JP2009302330A - Method of manufacturing multilayer ceramic board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic board having a flat inclined surface at an end portion and a cavity and the method of manufacturing the multilayer ceramic board which forms a conductive pattern on the flat inclined surface. <P>SOLUTION: The method of manufacturing a multilayer ceramic board includes the steps of: (a) laminating a plurality of ceramic green sheets in tiers; (b) laminating an inclined surface portion forming green sheet on at least a tiered portion on the upper surface of the plurality of laminated ceramic green sheets: (c) arranging, for compression molding, the green sheet for forming inclined surface portion, along the tiered portion of the laminate and planarizing a tiered shape; and (d) sintering the compression-molded laminate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic substrate, and more particularly to a method for manufacturing a multilayer ceramic substrate that can be suitably used for an LED, a high-frequency component, or the like that is used by mounting a chip component or a semiconductor. .

  When a conductor pattern is to be formed on the end surface or cavity surface of a conventional multilayer ceramic substrate, it is necessary to form a conductor on the vertical surface as shown in FIG.

  However, it is technically difficult to form a conductor pattern on such a vertical surface, and a very complicated process is required. Further, when the conductor pattern is formed on the vertical plane, the wiring pattern is bent at a right angle in the middle. However, if the wiring pattern is bent at a right angle, a characteristic impedance mismatch occurs at the bending point, causing a problem that radiation occurs. This appears remarkably especially at high frequencies, and cannot be used practically. Furthermore, although the expansion / contraction rate due to heat of the ceramic itself is low, slight expansion / contraction occurs. Since the conductor pattern is formed of a thin film of about 15 microns, this slight thermal expansion or contraction causes a crack at the corner B in FIG.

  Therefore, it is desirable to provide the wiring pattern with a gentle slope without providing a sharp bend as much as possible. Therefore, as a result of various studies, the present inventor has found a method for easily forming the slope portion of the ceramic substrate, and has completed the present invention.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a multilayer ceramic substrate having a flat inclined surface at the end, cavity side wall, etc., and a method for manufacturing a multilayer ceramic substrate having a conductor pattern formed on the flat inclined surface. There is.

  In order to solve the problems as described above, the measures taken by the present invention are as follows.

A method for manufacturing a multilayer ceramic substrate according to claim 1 of the present invention includes:
(A) a step of laminating a plurality of ceramic green sheets in a step shape;
(B) a step of laminating one or two or more slope portion forming green sheets so as to include at least a stepped portion on the surface of the plurality of laminated ceramic green sheets;
(C) a compression molding step for flattening the staircase portion along the stepped portion with the slope forming green sheet;
(D) a step of sintering the laminate that has been compression molded in the compression molding step;
It is characterized by including.

  Steps are formed by laminating ceramic green sheets in a step shape, and further, by forming a slope portion forming green sheet on the stepped step portion and then compression molding, the surface of the stepped step portion is formed. A flat slope is formed by arranging a slope-forming green sheet on the surface. For this reason, when printing a conductor pattern, it becomes easy to print a conductor pattern, and it becomes possible to form a conductor pattern on a slope by screen printing, ink jet printing, thin film technology, or the like.

  The method for manufacturing a multilayer ceramic substrate according to claim 2 of the present invention is characterized in that the slope-forming green sheet has a conductor pattern printed on at least a portion including a stepped portion. is there.

  By printing the conductor pattern on the slope portion forming green sheet in advance, the conductor pattern printing step can be omitted in a later step. In addition, since the printing of the conductor pattern is performed on the green sheet on the plane before the lamination, the printing with higher accuracy, and thus the conductor pattern can be formed.

  According to a third aspect of the present invention, there is provided a multilayer ceramic substrate manufacturing method comprising: (between the step (b) and the step (c) a laminate laminated by the step (a) and the step (b). Including the step of vacuum packaging, the compression molding step uses a hydraulic press.

  By performing the compression molding step with a hydraulic press, almost all the outer surfaces of the substrate can be pressurized with substantially equal pressure. Accordingly, the green sheet for forming the slope portion can be laminated along the staircase portion. Further, since the stepped portion itself can be leveled by a hydraulic press, a flat plane can be formed.

