JP2009522786A5 - - Google Patents

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Publication number
JP2009522786A5
JP2009522786A5 JP2008548732A JP2008548732A JP2009522786A5 JP 2009522786 A5 JP2009522786 A5 JP 2009522786A5 JP 2008548732 A JP2008548732 A JP 2008548732A JP 2008548732 A JP2008548732 A JP 2008548732A JP 2009522786 A5 JP2009522786 A5 JP 2009522786A5
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JP
Japan
Prior art keywords
polymer
activated
layer
filler
conductive
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JP2008548732A
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English (en)
Japanese (ja)
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JP5155879B2 (ja
JP2009522786A (ja
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Priority claimed from PCT/US2006/049453 external-priority patent/WO2007079156A2/en
Publication of JP2009522786A publication Critical patent/JP2009522786A/ja
Publication of JP2009522786A5 publication Critical patent/JP2009522786A5/ja
Application granted granted Critical
Publication of JP5155879B2 publication Critical patent/JP5155879B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008548732A 2005-12-30 2006-12-28 電子基板 Expired - Fee Related JP5155879B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US75517405P 2005-12-30 2005-12-30
US75524905P 2005-12-30 2005-12-30
US60/755,249 2005-12-30
US60/755,174 2005-12-30
US81426006P 2006-06-16 2006-06-16
US60/814,260 2006-06-16
PCT/US2006/049453 WO2007079156A2 (en) 2005-12-30 2006-12-28 Substrates for electronic circuitry type applications

Publications (3)

Publication Number Publication Date
JP2009522786A JP2009522786A (ja) 2009-06-11
JP2009522786A5 true JP2009522786A5 (https=) 2010-02-18
JP5155879B2 JP5155879B2 (ja) 2013-03-06

Family

ID=38134893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008548732A Expired - Fee Related JP5155879B2 (ja) 2005-12-30 2006-12-28 電子基板

Country Status (5)

Country Link
US (1) US20100263919A1 (https=)
EP (1) EP1977633A2 (https=)
JP (1) JP5155879B2 (https=)
KR (1) KR20080080674A (https=)
WO (1) WO2007079156A2 (https=)

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JP6074883B2 (ja) 2010-10-29 2017-02-08 パナソニックＩｐマネジメント株式会社 プリプレグ、積層板、金属箔張積層板、回路基板及びｌｅｄモジュール
US8933161B2 (en) * 2011-03-18 2015-01-13 Mitsubishi Chemical Europe Gmbh Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer
WO2013181781A1 (en) 2012-06-04 2013-12-12 Nokia Corporation An apparatus comprising conductive portions and a method of making the apparatus
CN103596359A (zh) * 2012-08-13 2014-02-19 广达电脑股份有限公司 印刷电路板结构
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KR101574736B1 (ko) * 2013-04-26 2015-12-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
JP6147107B2 (ja) * 2013-06-11 2017-06-14 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
KR20140144958A (ko) * 2013-06-12 2014-12-22 삼성디스플레이 주식회사 액정 변조기 및 이를 포함하는 검사 장치
WO2014208800A1 (ko) * 2013-06-28 2014-12-31 (주)파트론 도체 패턴이 형성된 구조물 및 도체 패턴 형성 방법
TWI501713B (zh) * 2013-08-26 2015-09-21 Unimicron Technology Corp 軟硬板模組以及軟硬板模組的製造方法
JP6489795B2 (ja) * 2013-12-17 2019-03-27 三菱エンジニアリングプラスチックス株式会社 繊維強化樹脂材料、樹脂成形品、メッキ層付樹脂成形品、メッキ層付樹脂成形品の製造方法、および繊維強化樹脂材料の製造方法
US20150274965A1 (en) * 2014-03-26 2015-10-01 Ticona Llc Laminate for a Printed Circuit Board
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
JP6344476B2 (ja) * 2014-08-29 2018-06-20 株式会社村田製作所 多層回路基板
US20170075473A1 (en) * 2015-09-15 2017-03-16 Hyundai Motor Company Touch input device and method for manufacturing the same
KR101887134B1 (ko) * 2016-07-06 2018-08-09 현대자동차주식회사 터치 입력장치 및 그 제조방법
US20170154790A1 (en) 2015-11-30 2017-06-01 Intel Corporation Sam assisted selective e-less plating on packaging materials
LT6517B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Selektyvus polimerinio gaminio paviršiaus metalizavimo būdas
US20210045252A1 (en) * 2019-04-12 2021-02-11 Averatek Corporation Systems and methods for manufacturing
KR102268383B1 (ko) * 2019-08-02 2021-06-23 삼성전기주식회사 칩 안테나
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US12441879B2 (en) 2019-08-21 2025-10-14 Ticona Llc Polymer composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
US11688668B2 (en) * 2019-12-31 2023-06-27 At&S (China) Co. Ltd. Component carrier with low shrinkage dielectric material
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
US20220081776A1 (en) * 2020-09-11 2022-03-17 Macdermid Enthone Inc. High Elongation Electroless Copper Process
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system

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US20060083939A1 (en) * 2004-10-20 2006-04-20 Dunbar Meredith L Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
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US7504150B2 (en) * 2005-06-15 2009-03-17 E.I. Du Pont De Nemours & Company Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto

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