CN101400479B - 抛光垫和抛光装置 - Google Patents

抛光垫和抛光装置 Download PDF

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Publication number
CN101400479B
CN101400479B CN2007800086621A CN200780008662A CN101400479B CN 101400479 B CN101400479 B CN 101400479B CN 2007800086621 A CN2007800086621 A CN 2007800086621A CN 200780008662 A CN200780008662 A CN 200780008662A CN 101400479 B CN101400479 B CN 101400479B
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CN
China
Prior art keywords
polishing
layer
pad
window
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800086621A
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English (en)
Chinese (zh)
Other versions
CN101400479A (zh
Inventor
B·E·伯特玛
S·F·阿布拉哈姆
A·P·帕玛塔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN101400479A publication Critical patent/CN101400479A/zh
Application granted granted Critical
Publication of CN101400479B publication Critical patent/CN101400479B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN2007800086621A 2006-03-27 2007-02-20 抛光垫和抛光装置 Expired - Fee Related CN101400479B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/390,292 US7179151B1 (en) 2006-03-27 2006-03-27 Polishing pad, a polishing apparatus, and a process for using the polishing pad
US11/390,292 2006-03-27
PCT/US2007/062400 WO2007120982A2 (en) 2006-03-27 2007-02-20 Polishing pad, a polishing apparatus, and a process for using the polishing pad

Publications (2)

Publication Number Publication Date
CN101400479A CN101400479A (zh) 2009-04-01
CN101400479B true CN101400479B (zh) 2010-12-15

Family

ID=37744898

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800086621A Expired - Fee Related CN101400479B (zh) 2006-03-27 2007-02-20 抛光垫和抛光装置

Country Status (6)

Country Link
US (1) US7179151B1 (enExample)
JP (1) JP2009531192A (enExample)
KR (1) KR20080100277A (enExample)
CN (1) CN101400479B (enExample)
TW (1) TW200744796A (enExample)
WO (1) WO2007120982A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7497763B2 (en) * 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
DE102010011470B9 (de) * 2010-03-09 2016-09-29 Nagel Maschinen- Und Werkzeugfabrik Gmbh Verfahren und Vorrichtung zur messungsunterstützten Feinbearbeitung von Werkstückoberflächen sowie Messsystem
JP5526911B2 (ja) * 2010-03-25 2014-06-18 東レ株式会社 研磨パッド
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
US20220305613A1 (en) * 2021-03-26 2022-09-29 Applied Materials, Inc. Controlled profile polishing platen
TWI879629B (zh) * 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280290B1 (en) * 1995-03-28 2001-08-28 Applied Materials, Inc. Method of forming a transparent window in a polishing pad
US6323046B1 (en) * 1998-08-25 2001-11-27 Micron Technology, Inc. Method and apparatus for endpointing a chemical-mechanical planarization process
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN1458673A (zh) * 2002-05-15 2003-11-26 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
CN1622289A (zh) * 2003-11-25 2005-06-01 Cmp罗姆和哈斯电子材料控股公司 具有高透光窗口的抛光垫
CN1660543A (zh) * 2004-02-27 2005-08-31 Cmp罗姆和哈斯电子材料控股公司 层状抛光垫的成形方法

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Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5461007A (en) 1994-06-02 1995-10-24 Motorola, Inc. Process for polishing and analyzing a layer over a patterned semiconductor substrate
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP3826728B2 (ja) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US6599765B1 (en) 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
JP3988611B2 (ja) * 2002-10-09 2007-10-10 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280290B1 (en) * 1995-03-28 2001-08-28 Applied Materials, Inc. Method of forming a transparent window in a polishing pad
US6323046B1 (en) * 1998-08-25 2001-11-27 Micron Technology, Inc. Method and apparatus for endpointing a chemical-mechanical planarization process
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN1458673A (zh) * 2002-05-15 2003-11-26 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
CN1622289A (zh) * 2003-11-25 2005-06-01 Cmp罗姆和哈斯电子材料控股公司 具有高透光窗口的抛光垫
CN1660543A (zh) * 2004-02-27 2005-08-31 Cmp罗姆和哈斯电子材料控股公司 层状抛光垫的成形方法

Also Published As

Publication number Publication date
KR20080100277A (ko) 2008-11-14
CN101400479A (zh) 2009-04-01
WO2007120982A3 (en) 2008-10-02
TW200744796A (en) 2007-12-16
WO2007120982A2 (en) 2007-10-25
US7179151B1 (en) 2007-02-20
JP2009531192A (ja) 2009-09-03

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Texas in the United States

Patentee after: NXP America Co Ltd

Address before: Texas in the United States

Patentee before: Fisical Semiconductor Inc.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101215

Termination date: 20190220