JP2009530859A5 - - Google Patents

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Publication number
JP2009530859A5
JP2009530859A5 JP2009501521A JP2009501521A JP2009530859A5 JP 2009530859 A5 JP2009530859 A5 JP 2009530859A5 JP 2009501521 A JP2009501521 A JP 2009501521A JP 2009501521 A JP2009501521 A JP 2009501521A JP 2009530859 A5 JP2009530859 A5 JP 2009530859A5
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JP
Japan
Prior art keywords
composition
acid amide
weight
ethylene copolymer
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009501521A
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English (en)
Japanese (ja)
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JP2009530859A (ja
JP5253373B2 (ja
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Publication date
Priority claimed from US11/386,143 external-priority patent/US20070221268A1/en
Application filed filed Critical
Publication of JP2009530859A publication Critical patent/JP2009530859A/ja
Publication of JP2009530859A5 publication Critical patent/JP2009530859A5/ja
Application granted granted Critical
Publication of JP5253373B2 publication Critical patent/JP5253373B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009501521A 2006-03-21 2007-03-20 電子部品用の封入剤 Expired - Fee Related JP5253373B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/386,143 2006-03-21
US11/386,143 US20070221268A1 (en) 2006-03-21 2006-03-21 Encapsulants for electronic components
PCT/US2007/006937 WO2007109283A2 (en) 2006-03-21 2007-03-20 Encapsulants for electronic components

Publications (3)

Publication Number Publication Date
JP2009530859A JP2009530859A (ja) 2009-08-27
JP2009530859A5 true JP2009530859A5 (https=) 2010-04-30
JP5253373B2 JP5253373B2 (ja) 2013-07-31

Family

ID=38375128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009501521A Expired - Fee Related JP5253373B2 (ja) 2006-03-21 2007-03-20 電子部品用の封入剤

Country Status (5)

Country Link
US (1) US20070221268A1 (https=)
EP (1) EP1997164A2 (https=)
JP (1) JP5253373B2 (https=)
CN (1) CN101405886B (https=)
WO (1) WO2007109283A2 (https=)

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US20080128018A1 (en) * 2006-12-04 2008-06-05 Richard Allen Hayes Solar cells which include the use of certain poly(vinyl butyral)/film bilayer encapsulant layers with a low blocking tendency and a simplified process to produce thereof
US20080196760A1 (en) * 2007-02-15 2008-08-21 Richard Allen Hayes Articles such as safety laminates and solar cell modules containing high melt flow acid copolymer compositions
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WO2008102863A1 (ja) * 2007-02-23 2008-08-28 Bridgestone Corporation 太陽電池用封止膜及びこれを用いた太陽電池
US20080264471A1 (en) * 2007-04-30 2008-10-30 Richard Allen Hayes Solar cell modules comprising compositionally distinct encapsulant layers
US8637150B2 (en) 2007-10-01 2014-01-28 E I Du Pont De Nemours And Company Multilayer acid terpolymer encapsulant layers and interlayers and laminates therefrom
US9960300B2 (en) 2007-11-21 2018-05-01 Arkema Inc. Photovoltaic module using PVDF based flexible glazing film
EP2262001B1 (en) * 2008-03-21 2018-07-25 Kyocera Corporation Pair of sealing films and solar battery using the pair of sealing films
WO2009149000A2 (en) 2008-06-02 2009-12-10 E. I. Du Pont De Nemours And Company Solar cell module having a low haze encapsulant layer
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US20110083721A1 (en) * 2008-11-20 2011-04-14 Behzad Imani Concentrating photovoltaic system
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FR2953524B1 (fr) * 2009-12-03 2012-12-14 Arkema France Systeme de reticulation a haute vitesse
WO2011142804A1 (en) * 2010-05-10 2011-11-17 The University Of Toledo Flexible photovoltaic cells and modules having an improved adhesion characteristic
MX2012013614A (es) 2010-05-26 2013-03-20 Univ Toledo Estructuras fotovoltaicas que tienen una capa de interfaz de difraccion de luz y metodos para fabricar las mismas.
CN102315311A (zh) * 2010-07-06 2012-01-11 杜邦太阳能有限公司 太阳能模块装置及其封边涂布方法
WO2012050093A1 (ja) * 2010-10-12 2012-04-19 三菱樹脂株式会社 透明性及び防湿性に優れた樹脂組成物、並びに、それを成形してなるシート
DE102011100608B4 (de) * 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
CN102299123A (zh) * 2011-05-20 2011-12-28 电子科技大学 一种光电子器件的封装方法
WO2015171575A1 (en) * 2014-05-09 2015-11-12 E. I. Du Pont De Nemours And Company Encapsulant composition comprising a copolymer of ethylene, vinyl acetate and a third comonomer
GB201504760D0 (en) * 2015-03-20 2015-05-06 Dupont Teijin Films Us Ltd Partnership PV cells
RU2768804C1 (ru) * 2018-09-25 2022-03-24 Сэн-Гобэн Гласс Франс Многослойное стекло и способ его изготовления
KR20220099763A (ko) * 2021-01-07 2022-07-14 한화토탈에너지스 주식회사 써멀 라미네이션 필름

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