A method for manufacturing a multilayer ceramic substrate according to claim 4 of the present invention includes:
(A) a step of laminating a plurality of ceramic green sheets in a step shape;
(B) a pressing step for making the stepped portions of the laminated ceramic green sheets into flattened slopes;
(C) laminating one or two or more slope forming green sheets on the surface of the laminated ceramic green sheets so as to include at least a flattened slope;
(D) a compression molding step of compressing the green sheet for forming the slope portion along the flattened slope;
(E) a step of sintering the laminate that has been compression molded in the compression molding step;
It is characterized by including.

  According to a fourth aspect of the present invention, a stepped portion formed of a plurality of ceramic green sheets is flattened by pressing before laminating the slope forming green sheets. By adopting such a configuration, a flatter slope can be formed.

  The method for manufacturing a multilayer ceramic substrate according to claim 5 of the present invention is characterized in that the slope portion forming green sheet has at least a conductor pattern printed on a portion including a flattened slope. It is.

  By printing the conductor pattern on the slope forming green sheet in advance, the step of printing the conductor pattern in a later step can be omitted. In addition, since the printing of the conductor pattern is performed on the green sheet on the plane before the lamination, the printing with higher accuracy, and thus the conductor pattern can be formed.

  The method for producing a multilayer ceramic substrate according to claim 6 of the present invention is the method for producing a multilayer ceramic substrate according to claim 4 or 5, wherein the step (a) is performed between the step (c) and the step (d). The process includes a step of vacuum packaging the laminated body laminated by the step (c), and the compression molding step uses a hydraulic press.

  By adopting such a configuration, almost equal pressure can be applied to all surfaces of the substrate. Accordingly, the green sheet for forming the slope portion can be laminated along the staircase portion. Further, since the stepped portion itself can be leveled by a hydraulic press, a flat plane can be formed.

A method for manufacturing a multilayer ceramic substrate according to claim 7 of the present invention includes:
(A) a step of laminating a plurality of ceramic green sheets having through holes of different sizes at positions where cavities are formed, so that the side walls of the cavities are stepped;
(B) a step of laminating a slope portion forming green sheet so as to include at least a stepped portion on the top surface of the plurality of laminated ceramic green sheets;
(C) A compression molding step of flattening the stepped portion while keeping the green portion for forming the inclined portion along the stepped portion of the laminate by a hydraulic press;
(D) a step of sintering the compression-molded laminate;
It is characterized by including.

  A stepped hole is formed at a position where the cavity of the multilayer ceramic substrate is provided, and a flat slope is formed by further laminating a green part forming slope part on the stepped slope and compressing it. For this reason, when a conductor pattern is printed on the slope, the conductor pattern can be formed on the slope by screen printing, inkjet printing, thin film technology, or the like.

  The method for manufacturing a multilayer ceramic substrate according to claim 8 of the present invention is the method for manufacturing a multilayer ceramic substrate according to claim 7, wherein the slope-forming green sheet has a conductor pattern at least at a portion including a stepped portion. Is printed.

  By printing the conductor pattern on the slope forming green sheet in advance, the step of printing the conductor pattern in a later step can be omitted. In addition, since the printing of the conductor pattern is performed on the green sheet on the plane before the lamination, the printing with higher accuracy, and thus the conductor pattern can be formed.

  The method for producing a multilayer ceramic substrate according to claim 9 of the present invention is the method for producing a multilayer ceramic substrate according to claim 7 or 8, wherein the step (a) and the step (c) are performed between the step (b) and the step (c). (B) It includes a step of vacuum packaging the laminated body laminated by the step, and the compression molding step is a hydraulic press.

  By adopting such a configuration, almost equal pressure can be applied to all surfaces of the substrate. Accordingly, the green sheet for forming the slope portion can be laminated along the staircase portion. Further, since the stepped portion itself can be leveled by a hydraulic press, a flat plane can be formed.

  In the method for manufacturing a multilayer ceramic substrate according to claim 10 of the present invention, in the step (b), one or more slope forming green sheets are formed on the top surface of the plurality of laminated ceramic green sheets. It is a step of laminating and further laminating a plurality of ceramic green sheets in a staircase pattern.

