002-05-16 | Dana David E. | Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
JP4665336B2 (ja) * | 2001-04-26 | 2011-04-06 | 住友ベークライト株式会社 | エポキシ樹脂組成物の製造方法及び半導体装置 |
JP3576119B2 (ja) * | 2001-04-27 | 2004-10-13 | 株式会社東芝 | 回転電機のコイル及びこのコイルの絶縁に用いられるマイカーテープ |
US20030040563A1 (en) | 2001-08-23 | 2003-02-27 | Sagal E. Mikhail | Substantially non-abrasive thermally conductive polymer composition containing boron nitride |
CN1321232C (zh) * | 2001-09-20 | 2007-06-13 | 昭和电工株式会社 | 细碳纤维混合物及其组合物 |
EP1300439A1 (de) | 2001-09-26 | 2003-04-09 | Abb Research Ltd. | Füllstoff für die Verwendung in elektrischen Feststoff-Isolatoren |
WO2003040445A1 (en) | 2001-11-07 | 2003-05-15 | Showa Denko K.K. | Fine carbon fiber, method for producing the same and use thereof |
US20030139510A1 (en) * | 2001-11-13 | 2003-07-24 | Sagal E. Mikhail | Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom |
US6746758B2 (en) * | 2002-02-25 | 2004-06-08 | Hitachi, Ltd. | Insulating material and electric machine winding and method for manufacturing the same |
WO2003078652A2 (en) | 2002-03-15 | 2003-09-25 | Nanomix, Inc. | Modification of selectivity for sensing for nanostructure device arrays |
CN1324615C (zh) * | 2002-07-04 | 2007-07-04 | 株式会社东芝 | 高导热性绝缘部件及其制造方法、电磁线圈 |
US7524557B2 (en) * | 2002-07-04 | 2009-04-28 | Kabushiki Kaisha Toshiba | Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device |
JP2004051852A (ja) | 2002-07-22 | 2004-02-19 | Polymatech Co Ltd | 熱伝導性高分子成形体及びその製造方法 |
US20060034787A1 (en) * | 2002-12-10 | 2006-02-16 | Patrice Bujard | Flake-form pigments based on aluminium |
US7250477B2 (en) * | 2002-12-20 | 2007-07-31 | General Electric Company | Thermoset composite composition, method, and article |
JP2004250665A (ja) | 2003-01-30 | 2004-09-09 | Suzuka Fuji Xerox Co Ltd | 耐熱性熱伝導性材料 |
US7013965B2 (en) | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
JP3843967B2 (ja) * | 2003-06-11 | 2006-11-08 | 三菱電機株式会社 | 絶縁コイルの製造方法 |
US7033670B2 (en) | 2003-07-11 | 2006-04-25 | Siemens Power Generation, Inc. | LCT-epoxy polymers with HTC-oligomers and method for making the same |
US7042346B2 (en) | 2003-08-12 | 2006-05-09 | Gaige Bradley Paulsen | Radio frequency identification parts verification system and method for using same |
US20050116336A1 (en) | 2003-09-16 | 2005-06-02 | Koila, Inc. | Nano-composite materials for thermal management applications |
JP4599063B2 (ja) | 2004-01-15 | 2010-12-15 | 株式会社東芝 | コイル巻回用絶縁テープ |
US20050236606A1 (en) | 2004-04-26 | 2005-10-27 | Certainteed Corporation | Flame resistant fibrous insulation and methods of making the same |
US7553438B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
US7553781B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Fabrics with high thermal conductivity coatings |
US7776392B2 (en) | 2005-04-15 | 2010-08-17 | Siemens Energy, Inc. | Composite insulation tape with loaded HTC materials |
US20050277721A1 (en) | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials aligned within resins |
US20080050580A1 (en) | 2004-06-15 | 2008-02-28 | Stevens Gary C | High Thermal Conductivity Mica Paper Tape |
US7268293B2 (en) | 2004-06-15 | 2007-09-11 | Siemen Power Generation, Inc. | Surface coating of lapped insulation tape |
US8216672B2 (en) | 2004-06-15 | 2012-07-10 | Siemens Energy, Inc. | Structured resin systems with high thermal conductivity fillers |
US7592045B2 (en) | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
US7180409B2 (en) | 2005-03-11 | 2007-02-20 | Temic Automotive Of North America, Inc. | Tire tread wear sensor system |
US7651963B2 (en) | 2005-04-15 | 2010-01-26 | Siemens Energy, Inc. | Patterning on surface with high thermal conductivity materials |
US7846853B2 (en) | 2005-04-15 | 2010-12-07 | Siemens Energy, Inc. | Multi-layered platelet structure |
US20060234027A1 (en) | 2005-04-18 | 2006-10-19 | Huusken Robert W | Fire retardant laminate |
US20070026221A1 (en) | 2005-06-14 | 2007-02-01 | Siemens Power Generation, Inc. | Morphological forms of fillers for electrical insulation |
US7781057B2 (en) | 2005-06-14 | 2010-08-24 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
US7955661B2 (en) | 2005-06-14 | 2011-06-07 | Siemens Energy, Inc. | Treatment of micropores in mica materials |
US8357433B2 (en) | 2005-06-14 | 2013-01-22 | Siemens Energy, Inc. | Polymer brushes |
US7655295B2 (en) | 2005-06-14 | 2010-02-02 | Siemens Energy, Inc. | Mix of grafted and non-grafted particles in a resin |
JP4996086B2 (ja) * | 2005-09-29 | 2012-08-08 | 株式会社東芝 | マイカテープおよびこのマイカテープを用いた回転電機コイル |
US7547847B2 (en) | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
-
2006
- 2006-04-03 US US11/396,989 patent/US7655295B2/en not_active Expired - Fee Related
-
2007
- 2007-01-03 WO PCT/US2007/000081 patent/WO2007114873A1/en active Application Filing
- 2007-01-03 EP EP20070716248 patent/EP2001945A1/en not_active Withdrawn
- 2007-01-03 CN CN2007800206591A patent/CN101479332B/zh not_active Expired - Fee Related
- 2007-01-03 KR KR1020087026914A patent/KR101405836B1/ko not_active IP Right Cessation
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-
2010
- 2010-01-28 US US12/695,279 patent/US20100120928A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008502816A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | ナノフィラーのダイヤモンドライクコーティング |
JP2008502782A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高熱伝導性充填剤を有する構造化樹脂系 |
JP2008502779A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | グラフトされた表面官能基を有する高熱伝導性材料 |
JP2008504378A (ja) * | 2004-06-15 | 2008-02-14 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂に組込まれた高熱伝導性材料 |
JP2008507594A (ja) * | 2004-06-15 | 2008-03-13 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂内に配列した高熱伝導性材料 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011093079A1 (ja) * | 2010-01-28 | 2011-08-04 | 三井化学株式会社 | 金属樹脂複合体 |
JPWO2011093079A1 (ja) * | 2010-01-28 | 2013-05-30 | 三井化学株式会社 | 金属樹脂複合体 |
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EP2001945A1 (en) | 2008-12-17 |
CN101479332B (zh) | 2012-07-04 |
CN101479332A (zh) | 2009-07-08 |
JP5574703B2 (ja) | 2014-08-20 |
US7655295B2 (en) | 2010-02-02 |
US20060281833A1 (en) | 2006-12-14 |
WO2007114873A1 (en) | 2007-10-11 |
KR20090005360A (ko) | 2009-01-13 |
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US20100120928A1 (en) | 2010-05-13 |
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