JP2009531710A - センサアレイの制御回路及び関連する方法 - Google Patents

センサアレイの制御回路及び関連する方法 Download PDF

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Publication number
JP2009531710A
JP2009531710A JP2009502804A JP2009502804A JP2009531710A JP 2009531710 A JP2009531710 A JP 2009531710A JP 2009502804 A JP2009502804 A JP 2009502804A JP 2009502804 A JP2009502804 A JP 2009502804A JP 2009531710 A JP2009531710 A JP 2009531710A
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Japan
Prior art keywords
pressure
force
array
sensor
sensor element
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JP2009502804A
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Japanese (ja)
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JP2009531710A5 (https=
Inventor
ルーミス，ゲアリー
レフコ，ジャネット
ドゥビンスキー，ボリス
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Tekscan Inc
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Tekscan Inc
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Publication of JP2009531710A publication Critical patent/JP2009531710A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2009502804A 2006-03-29 2007-02-27 センサアレイの制御回路及び関連する方法 Pending JP2009531710A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/392,207 US20070235231A1 (en) 2006-03-29 2006-03-29 Control circuit for sensor array and related methods
PCT/US2007/005120 WO2007126518A1 (en) 2006-03-29 2007-02-27 Control circuit for sensor array and related methods

Publications (2)

Publication Number Publication Date
JP2009531710A true JP2009531710A (ja) 2009-09-03
JP2009531710A5 JP2009531710A5 (https=) 2010-04-22

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JP2009502804A Pending JP2009531710A (ja) 2006-03-29 2007-02-27 センサアレイの制御回路及び関連する方法

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US (1) US20070235231A1 (https=)
EP (1) EP2002231B1 (https=)
JP (1) JP2009531710A (https=)
CA (1) CA2647296C (https=)
WO (1) WO2007126518A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013027594A1 (ja) * 2011-08-22 2013-02-28 ニッタ株式会社 感圧センサ検査装置及び方法
JP2018046013A (ja) * 2016-09-16 2018-03-22 ドクター エンジニール ハー ツェー エフ ポルシェ アクチエンゲゼルシャフトＤｒ． Ｉｎｇ． ｈ．ｃ． Ｆ． Ｐｏｒｓｃｈｅ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ トラクションバッテリ、およびそのようなバッテリを有する車両
JP2018510427A (ja) * 2015-06-01 2018-04-12 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ圧力を感知するタッチ入力装置の感度補正方法及びコンピュータ読取可能な記録媒体

