JP2009521561A5 - - Google Patents
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- Publication number
- JP2009521561A5 JP2009521561A5 JP2008547452A JP2008547452A JP2009521561A5 JP 2009521561 A5 JP2009521561 A5 JP 2009521561A5 JP 2008547452 A JP2008547452 A JP 2008547452A JP 2008547452 A JP2008547452 A JP 2008547452A JP 2009521561 A5 JP2009521561 A5 JP 2009521561A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- tape
- thickness
- film
- raised portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 239000004697 Polyetherimide Substances 0.000 claims 4
- 229920001601 polyetherimide Polymers 0.000 claims 4
- 229920006254 polymer film Polymers 0.000 claims 3
- 230000000873 masking effect Effects 0.000 claims 2
- -1 polydimethylsiloxane Polymers 0.000 claims 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- 239000003522 acrylic cement Substances 0.000 claims 1
- 239000006229 carbon black Substances 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000013464 silicone adhesive Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74307605P | 2005-12-23 | 2005-12-23 | |
| PCT/US2006/048476 WO2007075716A1 (en) | 2005-12-23 | 2006-12-19 | High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009521561A JP2009521561A (ja) | 2009-06-04 |
| JP2009521561A5 true JP2009521561A5 (enExample) | 2010-02-04 |
Family
ID=38218317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008547452A Withdrawn JP2009521561A (ja) | 2005-12-23 | 2006-12-19 | 静電気発生の少ないポリエーテルイミドポリマーからなる高温熱耐接着テープ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080268206A1 (enExample) |
| EP (1) | EP1969081A4 (enExample) |
| JP (1) | JP2009521561A (enExample) |
| KR (1) | KR20080076965A (enExample) |
| CN (1) | CN101341226B (enExample) |
| MX (1) | MXPA06010596A (enExample) |
| WO (1) | WO2007075716A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5517162B2 (ja) | 2010-09-22 | 2014-06-11 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 文書情報の機密ラベルを判定する方法、コンピュータ・プログラム、装置、及びシステム |
| US8673462B2 (en) | 2011-09-02 | 2014-03-18 | International Business Machines Corporation | Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates |
| EP2639278A1 (en) * | 2012-03-13 | 2013-09-18 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape |
| JP6106232B2 (ja) * | 2015-09-07 | 2017-03-29 | 日東電工株式会社 | グラファイトシート用粘着シート |
| US10501252B1 (en) * | 2017-07-27 | 2019-12-10 | Amazon Technologies, Inc. | Packaging material having patterns of microsphere adhesive members that allow for bending around objects |
| JP7204658B2 (ja) * | 2017-10-19 | 2023-01-16 | デンカ株式会社 | 単層フィルム及びそれを用いた耐熱粘着テープ |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475196A (en) * | 1965-12-27 | 1969-10-28 | Borden Inc | Pressure-sensitive tape coated with a release agent |
| US3728150A (en) * | 1971-07-12 | 1973-04-17 | Du Pont | Bondable adhesive coated polyimide film |
| JPH0620087B2 (ja) * | 1989-07-10 | 1994-03-16 | 株式会社巴川製紙所 | リードフレーム用接着テープ |
| IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
| US5273798A (en) * | 1991-08-01 | 1993-12-28 | Watson Label Products, Corp. | Heat and solvent resistant pressure-sensitive label |
| JP3368927B2 (ja) * | 1992-12-28 | 2003-01-20 | 大倉工業株式会社 | 導電性粘着テープ用基材フィルムの製造方法 |
| US5508107A (en) * | 1993-07-28 | 1996-04-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tapes for electronics applications |
| US5478880A (en) * | 1994-02-01 | 1995-12-26 | Moore Business Forms, Inc. | Printable release |
| JP3473701B2 (ja) * | 1994-05-06 | 2003-12-08 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 高温耐性を有する帯電防止性感圧接着テープ |
| US5589246A (en) * | 1994-10-17 | 1996-12-31 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive article |
| US5807507A (en) * | 1996-08-28 | 1998-09-15 | Fuji Polymer Industries Co., Ltd. | Self-fusing conductive silicone rubber composition |
| JP3347026B2 (ja) * | 1997-07-23 | 2002-11-20 | 株式会社巴川製紙所 | 電子部品用接着テープ |
| US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
| JP5105655B2 (ja) * | 1999-03-11 | 2012-12-26 | 日東電工株式会社 | 粘着テープ又はシート用プライマー組成物、及び粘着テープ又はシート |
| US20030039822A1 (en) * | 2001-08-17 | 2003-02-27 | 3M Innovative Properties Company | Contaminant removal tape assembly, a roll of contaminant removal tape, and methods of removing contaminants from a surface |
| TWI341859B (en) * | 2003-05-09 | 2011-05-11 | Mitsubishi Gas Chemical Co | Adhesive and adhesive film |
| JP2005150630A (ja) * | 2003-11-19 | 2005-06-09 | Nitto Denko Corp | 半導体装置製造用接着フィルム |
| US8252407B2 (en) * | 2005-01-12 | 2012-08-28 | Avery Dennison Corporation | Adhesive article having improved application properties |
| US20060194070A1 (en) * | 2005-02-25 | 2006-08-31 | Joshua Croll | Polyetherimide film and multilayer structure |
-
2006
- 2006-09-15 MX MXPA06010596A patent/MXPA06010596A/es unknown
- 2006-12-19 WO PCT/US2006/048476 patent/WO2007075716A1/en not_active Ceased
- 2006-12-19 US US12/096,249 patent/US20080268206A1/en not_active Abandoned
- 2006-12-19 JP JP2008547452A patent/JP2009521561A/ja not_active Withdrawn
- 2006-12-19 EP EP06839436A patent/EP1969081A4/en not_active Withdrawn
- 2006-12-19 KR KR1020087014917A patent/KR20080076965A/ko not_active Ceased
- 2006-12-19 CN CN2006800482686A patent/CN101341226B/zh not_active Expired - Fee Related
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