JP2008504378A - 樹脂に組込まれた高熱伝導性材料 - Google Patents
樹脂に組込まれた高熱伝導性材料 Download PDFInfo
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- JP2008504378A JP2008504378A JP2007516677A JP2007516677A JP2008504378A JP 2008504378 A JP2008504378 A JP 2008504378A JP 2007516677 A JP2007516677 A JP 2007516677A JP 2007516677 A JP2007516677 A JP 2007516677A JP 2008504378 A JP2008504378 A JP 2008504378A
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2926—Coated or impregnated inorganic fiber fabric
- Y10T442/2992—Coated or impregnated glass fiber fabric
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/50—FELT FABRIC
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Abstract
Description
本出願は、2004年6月15日に提出したスミス(Smith)らによる仮出願のUS 60/580,023に優先権を主張するものであり、これを参照して本明細書中に取入れることとする。本出願は、さらに米国特許明細書"樹脂内に配列した熱伝導性材料"、"グラフトした表面官能基を有する高熱伝導性材料"、"高熱伝導性充填剤を有する構造化樹脂系"にも関し、全てスミスらにより本明細書と共に提出された。よって、本明細書中に全てを参照して取入れることとする。
本発明の分野は、樹脂に含浸した高熱伝導性材料に関する。
どのような形の電気器具の使用でも、電気絶縁コンダクターが必要である。全ての電気系と電子系の大きさを常に減少させ、かつ合理化させる後押しにより、より良好で、かつよりコンパクトな絶縁体ならびに絶縁系を相応して見出す必要がある。
上記のことを念頭において、方法と装置は、本発明のものと一致する。これは特に高熱伝導性(HTC)含浸媒体を通るフォノンの輸送を容易にして、HTC材料間の距離を平均フォノン行程の長さ以下に下げる。これはフォノン散乱を減少し、熱源から離れて、より大きなフォノンの正味のフローまたはフラックスを生じる。従って、樹脂は多層絶縁テープのようなホストマトリックス媒体に含浸される。
本発明を以下の図面について例を用いて更に詳細に説明する。
高熱伝導(HTC)性コンポジットは、2相の有機−無機ハイブリッド材料である充填剤と組合わさった樹脂性ホストネットワークを有する。有機−無機ハイブリッド材料は、2相の有機−無機コンポジットから、分子合金をベースとする有機−無機連続相材料から、ならびにディスクリートな有機−デンドリマー型コンポジットから形成することができ、その際、有機−無機界面はデンドリマー型コア−シェル構造とはディスクリートではない。構造エレメントの長さスケールが熱輸送に重要なフォノン分布よりも短いか、または釣り合うことを保証することにより、フォノン輸送が増大し、フォノン散乱が減少する。
Claims (24)
- ホスト樹脂マトリックスと高熱伝導性充填剤とを有する高熱伝導性樹脂であって、前記高熱伝導性充填剤は前記ホスト樹脂マトリックスと連続した有機−無機コンポジットを形成し、前記高熱伝導性充填剤は、長さ1〜1000nmであり、かつ高熱伝導性充填剤は、3〜100の間のアスペクト比を有する高熱伝導性樹脂。
- 高熱伝導性充填剤は、10〜50の間のアスペクト比を有する、請求項1に記載の高熱伝導性樹脂。
- 高熱伝導性充填剤は、2相の有機−無機コンポジットから形成される、請求項1に記載の高熱伝導性樹脂。
- 有機−無機コンポジットには、少なくとも1つの多面体オリゴマー状シルセスキオキサン、テトラエチルオルトシリケートおよびテトラブチルオルトチタネートが含まれる、請求項3に記載の高熱伝導性樹脂。
- 反応性表面基は、前記高熱伝導性充填剤の上に存在する、請求項3に記載の高熱伝導性樹脂。
- 高熱伝導性充填剤は、有機−無機連続相材料から形成される、請求項1に記載の高熱伝導性樹脂。
- 高熱伝導性充填剤は、ディスクリートな有機デンドリマーコンポジットから形成される、請求項1に記載の高熱伝導性樹脂。
- 高熱伝導性充填剤は、ディスクリートな有機−無機デンドリマーコンポジットから形成される、請求項1に記載の高熱伝導性樹脂。
- ホスト樹脂ネットワークと、前記ホスト樹脂ネットワーク中に均質に分散し、かつ事実上完全にホスト樹脂ネットワークと共反応する無機高熱伝導性充填剤とを有する連続した有機−無機樹脂であって、前記高熱伝導性樹脂は1〜1000nmの長さと10〜50のアスペクト比を有し、前記高熱伝導性充填剤は、少なくとも1つの酸化物、窒化物および炭化物から選択され、前記高熱伝導性充填剤は表面処理されて、ホスト樹脂ネットワークと事実上完全に共反応を可能にする表面官能基が導入されていて、前記の連続した有機−無機樹脂は、最大で60体積%の高熱伝導性充填剤を有する、連続した有機−無機樹脂。
- 少なくとも1つの酸化物、窒化物および炭化物は、混ざった化学量論および非化学量論的組合せを有するAl2O3、AlN、MgO、ZnO、BeO、BN、Si3N4、SiCおよびSiO2を有する、請求項9に記載の連続した有機−無機樹脂。
- 連続した有機−無機樹脂は、最大で35体積%の高熱伝導性充填剤を有する、請求項9に記載の連続した有機−無機樹脂。
- 官能基は、少なくとも1つのヒドロキシル基、カルボン酸基、アミン基、エポキシド基、シラン基およびビニル基を有する、請求項9に記載の連続した有機−無機樹脂。
- ホスト樹脂ネットワークには、エポキシ、ポリイミドエポキシ、液晶エポキシおよびシアネートエステルが含まれる、請求項9に記載の連続した有機−無機樹脂。
- 連続した有機−無機樹脂は、さらに架橋剤を有する、請求項9に記載の連続した有機−無機樹脂。
- 連続した有機−無機樹脂は多孔質媒体中に含浸される、請求項9に記載の連続した有機−無機樹脂。