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8547114B2 (en) 2006-11-14 2013-10-01 Cypress Semiconductor Corporation Capacitance to code converter with sigma-delta modulator
US8125455B2 (en) * 2007-01-03 2012-02-28 Apple Inc. Full scale calibration measurement for multi-touch surfaces
WO2009006557A1 (en) 2007-07-03 2009-01-08 Cypress Semiconductor Corporation Method for improving scan time and sensitivity in touch sensitive user interface device
EP2247998B1 (en) * 2008-02-28 2019-04-10 New York University Method and apparatus for providing input to a processor, and a sensor pad
TWI397850B (zh) * 2008-05-14 2013-06-01 Ind Tech Res Inst 感測裝置及其掃描驅動方法
US9342202B2 (en) * 2009-01-23 2016-05-17 Qualcomm Incorporated Conductive multi-touch touch panel
US9740341B1 (en) 2009-02-26 2017-08-22 Amazon Technologies, Inc. Capacitive sensing with interpolating force-sensitive resistor array
US9069405B2 (en) 2009-07-28 2015-06-30 Cypress Semiconductor Corporation Dynamic mode switching for fast touch response
US8723825B2 (en) 2009-07-28 2014-05-13 Cypress Semiconductor Corporation Predictive touch surface scanning
US8723827B2 (en) 2009-07-28 2014-05-13 Cypress Semiconductor Corporation Predictive touch surface scanning
US9740340B1 (en) 2009-07-31 2017-08-22 Amazon Technologies, Inc. Visually consistent arrays including conductive mesh
US9785272B1 (en) * 2009-07-31 2017-10-10 Amazon Technologies, Inc. Touch distinction
WO2011088147A2 (en) * 2010-01-12 2011-07-21 Sensitronics, LLC Method and apparatus for multi-touch sensing
CN102892354A (zh) 2010-03-12 2013-01-23 茵汉斯瑟菲斯动力公司 用于从压力感测系统中的压力传感器快速收集数据的系统和方法
CA2734427C (en) * 2010-03-19 2018-05-08 Xavier Pierre-Emmanuel Saynac Systems and methods for determining the location and pressure of a touchload applied to a touchpad
JP5429814B2 (ja) * 2010-03-29 2014-02-26 株式会社ワコム 指示体検出装置および検出センサ
JP5778273B2 (ja) 2010-07-16 2015-09-16 クーライト・セミコンダクター・プロダクツ・インコーポレーテッド 交換可能なセンサプレートを備える圧力スキャナアセンブリ
BR112014000766A2 (pt) 2011-07-13 2017-02-14 Enhanced Surface Dynamics Inc método para fabricação de a esteira de sensibilidade de pressão; e método para testar uma esteira de sensibilidade de pressão
CN203523055U (zh) * 2011-10-26 2014-04-02 光达家电用品公司 电加热织物和检测感测线完整性的电路完整性检测系统
EP2614806A1 (en) * 2012-01-12 2013-07-17 Caremed Supply, Inc. Air cushion bed with sensing mat capable of detecting the lying of a patient thereon
US20200367605A1 (en) 2012-04-18 2020-11-26 Frampton E. Ellis Smartphone-controlled active configuration of footwear, including with concavely rounded soles
US9030335B2 (en) 2012-04-18 2015-05-12 Frampton E. Ellis Smartphones app-controlled configuration of footwear soles using sensors in the smartphone and the soles
US9877523B2 (en) 2012-04-18 2018-01-30 Frampton E. Ellis Bladders, compartments, chambers or internal sipes controlled by a computer system using big data techniques and a smartphone device
US11901072B2 (en) 2012-04-18 2024-02-13 Frampton E. Ellis Big data artificial intelligence computer system used for medical care connected to millions of sensor-equipped smartphones connected to their users' configurable footwear soles with sensors and to body sensors
US10226082B2 (en) 2012-04-18 2019-03-12 Frampton E. Ellis Smartphone-controlled active configuration of footwear, including with concavely rounded soles
