JP2009529244A - 基板内に形成されたビアを平坦化する方法 - Google Patents

基板内に形成されたビアを平坦化する方法 Download PDF

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Publication number
JP2009529244A
JP2009529244A JP2008558445A JP2008558445A JP2009529244A JP 2009529244 A JP2009529244 A JP 2009529244A JP 2008558445 A JP2008558445 A JP 2008558445A JP 2008558445 A JP2008558445 A JP 2008558445A JP 2009529244 A JP2009529244 A JP 2009529244A
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Japan
Prior art keywords
substrate
protective layer
polishing
microns
height
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Pending
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JP2008558445A
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English (en)
Japanese (ja)
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JP2009529244A5 (enExample
Inventor
アムライン、クレイグ
フェイ、オーウェン
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NXP USA Inc
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NXP USA Inc
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Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2009529244A publication Critical patent/JP2009529244A/ja
Publication of JP2009529244A5 publication Critical patent/JP2009529244A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2008558445A 2006-03-08 2007-01-29 基板内に形成されたビアを平坦化する方法 Pending JP2009529244A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/371,658 US20070212865A1 (en) 2006-03-08 2006-03-08 Method for planarizing vias formed in a substrate
PCT/US2007/061192 WO2007120959A2 (en) 2006-03-08 2007-01-29 Method for planarizing vias formed in a substrate

Publications (2)

Publication Number Publication Date
JP2009529244A true JP2009529244A (ja) 2009-08-13
JP2009529244A5 JP2009529244A5 (enExample) 2010-03-18

Family

ID=38479482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008558445A Pending JP2009529244A (ja) 2006-03-08 2007-01-29 基板内に形成されたビアを平坦化する方法

Country Status (5)

Country Link
US (1) US20070212865A1 (enExample)
JP (1) JP2009529244A (enExample)
CN (1) CN101395699A (enExample)
TW (1) TW200802769A (enExample)
WO (1) WO2007120959A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8951839B2 (en) * 2010-03-15 2015-02-10 Stats Chippac, Ltd. Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
US8216918B2 (en) 2010-07-23 2012-07-10 Freescale Semiconductor, Inc. Method of forming a packaged semiconductor device
US20120282767A1 (en) * 2011-05-05 2012-11-08 Stmicroelectronics Pte Ltd. Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor package
US8617935B2 (en) 2011-08-30 2013-12-31 Freescale Semiconductor, Inc. Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages
US9142502B2 (en) 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8916421B2 (en) 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
US8685790B2 (en) 2012-02-15 2014-04-01 Freescale Semiconductor, Inc. Semiconductor device package having backside contact and method for manufacturing
US9847315B2 (en) * 2013-08-30 2017-12-19 Taiwan Semiconductor Manufacturing Company, Ltd. Packages, packaging methods, and packaged semiconductor devices
EA201990069A1 (ru) 2016-06-21 2019-06-28 ОРИОН ОФТАЛМОЛОДЖИ ЭлЭлСи Производные гетероциклического пролинамида
WO2017222914A1 (en) 2016-06-21 2017-12-28 Inception 4, Inc. Carbocyclic prolinamide derivatives
CN111755384A (zh) * 2020-06-18 2020-10-09 通富微电子股份有限公司 半导体器件以及制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079736A (ja) * 2002-08-15 2004-03-11 Sony Corp チップ内蔵基板装置及びその製造方法

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US5110759A (en) * 1988-12-20 1992-05-05 Fujitsu Limited Conductive plug forming method using laser planarization
US5111759A (en) * 1989-12-19 1992-05-12 Juki Corporation Inconstant-thickness workpiece feeding apparatus
US5744285A (en) * 1996-07-18 1998-04-28 E. I. Du Pont De Nemours And Company Composition and process for filling vias
US6620731B1 (en) * 1997-12-18 2003-09-16 Micron Technology, Inc. Method for fabricating semiconductor components and interconnects with contacts on opposing sides
US6380078B1 (en) * 2000-05-11 2002-04-30 Conexant Systems, Inc. Method for fabrication of damascene interconnects and related structures
US6506332B2 (en) * 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
DE60229958D1 (de) * 2001-06-28 2009-01-02 Mountain View Pharmaceuticals Polymerstabilisierte proteinasen
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Industrial Co Ltd Circuit component built-in module and method of manufacturing the same
JP2004179588A (ja) * 2002-11-29 2004-06-24 Sanyo Electric Co Ltd 半導体装置の製造方法
US20050048766A1 (en) * 2003-08-31 2005-03-03 Wen-Chieh Wu Method for fabricating a conductive plug in integrated circuit
US7208404B2 (en) * 2003-10-16 2007-04-24 Taiwan Semiconductor Manufacturing Company Method to reduce Rs pattern dependence effect
TWI228389B (en) * 2003-12-26 2005-02-21 Ind Tech Res Inst Method for forming conductive plugs
JP4800585B2 (ja) * 2004-03-30 2011-10-26 ルネサスエレクトロニクス株式会社 貫通電極の製造方法、シリコンスペーサーの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079736A (ja) * 2002-08-15 2004-03-11 Sony Corp チップ内蔵基板装置及びその製造方法

Also Published As

Publication number Publication date
WO2007120959A3 (en) 2007-12-13
WO2007120959A2 (en) 2007-10-25
TW200802769A (en) 2008-01-01
CN101395699A (zh) 2009-03-25
US20070212865A1 (en) 2007-09-13

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