JP2009520351A - 銀めっきに超音波を使用する方法 - Google Patents
銀めっきに超音波を使用する方法 Download PDFInfo
- Publication number
- JP2009520351A JP2009520351A JP2008545581A JP2008545581A JP2009520351A JP 2009520351 A JP2009520351 A JP 2009520351A JP 2008545581 A JP2008545581 A JP 2008545581A JP 2008545581 A JP2008545581 A JP 2008545581A JP 2009520351 A JP2009520351 A JP 2009520351A
- Authority
- JP
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- Prior art keywords
- plating
- circuit board
- printed circuit
- khz
- immersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 82
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 26
- 229910052709 silver Inorganic materials 0.000 title claims description 26
- 239000004332 silver Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000007654 immersion Methods 0.000 claims abstract description 37
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 238000005260 corrosion Methods 0.000 claims abstract description 24
- 230000007797 corrosion Effects 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 21
- 238000002604 ultrasonography Methods 0.000 description 21
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- -1 aromatic nitro compound Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- LWFUFLREGJMOIZ-UHFFFAOYSA-N 3,5-dinitrosalicylic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1O LWFUFLREGJMOIZ-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
【解決手段】方法は、ソルダーマスクが設けられているプリント基板を準備する工程、及びめっき浴に超音波を使用して浸漬めっき液をプリント基板にめっきする、プリント基板を浸漬めっき液で処理する工程を含む。めっきする間中、周波数約40kHzの超音波を使用することが有効な結果を示すことが分かった。
【選択図】図2B
Description
a)レジスター、トランジスター等の足付部品。これらは、各足部を基板の穴に通し、足部の周りの穴がはんだで埋まることを確実にすることで回路基板に取り付けられる。
b)表面実装素子。平らな接触領域とのハンダ付けにより、又は接着剤を使用する接着により基板面に取り付けられる。
1)銅張積層板に穴を開けてスルーホールを形成する工程、
2)スルーホール及び表面を無電解銅めっきするためにスルーホールに標準めっきをする処理工程、
3)めっきマスクを設ける工程、
4)穴及び露出回路を所望の厚みに電解銅めっきする工程、
5)穴及び露出回路を電解錫めっきして、エッチングレジストとして用いる工程、
6)めっきレジストを剥離する工程、
7)露出した銅(すなわち、錫めっきされていない銅)をエッチングする工程、
8)錫を剥離する工程、
9)ソルダーレジストが接続領域以外の基板面のほぼ全体を覆うように、ソルダーレジストを設け、画像形成、現像する工程、
10)保護層形成工程、及び
11)接続領域を清浄し、マイクロエッチングする工程。
本発明の更なる目的は、浸漬めっき、特に、浸漬銀めっきする際に超音波の使用条件を検討し、SMIAを示さずに銀を析出させることである。
a)ソルダーマスクが設けられているプリント基板を準備する工程、及び
b)プリント基板に超音波振動を加えると同時に、プリント基板を浸漬めっき浴に浸漬することでプリント基板を処理する、プリント基板を浸漬めっき液で処理する工程。
a)ソルダーマスクが設けられているプリント基板を準備する工程、及び
b)プリント基板を浸漬めっき液で処理する工程。プリント基板に超音波振動を加えると同時に、プリント基板を浸漬めっき浴に浸漬することでプリント基板を処理するため、超音波振動なしで同じプロセスを行う場合に比べてソルダーレジスト界面腐食が低減する。浸漬銀めっきが特に好ましい。
a)溶解性銀イオン源、
b)酸及び/又は緩衝剤、
c)錯化(キレート)剤、
d)結晶微細化剤、
e)曇り防止剤、並びに
f)界面活性剤。
異なる周波数での超音波の影響を調べる試験
銀めっき浴で超音波使用の実行可能性を評価するために、超音波周波数を対照標準(超音波使用なし)から170kHzの高さまで90秒又は180秒間にわたって変化させ、試料の界面ガルバニック腐食の評価を行った。結果を表1に示す。
超音波方向及び時間の変化
第2試験は、超音波方向に対して並行又は垂直であるPCパネル配置が影響に対して重要であるか、及び(b)超音波付加時間がめっき所要時間の25%又は100%の場合に役割を果たすかどうかを決めるために行った。全ての試験片は、周波数約40kHzでめっきされた。結果を表2に示す。
電力変調及び周波数掃引の変化
第3試験は、界面ガルバニック腐食に対する電力変調及び周波数掃引の影響を断定するために行った。これらの試験において、超音波周波数は約40kHzを使用し、滞留時間は2分であった。
Claims (10)
- プリント基板製造プロセスにおいて、ソルダーレジスト界面腐食を低減する方法であって、
a)ソルダーマスクが設けられているプリント基板を準備する工程、及び
b)プリント基板に超音波振動を加えると同時に、プリント基板を浸漬めっき液に浸漬することでプリント基板を処理する、プリント基板を浸漬めっき液で処理する工程
を含むことを特徴とするソルダーレジスト界面腐食を低減する方法。 - 浸漬めっき液が、浸漬銀めっき液を含む請求項1に記載の方法。
- 超音波振動が、周波数約40kHz〜80kHzで加えられる請求項1に記載の方法。
- 超音波振動が、周波数約40kHzで加えられる請求項2に記載の方法。
- 超音波振動が、約60秒〜180秒間加えられる請求項1に記載の方法。
- 超音波振動が、めっきする間にわたって付加される請求項2に記載の方法。
- プリント基板が、加えた超音波振動の方向に対して、垂直又は水平方向に配置されている請求項1に記載の方法。
- プリント基板が、加えた超音波振動の方向に対して、水平方向に配置されている請求項7に記載の方法。