US9493342B2 (en) 2012-06-21 2016-11-15 Nextinput, Inc. Wafer level MEMS force dies
WO2014008377A1 (en) 2012-07-05 2014-01-09 Ian Campbell Microelectromechanical load sensor and methods of manufacturing the same
KR102270454B1 (ko) 2013-09-27 2021-06-29 센셀, 인크. 용량성 터치 센서 시스템 및 방법
US10013092B2 (en) * 2013-09-27 2018-07-03 Sensel, Inc. Tactile touch sensor system and method
US11221706B2 (en) 2013-09-27 2022-01-11 Sensel, Inc. Tactile touch sensor system and method
US9001082B1 (en) 2013-09-27 2015-04-07 Sensel, Inc. Touch sensor detector system and method
GB201317478D0 (en) * 2013-10-02 2013-11-13 Provost Fellows Foundation Scholars And The Other Members Of Board Of The A sensor for an oral appliance
CN105934661B (zh) 2014-01-13 2019-11-05 触控解决方案股份有限公司 微型强化圆片级mems力传感器
US9367193B2 (en) * 2014-07-14 2016-06-14 Uneo Inc. Multi-touch pad
US11513042B2 (en) * 2015-01-26 2022-11-29 SPEX SamplePrep, LLC Power-compensated fusion furnace
US10466119B2 (en) 2015-06-10 2019-11-05 Nextinput, Inc. Ruggedized wafer level MEMS force sensor with a tolerance trench
EP3132976B1 (en) 2015-08-17 2019-04-03 Thule Sweden AB Roof rack comprising a load sensor
US10492734B2 (en) 2016-11-04 2019-12-03 Wellsense, Inc. Patient visualization system
US11083418B2 (en) 2016-11-04 2021-08-10 Wellsense, Inc. Patient visualization system
WO2018148510A1 (en) 2017-02-09 2018-08-16 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
EP4701393A2 (en) 2017-02-09 2026-02-25 Nextinput, Inc. Integrated digital force sensors and related methods of manufacture
US11141109B2 (en) 2017-06-28 2021-10-12 Kube Innovation Inc. Bite force measuring system and mouthpiece
EP3655740A4 (en) 2017-07-19 2021-07-14 Nextinput, Inc. VOLTAGE TRANSFER STACKING IN A MEMS FORCE SENSOR
WO2019023309A1 (en) 2017-07-25 2019-01-31 Nextinput, Inc. FORCE SENSOR AND INTEGRATED FINGERPRINTS
WO2019023552A1 (en) 2017-07-27 2019-01-31 Nextinput, Inc. PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME
WO2019079420A1 (en) 2017-10-17 2019-04-25 Nextinput, Inc. SHIFT TEMPERATURE COEFFICIENT COMPENSATION FOR FORCE SENSOR AND STRAIN GAUGE
WO2019090057A1 (en) 2017-11-02 2019-05-09 Nextinput, Inc. Sealed force sensor with etch stop layer
WO2019099821A1 (en) 2017-11-16 2019-05-23 Nextinput, Inc. Force attenuator for force sensor
US10962427B2 (en) 2019-01-10 2021-03-30 Nextinput, Inc. Slotted MEMS force sensor
US11852561B2 (en) * 2021-04-30 2023-12-26 Tekscan, Inc. Portable tire contact sensors
CN113709390B (zh) * 2021-08-25 2022-06-10 豪威芯仑传感器(上海)有限公司 一种扫描器电路及图像传感器
CN116593041A (zh) * 2022-12-31 2023-08-15 北京津发科技股份有限公司 一种压力信号拟合方法和装置
WO2025250998A1 (en) * 2024-05-30 2025-12-04 The Johns Hopkins University Scalable sensor arrays through row column compressive sensing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237879A (en) * 1991-10-11 1993-08-24 At&T Bell Laboratories Apparatus for dynamically varying the resolution of a tactile sensor array
JPH10508943A (ja) * 1994-11-15 1998-09-02 テクスカン・インコーポレーテッド 圧力応答アレーのための走査回路
JP2000329511A (ja) * 1999-05-19 2000-11-30 Sony Corp データグローブ及びこれを用いた形状認識方法
JP2002501271A (ja) * 1998-01-26 2002-01-15 ウェスターマン，ウェイン 手操作入力を統合する方法および装置
US6374681B1 (en) * 1999-10-14 2002-04-23 Marcel Vanuytven Electronic scanning device to measure at high speed, physical properties of large multi-dimensional arrays