  By adopting such a configuration, a flat slope portion can be formed below the middle layer of the multilayer ceramic substrate. Further, if a pattern is printed on the slope forming green sheet, the conductor pattern can be drawn from the middle layer.

  According to the method for manufacturing a multilayer ceramic substrate of the present invention, it is possible to manufacture a multilayer ceramic substrate having flat slopes on the end surface, the center, and the wall surface of the cavity of the ceramic substrate. By forming the conductor pattern on this slope, there is no right-angled bending as in the prior art, so that it is possible to prevent the occurrence of characteristic impedance mismatch at the bending point, and to minimize the generation of radiation. In addition, the occurrence of breakage of the conductor pattern at the bent portion can be reduced.

  The best mode for carrying out the “method for producing a multilayer ceramic substrate” of the present invention will be described.

  The present invention relates to a method for manufacturing a multilayer ceramic substrate in which an end surface such as an end portion, a center, or a cavity of a ceramic substrate is formed with an inclined surface. For this purpose, the present invention laminates a ceramic green sheet on the portion where the slope is desired to form a stepped step, and laminates a slope forming green sheet on the stepped step, and then the slope portion. A method of compressing and forming the forming green sheet along the stepped portion is employed. The surface is flattened by forming a slope on the surface of the slope forming green sheet. That is, the stepped portion of the green sheet is collapsed by compression molding (via the slope forming green sheet) to smooth the convex portion, and the stepped portion smoothed by the slope forming green sheet By covering the surface, a flat slope is formed.

  Also, as another means, after stacking ceramic green sheets to form a stepped step on the part where the slope is to be formed, the convex part of the stepped step part is first crushed by the pressing means and formed to a certain degree of flatness After that, the slope forming green sheet is laminated on the surface of the flat slope, and then the slope forming green sheet is compression-molded along the stepped portion. According to this means, since a certain level of flatness is ensured before the slope portion forming green sheets are laminated in advance, a flatter slope can be formed.

  As a method of placing the ceramic green sheets in a staircase shape, for example, the stacked state may be simply shifted and provided in a staircase shape. Also, in the case of forming a cavity hole, a plurality of holes of different sizes are formed in advance in the ceramic green sheet, and the ceramic green sheet is laminated so that the hole becomes larger as it goes to the surface layer. It can be provided in steps. When the ceramic green sheets are provided in a staircase shape, it is not always necessary to displace them evenly, and by increasing the width of the staircase as it goes upward, it is gradually increased or decreased, or by combining these, Swelled slopes or concave slopes can be formed (see FIGS. 8 and 9). As a result, surfaces having various curvatures can be produced.

  Further, if a ceramic green sheet previously printed with a conductor pattern or via holes is laminated, internal wiring can be provided in the layer.

  The ceramic green sheet is not limited, but it is preferable to use a ceramic green sheet that can be fired at a low temperature of 900 ° C. or lower by adding a glass-based component to alumina. Adopting a ceramic green sheet that can be sintered at a temperature lower than the melting point of a low-resistance conductor such as Ag or Cu is preferable because the conductor pattern can be integrated simultaneously with firing. As the conductive paste, a paste obtained by adding an organic solvent or the like to silver particles, gold particles, platinum particles or the like and kneading them is used. Of course, it is not limited to these.

  The slope forming green sheet is for covering at least a stepped portion of a laminated plate formed in a stepped shape or a slope where the stepped portion is crushed, and may be one sheet or a plurality of stacked layers. It doesn't matter. The green sheets stacked in a staircase shape may have the same structure and material as the configuration, and the green sheets are stacked in a staircase shape so that they can be more familiar with the staircase portion and easily follow the staircase portion in the subsequent compression process. A thinner or softer green sheet may be used. In addition, a conductor pattern may be printed in advance on the slope portion forming green sheet, or printing may be performed after the compression molding step. In a laminated board having end portions formed in a staircase shape, even if it is desired to print, it is impossible to print because the ink flows along the back of the staircase shape (L-shaped part) by capillary action. However, in the green sheet laminate formed according to the present invention, the inclined surface is formed on a substantially flat surface by the compression molding process, and therefore it is possible to print on the inclined surface after the compression molding process.