- 超音波振動が、約80kHz未満の周波数で加えられる請求項1に記載の方法。
- 超音波振動が、約80kHz未満の周波数で加えられる請求項2に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/300,254 US7429400B2 (en) | 2005-12-14 | 2005-12-14 | Method of using ultrasonics to plate silver |
US11/300,254 | 2005-12-14 | ||
PCT/US2006/036186 WO2007070142A1 (en) | 2005-12-14 | 2006-09-15 | Method of using ultrasonics to plate silver |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009520351A true JP2009520351A (ja) | 2009-05-21 |
JP4999862B2 JP4999862B2 (ja) | 2012-08-15 |
Family
ID=38139706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008545581A Expired - Fee Related JP4999862B2 (ja) | 2005-12-14 | 2006-09-15 | 銀めっきに超音波を使用する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7429400B2 (ja) |
EP (1) | EP1973670B1 (ja) |
JP (1) | JP4999862B2 (ja) |
CN (1) | CN101326015B (ja) |
ES (1) | ES2394361T3 (ja) |
TW (1) | TWI307730B (ja) |
WO (1) | WO2007070142A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090123656A1 (en) * | 2007-11-13 | 2009-05-14 | Ernest Long | Composition and method for controlling galvanic corrosion in printed circuit boards |
US20090236129A1 (en) * | 2008-03-19 | 2009-09-24 | Dell Products L.P. | Methods for reducing corrosion on printed circuit boards |
WO2014102140A1 (en) * | 2012-12-28 | 2014-07-03 | Pk Plating Technology Ab | A method for plating a substrate with a metal |
CN109423635A (zh) * | 2017-08-22 | 2019-03-05 | 深圳市虹喜科技发展有限公司 | 一种印制线路板表面处理用化学镀银溶液 |
TWI780428B (zh) * | 2019-04-25 | 2022-10-11 | 華貿電機股份有限公司 | 具有超音波鍍覆膜層的鍍覆件及超音波鍍膜方法 |
CN110791789A (zh) * | 2019-11-26 | 2020-02-14 | 湖州努特表面处理科技有限公司 | 一种超声波一体化镀银方法 |
CN111698839A (zh) * | 2020-06-29 | 2020-09-22 | 百强电子(深圳)有限公司 | 一种厚铜板选择性表面处理的阻焊印制的方法 |
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US20040043159A1 (en) * | 2002-08-30 | 2004-03-04 | Shipley Company, L.L.C. | Plating method |
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-
2005
- 2005-12-14 US US11/300,254 patent/US7429400B2/en not_active Expired - Fee Related
-
2006
- 2006-09-15 CN CN2006800462305A patent/CN101326015B/zh not_active Expired - Fee Related
- 2006-09-15 WO PCT/US2006/036186 patent/WO2007070142A1/en active Application Filing
- 2006-09-15 EP EP06814817A patent/EP1973670B1/en not_active Expired - Fee Related
- 2006-09-15 JP JP2008545581A patent/JP4999862B2/ja not_active Expired - Fee Related
- 2006-09-15 ES ES06814817T patent/ES2394361T3/es active Active
- 2006-12-08 TW TW095146000A patent/TWI307730B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223681A (ja) * | 1997-02-06 | 1998-08-21 | Dipsol Chem Co Ltd | 微細孔にめっきを柱状に析出させる方法 |
JP2000038681A (ja) * | 1998-07-21 | 2000-02-08 | Permelec Electrode Ltd | 置換めっき方法 |
US20040043159A1 (en) * | 2002-08-30 | 2004-03-04 | Shipley Company, L.L.C. | Plating method |
Also Published As
Publication number | Publication date |
---|---|
TW200730670A (en) | 2007-08-16 |
CN101326015A (zh) | 2008-12-17 |
WO2007070142A1 (en) | 2007-06-21 |
ES2394361T3 (es) | 2013-01-31 |
JP4999862B2 (ja) | 2012-08-15 |
US7429400B2 (en) | 2008-09-30 |
TWI307730B (en) | 2009-03-21 |
EP1973670B1 (en) | 2012-11-07 |
EP1973670A4 (en) | 2010-03-10 |
US20070134406A1 (en) | 2007-06-14 |
CN101326015B (zh) | 2011-08-17 |
EP1973670A1 (en) | 2008-10-01 |
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