JP2009531192A - 研磨パッド、研磨装置、及び研磨パッドの使用方法 - Google Patents

研磨パッド、研磨装置、及び研磨パッドの使用方法 Download PDF

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Publication number
JP2009531192A
JP2009531192A JP2009503109A JP2009503109A JP2009531192A JP 2009531192 A JP2009531192 A JP 2009531192A JP 2009503109 A JP2009503109 A JP 2009503109A JP 2009503109 A JP2009503109 A JP 2009503109A JP 2009531192 A JP2009531192 A JP 2009531192A
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JP
Japan
Prior art keywords
polishing
layer
pad
window
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009503109A
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English (en)
Japanese (ja)
Other versions
JP2009531192A5 (enExample
Inventor
イー． ボッテマ、ブライアン
エフ． エイブラハム、スティーブン
ピー． パマタット、アレックス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2009531192A publication Critical patent/JP2009531192A/ja
Publication of JP2009531192A5 publication Critical patent/JP2009531192A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2009503109A 2006-03-27 2007-02-20 研磨パッド、研磨装置、及び研磨パッドの使用方法 Pending JP2009531192A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/390,292 US7179151B1 (en) 2006-03-27 2006-03-27 Polishing pad, a polishing apparatus, and a process for using the polishing pad
PCT/US2007/062400 WO2007120982A2 (en) 2006-03-27 2007-02-20 Polishing pad, a polishing apparatus, and a process for using the polishing pad

Publications (2)

Publication Number Publication Date
JP2009531192A true JP2009531192A (ja) 2009-09-03
JP2009531192A5 JP2009531192A5 (enExample) 2010-04-08

Family

ID=37744898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009503109A Pending JP2009531192A (ja) 2006-03-27 2007-02-20 研磨パッド、研磨装置、及び研磨パッドの使用方法

Country Status (6)

Country Link
US (1) US7179151B1 (enExample)
JP (1) JP2009531192A (enExample)
KR (1) KR20080100277A (enExample)
CN (1) CN101400479B (enExample)
TW (1) TW200744796A (enExample)
WO (1) WO2007120982A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011200962A (ja) * 2010-03-25 2011-10-13 Toray Ind Inc 研磨パッド
JP2024525530A (ja) * 2021-07-06 2024-07-12 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための音響窓を含む研磨パッド

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US7497763B2 (en) * 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
DE102010011470B9 (de) * 2010-03-09 2016-09-29 Nagel Maschinen- Und Werkzeugfabrik Gmbh Verfahren und Vorrichtung zur messungsunterstützten Feinbearbeitung von Werkstückoberflächen sowie Messsystem
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
US20220305613A1 (en) * 2021-03-26 2022-09-29 Applied Materials, Inc. Controlled profile polishing platen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP2002324769A (ja) * 2001-04-25 2002-11-08 Jsr Corp 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2004134539A (ja) * 2002-10-09 2004-04-30 Jsr Corp 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2005175464A (ja) * 2003-11-25 2005-06-30 Rohm & Haas Electronic Materials Cmp Holdings Inc 光透過性が高い窓を有する研磨パッド
JP2005522024A (ja) * 2002-03-28 2005-07-21 ラム　リサーチ　コーポレーション 化学機械研磨における処理の状態把握および制御のためにウエハ表面構造の遷移を検知する装置および方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5461007A (en) 1994-06-02 1995-10-24 Motorola, Inc. Process for polishing and analyzing a layer over a patterned semiconductor substrate
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6323046B1 (en) * 1998-08-25 2001-11-27 Micron Technology, Inc. Method and apparatus for endpointing a chemical-mechanical planarization process
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6599765B1 (en) 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN1302522C (zh) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP2002324769A (ja) * 2001-04-25 2002-11-08 Jsr Corp 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2005522024A (ja) * 2002-03-28 2005-07-21 ラム　リサーチ　コーポレーション 化学機械研磨における処理の状態把握および制御のためにウエハ表面構造の遷移を検知する装置および方法
JP2004134539A (ja) * 2002-10-09 2004-04-30 Jsr Corp 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2005175464A (ja) * 2003-11-25 2005-06-30 Rohm & Haas Electronic Materials Cmp Holdings Inc 光透過性が高い窓を有する研磨パッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011200962A (ja) * 2010-03-25 2011-10-13 Toray Ind Inc 研磨パッド
JP2024525530A (ja) * 2021-07-06 2024-07-12 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための音響窓を含む研磨パッド

Also Published As

Publication number Publication date
US7179151B1 (en) 2007-02-20
KR20080100277A (ko) 2008-11-14
CN101400479B (zh) 2010-12-15
WO2007120982A3 (en) 2008-10-02
TW200744796A (en) 2007-12-16
CN101400479A (zh) 2009-04-01
WO2007120982A2 (en) 2007-10-25

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