  Further, after arranging one or more slope portion forming green sheets, a plurality of ceramic green sheets may be further laminated on the upper layer. By adopting such a configuration, the slope forming green sheet can be arranged from the middle layer to the lower stepped portion (see FIG. 14). Therefore, for example, when the slope portion forming green sheet having the conductor pattern applied to the slope portion is used, the wiring pattern can be drawn from the middle layer portion to the slope portion.

  The compression molding step is a method in which the step of the stepped portion is pressurized, the stepped portion is crushed to some extent and the corners are crushed, and the slope forming green sheet can be flattened along the stepped portion. If it is, various press apparatuses, such as a mechanical press, a hydraulic press (for example, hydrostatic press), a pneumatic press, can be used, and it does not specifically limit. Considering the followability of the slope forming green sheet to the slope, the flattening of the staircase, and the like, a hydrostatic press that uniformly applies pressure is preferable. When compression molding is performed by a hydraulic press, it is necessary to vacuum package a laminated body in which a green sheet for forming a slope portion is covered with a green sheet laminated stepwise. The flattening referred to in the present invention includes not only a completely flat surface but also a state in which a wave is left in a stepped portion to some extent, and also includes a state in which no corners remain on the slope portion as a whole.

  The sintering process is not limited, and various conventionally used sintering methods can be used. The multilayer body that has been compression-molded is sintered to form a multilayer ceramic substrate having a flat inclined surface.

  Hereinafter, an optimum embodiment of a method for manufacturing a multilayer ceramic substrate will be described in detail with reference to the drawings. In addition, the Example and drawing demonstrated below illustrate the optimal form of the Example of this invention, and is not used for the objective limited to these structures.

  FIG. 1 shows a multilayer ceramic substrate having a slope formed on the ceramic substrate. 2-4 is sectional drawing which shows the process which shows the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention.

  First, the structure of the multilayer ceramic substrate 100 finally produced will be described. As shown in FIG. 1, a multilayer ceramic substrate 100 according to the first embodiment includes a ceramic substrate 10 formed in a lower layer, a middle ceramic substrate 20 disposed in a layer forming a slope, and an uppermost layer covering the slope portion. Ceramic substrate 30, and each ceramic substrate 10, 20, 30 is formed of a low-temperature co-fired ceramic obtained by adding a glass component to alumina. Circuit patterns, via-hole conductors, and the like are formed on the lower ceramic substrate 10, the middle ceramic substrate 20, and the uppermost ceramic substrate 30, respectively. The ceramic substrate 100 has a flat slope, and a conductor pattern 41 is provided on the slope.

  Next, a method for manufacturing the multilayer ceramic substrate 100 described above will be described with reference to FIGS. First, as shown in FIG. 2, a conductor pattern is printed on the ceramic green sheets 11 and 21 using a conductive paste to form a desired conductor pattern 40. If necessary, via holes are formed by laser or the like after printing the conductor pattern 40, and each interlayer connection portion 42 is formed so as to be conductive between the layers by filling with a conductive paste. An intermediate layer ceramic sheet 21 is laminated on the surface of the ceramic green sheet 11 constituting the substrate so that the end portion is stepped.

  Further, a slope portion forming green sheet 31 forming the uppermost ceramic substrate 30 is laminated so as to cover the stepped portion 50 as shown in FIG. The slope portion forming green sheet 31 is formed with a necessary conductor pattern 40 in both the portion covering the stepped portion 50 and the other portion, and the conductor pattern 41 is laminated on the outermost surface so as to cover the stepped portion. . The slope forming green sheet 31 may have the same physical properties as the green sheet forming the middle layer and the lower layer, or a ceramic green sheet thinner than the middle layer and the lower layer so as to easily follow the slope. May be.