- 多孔質媒体と、高熱伝導性材料を装填した樹脂とを有する高熱伝導性樹脂で含浸した多孔質媒体であって、前記高熱伝導性材料は、前記樹脂を5〜60体積%有し、前記高熱伝導性材料は約1〜1000nmの大きさの少なくとも1つのシリカ、アルミナ、酸化マグネシウム、炭化ケイ素、窒化ホウ素、窒化アルミニウム、酸化亜鉛およびダイヤモンドならびにデンドリマーを有し、かつ前記高熱伝導性材料は、10〜50のアスペクト比を有する、高熱伝導性樹脂で含浸した多孔質媒体。
- 高熱伝導性材料は、前記樹脂を25〜40体積%有する、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体は、紙マトリックスである、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 紙マトリックスは、マイカ−ガラス絶縁紙である、請求項18に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体は、回路基板のガラス繊維成分である、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体は、少なくとも1つの天然の有機および無機ポリマー繊維マトリックスおよび織物である、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体は、少なくとも1つの合成の有機および無機ポリマー繊維マトリックスおよび織物である、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体はクロスマットである、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
- 多孔質媒体はフェルトである、請求項16に記載の高熱伝導性樹脂で含浸した多孔質媒体。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58002304P | 2004-06-15 | 2004-06-15 | |
US60/580,023 | 2004-06-15 | ||
US11/152,983 | 2005-06-14 | ||
US11/152,983 US20050277349A1 (en) | 2004-06-15 | 2005-06-14 | High thermal conductivity materials incorporated into resins |
PCT/US2005/021116 WO2005123867A2 (en) | 2004-06-15 | 2005-06-15 | High thermal conductivity materials incorporated into resins |
Publications (2)
Publication Number | Publication Date |
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JP2008504378A true JP2008504378A (ja) | 2008-02-14 |
JP5108511B2 JP5108511B2 (ja) | 2012-12-26 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007516677A Expired - Fee Related JP5108511B2 (ja) | 2004-06-15 | 2005-06-15 | 樹脂に組込まれた高熱伝導性材料 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050277349A1 (ja) |
EP (1) | EP1786881A2 (ja) |
JP (1) | JP5108511B2 (ja) |
KR (1) | KR101313137B1 (ja) |
WO (1) | WO2005123867A2 (ja) |
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JP2008502775A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂含浸絶縁テープの圧縮 |
JP2009532556A (ja) * | 2006-04-03 | 2009-09-10 | シーメンス エナジー インコーポレイテッド | 樹脂におけるグラフト化粒子及び非グラフト化粒子の混合物 |
JP2009302150A (ja) * | 2008-06-10 | 2009-12-24 | Goo Chemical Co Ltd | 放熱性樹脂組成物、放熱性ソルダーレジスト用組成物、放熱性成形体、及び放熱性プリント配線板 |
US8173723B2 (en) | 2008-12-10 | 2012-05-08 | Cheil Industries Inc. | EMI/RFI shielding resin composite material and molded product made using the same |
WO2016078432A1 (zh) * | 2014-11-18 | 2016-05-26 | 中国科学院深圳先进技术研究院 | 改性氧化铝复合材料、覆铜基板及其制备方法 |
JP2016527365A (ja) * | 2013-07-29 | 2016-09-08 | ユニバーシティ・オブ・サウス・アラバマ | ナノ構造状に配列したマルチスケール複合材料の製造方法 |
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- 2005-06-15 WO PCT/US2005/021116 patent/WO2005123867A2/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
EP1786881A2 (en) | 2007-05-23 |
US20050277349A1 (en) | 2005-12-15 |
KR20070028540A (ko) | 2007-03-12 |
WO2005123867A2 (en) | 2005-12-29 |
KR101313137B1 (ko) | 2013-09-30 |
WO2005123867A3 (en) | 2006-03-02 |
JP5108511B2 (ja) | 2012-12-26 |
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