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4111058A (en) * 1977-09-22 1978-09-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Electrically scanned pressure sensor module with in situ calibration capability
US4856993A (en) * 1985-03-29 1989-08-15 Tekscan, Inc. Pressure and contact sensor system for measuring dental occlusion
US4665440A (en) * 1985-09-17 1987-05-12 Honeywell, Inc. Parallel processing of the output from monolithic sensor arrays
US5010774A (en) * 1987-11-05 1991-04-30 The Yokohama Rubber Co., Ltd. Distribution type tactile sensor
US5086652A (en) * 1991-02-25 1992-02-11 Fel-Pro Incorporated Multiple pad contact sensor and method for measuring contact forces at a plurality of separate locations
JPH04291887A (ja) * 1991-03-20 1992-10-15 Sony Corp 電荷転送装置
US5914465A (en) * 1992-06-08 1999-06-22 Synaptics, Inc. Object position detector
US5515040A (en) * 1993-09-28 1996-05-07 Sejin Electron, Incorporated Methods of self-calibration for a key-type mouse
US5736656A (en) * 1996-05-22 1998-04-07 Fullen Systems, Inc. Apparatus and method for measuring the magnitude and distribution of forces on the foot of a quadruped
US5756904A (en) * 1996-08-30 1998-05-26 Tekscan, Inc. Pressure responsive sensor having controlled scanning speed
US5905209A (en) * 1997-07-22 1999-05-18 Tekscan, Inc. Output circuit for pressure sensor
US6226271B1 (en) * 1997-09-26 2001-05-01 Ericsson Inc. Received signal strength determination method, apparatus and computer program products
US7663607B2 (en) * 2004-05-06 2010-02-16 Apple Inc. Multipoint touchscreen
US6825765B2 (en) * 1998-12-30 2004-11-30 Automotive Systems Laboratory, Inc. Occupant detection system
US6794671B2 (en) * 2002-07-17 2004-09-21 Particle Sizing Systems, Inc. Sensors and methods for high-sensitivity optical particle counting and sizing
DE10325406B4 (de) * 2003-06-05 2005-04-28 Eads Deutschland Gmbh Schadensermittlung an zu prüfenden Strukturen mittels Ultraschall
US7030378B2 (en) * 2003-08-05 2006-04-18 Bae Systems Information And Electronic Systems Integration, Inc. Real-time radiation sensor calibration
US7113179B2 (en) * 2004-06-23 2006-09-26 Interlink Electronics, Inc. Force sensing resistor with calibration element and method of manufacturing same
US7171179B2 (en) * 2004-06-28 2007-01-30 Broadcom Corporation Adjustment of a received signal strength indication module
US20060077182A1 (en) * 2004-10-08 2006-04-13 Studt Peter C Methods and systems for providing user selectable touch screen functionality
US7331245B2 (en) * 2005-11-22 2008-02-19 Avago Technologies Ecbu Ip Pte Ltd Pressure distribution sensor and sensing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237879A (en) * 1991-10-11 1993-08-24 At&T Bell Laboratories Apparatus for dynamically varying the resolution of a tactile sensor array
JPH10508943A (ja) * 1994-11-15 1998-09-02 テクスカン・インコーポレーテッド 圧力応答アレーのための走査回路
JP2002501271A (ja) * 1998-01-26 2002-01-15 ウェスターマン，ウェイン 手操作入力を統合する方法および装置
JP2000329511A (ja) * 1999-05-19 2000-11-30 Sony Corp データグローブ及びこれを用いた形状認識方法
US6374681B1 (en) * 1999-10-14 2002-04-23 Marcel Vanuytven Electronic scanning device to measure at high speed, physical properties of large multi-dimensional arrays

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013027594A1 (ja) * 2011-08-22 2013-02-28 ニッタ株式会社 感圧センサ検査装置及び方法
JP2013044550A (ja) * 2011-08-22 2013-03-04 Nitta Ind Corp 抵抗検査装置、抵抗検査方法、及び抵抗検査プログラム
JP2018510427A (ja) * 2015-06-01 2018-04-12 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ圧力を感知するタッチ入力装置の感度補正方法及びコンピュータ読取可能な記録媒体
JP2018046013A (ja) * 2016-09-16 2018-03-22 ドクター エンジニール ハー ツェー エフ ポルシェ アクチエンゲゼルシャフトＤｒ． Ｉｎｇ． ｈ．ｃ． Ｆ． Ｐｏｒｓｃｈｅ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ トラクションバッテリ、およびそのようなバッテリを有する車両

Also Published As

Publication number Publication date
EP2002231B1 (en) 2012-08-29
CA2647296A1 (en) 2007-11-08
WO2007126518A1 (en) 2007-11-08
US20070235231A1 (en) 2007-10-11
EP2002231A1 (en) 2008-12-17
CA2647296C (en) 2013-02-26

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