  Then, as shown in FIG. 4, the laminate 101 in which the lower and middle ceramic green sheets 11 and 21 and the slope forming green sheet 31 are laminated is inserted into a bag 60 made of plastic, rubber or the like, Vacuum packaging. Since the laminated body 101 and the bag 60 are vacuum-packed, they are actually in close contact with the substrate. In FIG. 4, a slight gap is provided to ensure the visibility of the drawing. . And the laminated body 101 with this bag 60 is put into the water tank of a hydrostatic pressure press apparatus, and is compression-molded. As a pressurizing condition, for example, it is preferable to pressurize for about 10 to 60 minutes at a temperature of 70 to 90 ° C. under a pressure condition of 15 to 50 MPa. Thereby, the laminated green sheets 11 and 21 are pressure-bonded, and the portion of the slope forming green sheet 31 that covers the stepped portion is pressed against the stepped portion by water pressure, and the stepped unevenness is flattened. At the same time, the surface is covered with the slope portion forming green sheet 31 to form an inclined surface having a flat plane. In this way, the conductor pattern 41 along the gentle slope of the conductor pattern printed on the stepped portion of the slope forming green sheet 31 is formed.

  Next, the compression molded laminate 101 is taken out of the bag and fired at about 600 ° C. to 900 ° C. for 300 minutes to complete the multilayer ceramic substrate 100. The multilayer ceramic substrate 100 manufactured in this way can be used as an external connection portion connected to an external circuit, for example, by the conductor pattern 41 extending from the inclined surface.

  The multilayer ceramic substrate 100 manufactured by the above manufacturing method can form the conductor pattern 41 on a slope. Therefore, since the wiring pattern does not bend at right angles, there is no mismatch in characteristic impedance at the bending point, and radiation can be prevented, which is particularly suitable for applications that handle high frequencies such as microwaves and millimeter waves. It can be a multilayer ceramic substrate.

  In Example 1, the ceramic green sheet 11 that does not form the stepped portion is provided in the lowermost layer. This is intended to reinforce the portion of the substrate (portion A in FIG. 1) extending from the slope portion. Therefore, it is not always necessary to provide it. On the other hand, if it is desired to make the substrate stronger, a plurality of layers may be provided. Further, as shown in FIG. 5, the slope portion forming green sheet 31 is not necessarily a single sheet, and may be formed by overlapping a plurality of sheets. Further, in the first embodiment, an example is shown in which a stepped portion is provided on the upper surface side and the slope portion forming green sheet is covered from the upper surface. As an application example of the first embodiment, as shown in FIG. Alternatively, it may be produced upside down, or as shown in FIG. 7, stepped portions may be provided on the upper and lower sides and slopes may be provided on both sides. In this case, it can be manufactured by performing the manufacturing method on both sides simultaneously.

  Moreover, as shown in FIG. 8, it is also possible to produce convex (FIG. 8) and concave (FIG. 9) slopes by changing the stepped step by each layer.

  Next, the manufacturing method of the multilayer ceramic substrate based on Example 2 is demonstrated along FIGS. The multilayer ceramic substrate produced by the manufacturing method in Example 2 is the same as the multilayer ceramic substrate 100 produced in Example 1. However, the manufacturing process is partially different from that of the first embodiment.

  As shown in FIG. 10, the process is the same as that of Example 1 until the middle ceramic sheet 21 is laminated stepwise on the surface of the lowermost ceramic green sheet 11.

  In the next step, in Example 2, the stepped portion 50 of the ceramic green sheet 21 that becomes the slope of the ceramic substrate is crushed by the pressing means and formed to be flat to some extent (FIG. 11). That is, the stepped portion is flattened to some extent or completely before being covered with the slope portion forming green sheet. As a pressing means method, a mechanical press may be used, or an isostatic press may be used as in the compression molding process. Thereafter, the slope portion forming green sheet 31 is laminated so as to cover the slope portion 50 (FIG. 12).

  After that, as in Example 1, the laminated body 101 in which the lower and middle ceramic green sheets 11 and 21 and the slope forming green sheet 31 were laminated was inserted into a bag 60 made of plastic, rubber or the like. A multilayer ceramic substrate is manufactured by vacuum packaging, and compression-molding and firing.

  According to the method for manufacturing a multilayer ceramic substrate according to the second embodiment, the step portion is crushed in advance, so that a flatr slope can be provided.

  Next, a method for manufacturing a multilayer ceramic substrate according to Example 3 will be described. The manufacturing method of the multilayer ceramic substrate in Example 3 is the same as the manufacturing method of Example 1, except that the stacked green sheet 31 for forming the slope portion is stacked in the middle layer instead of being disposed in the uppermost layer. That is, as shown in FIG. 13, ceramic green sheets 21 are stacked in a stepped manner, and thereafter sloped portion forming green sheets 31 are stacked so as to cover the stepped portions. A laminate is compression molded. According to the method for manufacturing a multilayer ceramic substrate according to the third embodiment, as shown in FIG. 14, the conductor pattern can be formed on the slope portion from the middle layer to the lower layer, and the conductor pattern can be drawn from the middle layer. become able to.

