JP2009289447A5 - - Google Patents

Download PDF

Info

Publication number
JP2009289447A5
JP2009289447A5 JP2008137973A JP2008137973A JP2009289447A5 JP 2009289447 A5 JP2009289447 A5 JP 2009289447A5 JP 2008137973 A JP2008137973 A JP 2008137973A JP 2008137973 A JP2008137973 A JP 2008137973A JP 2009289447 A5 JP2009289447 A5 JP 2009289447A5
Authority
JP
Japan
Prior art keywords
hole
wiring board
holes
press
dummy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008137973A
Other languages
English (en)
Japanese (ja)
Other versions
JP5117282B2 (ja
JP2009289447A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008137973A priority Critical patent/JP5117282B2/ja
Priority claimed from JP2008137973A external-priority patent/JP5117282B2/ja
Publication of JP2009289447A publication Critical patent/JP2009289447A/ja
Publication of JP2009289447A5 publication Critical patent/JP2009289447A5/ja
Application granted granted Critical
Publication of JP5117282B2 publication Critical patent/JP5117282B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008137973A 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置 Expired - Fee Related JP5117282B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008137973A JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008137973A JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

Publications (3)

Publication Number Publication Date
JP2009289447A JP2009289447A (ja) 2009-12-10
JP2009289447A5 true JP2009289447A5 (https=) 2010-10-28
JP5117282B2 JP5117282B2 (ja) 2013-01-16

Family

ID=41458490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008137973A Expired - Fee Related JP5117282B2 (ja) 2008-05-27 2008-05-27 配線基板及びこれを備えた電子装置

Country Status (1)

Country Link
JP (1) JP5117282B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628772B2 (ja) * 2011-10-20 2014-11-19 日立オートモティブシステムズ株式会社 プリント基板およびそれを用いた電子機器
JP6274058B2 (ja) 2014-09-22 2018-02-07 株式会社デンソー 電子装置、及び電子装置を備えた電子構造体
JP6866121B2 (ja) 2016-11-14 2021-04-28 日立Astemo株式会社 半導体モジュール
JP6711262B2 (ja) 2016-12-26 2020-06-17 株式会社デンソー 電子装置
JP2019020300A (ja) * 2017-07-19 2019-02-07 アイシン精機株式会社 センサ電極構造およびセンサ電極構造の製造方法
JP2019169279A (ja) * 2018-03-22 2019-10-03 株式会社アドヴィックス プレスフィット端子接続装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419806Y2 (https=) * 1990-11-27 1992-05-06
JPH0629026U (ja) * 1992-09-10 1994-04-15 本多通信工業株式会社 コネクタ用ハウジング
JP2004134302A (ja) * 2002-10-11 2004-04-30 Fujitsu Ten Ltd プレスフィット端子接続装置及びプレスフィット接続配線基板
JP2008053091A (ja) * 2006-08-25 2008-03-06 Honda Tsushin Kogyo Co Ltd プレスフィットコンタクト

Similar Documents

Publication Publication Date Title
JP2009289447A5 (https=)
WO2006071890A3 (en) Midplane epecially applicable to an ortogonal architecture electronic system
EP1909543A3 (en) Wired circuit board and electronic device
EP2728981A3 (en) Connecting structure between circuit boards and battery pack having the same
JP2006303360A5 (https=)
EP2219273A3 (en) Connectors to connect electronic devices
WO2007002342A3 (en) Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
JP2010165840A5 (https=)
WO2008102326A3 (en) In-grid decoupling for ball grid array (bga) devices
EP2498288A3 (en) Circuit board using heat radiating member, electronic module and method for manufacturing the module
EP2048922A3 (en) COF Board
WO2009022517A1 (ja) 配線基板、及び、液晶表示装置
EP2590267A3 (en) Electrical harness connector
EP1962566A3 (en) Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
JP2006319050A5 (https=)
JP2007525808A5 (https=)
EP3151342A3 (en) Interconnect devices
JP2011124549A5 (https=)
TW200733843A (en) Filter and its coils connecting frame
EP2568784A3 (en) USB application device and method for assembling USB application device
WO2007081928A3 (en) 360 degree viewable light emitting apparatus
WO2012005434A3 (ko) 마이크로폰
WO2006036918A3 (en) Backplane with routing to reduce layer count
US8317546B2 (en) Printed circuit board
WO2014195806A3 (en) Methods and systems for insertion of spare wiring structures for improved engineering change orders