  Next, a method for manufacturing a multilayer ceramic substrate according to Example 4 will be described. The multilayer ceramic substrate according to Example 4 is a method of providing a slope on the end face of the cavity portion.

First, the configuration of the finally produced multilayer ceramic substrate will be described. As shown in FIG.
The multilayer ceramic substrate 110 according to the first embodiment includes a ceramic substrate 10a formed below the bottom surface of the cavity, an intermediate ceramic substrate 20a, and an uppermost ceramic substrate 30a covering the inclined surface portion of the opening forming the cavity portion. ing. Circuit patterns, via-hole conductors, and the like are formed on the lower ceramic substrate 10a, the middle ceramic substrate 20a, and the uppermost ceramic substrate 30a, respectively. A wall around the cavity is formed by a flat inclined surface, and a conductor pattern 40a is provided on the inclined surface.

  Next, a method for manufacturing the multilayer ceramic substrate 110 described above will be described with reference to FIGS. First, as shown in FIG. 2, a conductor pattern is printed on the ceramic green sheet 11a using a conductive paste to form a desired conductor pattern 40a. If necessary, via holes are formed by laser or the like after or before the conductor pattern 40a is printed, and each interlayer connection portion 42a is formed so as to be conductive between the layers by filling with a conductive paste. And as shown in FIG. 16, the ceramic green sheet 11a is laminated | stacked on the part which makes this lower layer ceramic substrate.

  Next, an intermediate ceramic green sheet 21a constituting the cavity is laminated. As the ceramic green sheet 21 of this portion, a ceramic green sheet having a through hole at a cavity forming position is used. The through holes are provided so as to have different sizes according to the ceramic green sheets 21a forming the respective layers, and are stacked such that the side walls of the cavity portion are stepped as shown in FIG. In addition, the point which forms a conductor pattern and a via hole as needed is the same as that of the ceramic green sheet 11a of a lower layer. Moreover, the structure of the ceramic green sheet to be used is the same as that of Example 1.

  Further, a slope forming green sheet 31a forming the uppermost ceramic substrate 30a is laminated so as to cover the stepped portion 50a. The slope forming green sheet 31a is formed with a necessary conductor pattern 40a for both the stepped portion and the other portions, and as shown in FIG. 17, the conductor pattern 40a is positioned so that it is positioned on the stepped portion. Laminate on the surface.

  Then, as shown in FIG. 19, a laminated body 101a (FIG. 18) in which the lower, middle and uppermost ceramic green sheets 11a and 21a and the slope forming green sheet 31a are laminated is a bag 60a made of plastic or the like. Insert into vacuum packaging. And this bag is compression-molded in the water tank of an isostatic press. Thereby, the green sheets 11a and 21a in the laminated state are pressure-bonded and integrated, and the portion of the slope forming green sheet 31a that is in the stepped portion is pressed against the stepped portion by water pressure, and the stepped unevenness is At the same time, the surface is covered with the slope portion forming green sheet 31a to form an inclined surface having a flat plane (FIG. 20). At this time, the place 40a where the conductor pattern is printed on the stepped portion of the slope forming green sheet is provided with the conductor pattern 41a along the gentle slope.

  The laminated body 101a thus compression-molded is taken out of the bag and fired at about 600 ° C. to 900 ° C. for 300 minutes to form a multilayer ceramic substrate. And a circuit element is attached and it electrically connects by wire-bonding the electrode and conductor pattern of a circuit element.

  The multilayer ceramic substrate produced by the above manufacturing method can be formed with the wall surface of the cavity as an inclined surface. Therefore, since the wiring pattern does not bend at right angles, there is no mismatch in characteristic impedance at the bending point, and radiation can be prevented, which is particularly suitable for applications that handle high frequencies such as microwaves and millimeter waves. Multilayer substrates can be manufactured.

  In addition, as shown in FIGS. 21 and 22, the multilayer ceramic plate in which the cavity is formed in the cavity in the fourth embodiment can form a parabolic concave portion by changing in each layer when providing a step. Such a multilayer ceramic substrate can be used as a reflecting mirror with an LED attached.

It is sectional drawing which shows the multilayer ceramic substrate produced by the manufacturing method of Example 1 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 1 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 2 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 2 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 2 which concerns on this invention. It is sectional drawing which shows the multilayer ceramic substrate produced by the manufacturing method of Example 3 which concerns on this invention. It is sectional drawing which shows the multilayer ceramic substrate produced by the manufacturing method of Example 3 which concerns on this invention. It is sectional drawing which shows the multilayer ceramic substrate produced by the manufacturing method of Example 4 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing which shows a part of manufacturing process of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is sectional drawing of the multilayer substrate produced by the application example of the manufacturing method of the multilayer ceramic substrate of Example 4 which concerns on this invention. It is a ceramic multilayer substrate showing a state in which a conductor is formed on a vertical surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Multilayer ceramic substrate 10 Ceramic substrate 20 formed in the lower layer Medium layer ceramic substrate 30 arrange | positioned in the layer which forms a slope The uppermost layer ceramic substrate 11 and 21 which covers a slope part Ceramic green sheet 31 The green sheet for slope part formation

Claims (10)

(A) a step of laminating a plurality of ceramic green sheets in a step shape;
(B) a step of laminating one or two or more slope portion forming green sheets so as to include at least a stepped portion on the surface of the plurality of laminated ceramic green sheets;
(C) a compression molding step for flattening the staircase portion along the stepped portion with the slope forming green sheet;
(D) a step of sintering the laminate that has been compression molded in the compression molding step;
A method for producing a multilayer ceramic substrate comprising:   2. The method for manufacturing a multilayer ceramic substrate according to claim 1, wherein the slope forming green sheet has a pattern formed at least on a portion including a stepped portion. Between the step (b) and the step (c), including a step of vacuum packaging the laminate laminated by the step (a) and the step (b),
The method for producing a multilayer ceramic substrate according to claim 1, wherein the compression molding step uses a hydraulic press. (A) a step of laminating a plurality of ceramic green sheets in a step shape;
(B) a pressing step for making the stepped portion of the laminated ceramic green sheets into a flattened slope;
(C) laminating one or two or more slope forming green sheets on the surface of the laminated ceramic green sheets so as to include at least a flattened slope;
(D) a compression molding step of compressing the green sheet for forming the slope portion along the flattened slope;
(E) a step of sintering the laminate that has been compression molded in the compression molding step;
A method for producing a multilayer ceramic substrate comprising:   5. The method of manufacturing a multilayer ceramic substrate according to claim 4, wherein the slope portion forming green sheet has at least a pattern formed on a portion including at least a flattened slope. Between the step (c) and the step (d), including a step of vacuum packaging the laminate laminated by the step (c) from the step (a),
6. The method of manufacturing a multilayer ceramic substrate according to claim 4, wherein the compression molding step uses a hydraulic press. (A) a step of laminating a plurality of ceramic green sheets having through holes of different sizes at positions where cavities are formed, so that the side walls of the cavities are stepped;
(B) a step of laminating a slope portion forming green sheet so as to include at least a stepped portion on an upper surface of the plurality of laminated ceramic green sheets;
(C), a compression molding step of flattening the stepped portion while aligning the slope forming green sheet to the stepped portion of the laminate,
(D) a step of sintering the compression-molded laminate;
A method for producing a multilayer ceramic substrate comprising: 8. The method for manufacturing a multilayer ceramic substrate according to claim 7, wherein the slope portion forming green sheet has a pattern formed at least on a portion including a stepped portion. Between the step (b) and the step (c), including a step of vacuum packaging the laminate laminated by the step (a) and the step (b),
The method for manufacturing a multilayer ceramic substrate according to claim 7 or 8, wherein the compression molding step uses a hydraulic press.   In the step (b), one or more slope forming green sheets are laminated on the upper surface of the laminated ceramic green sheets, and the ceramic green sheets are further laminated stepwise. The method for producing a multilayer ceramic substrate according to claim 1, wherein the method is a process.

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