JP2009283895A5 - - Google Patents

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Publication number
JP2009283895A5
JP2009283895A5 JP2008318791A JP2008318791A JP2009283895A5 JP 2009283895 A5 JP2009283895 A5 JP 2009283895A5 JP 2008318791 A JP2008318791 A JP 2008318791A JP 2008318791 A JP2008318791 A JP 2008318791A JP 2009283895 A5 JP2009283895 A5 JP 2009283895A5
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JP
Japan
Prior art keywords
group iii
iii nitride
nitride semiconductor
sapphire substrate
multilayer structure
Prior art date
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Pending
Application number
JP2008318791A
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English (en)
Japanese (ja)
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JP2009283895A (ja
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Priority to JP2008318791A priority Critical patent/JP2009283895A/ja
Priority claimed from JP2008318791A external-priority patent/JP2009283895A/ja
Publication of JP2009283895A publication Critical patent/JP2009283895A/ja
Publication of JP2009283895A5 publication Critical patent/JP2009283895A5/ja
Pending legal-status Critical Current

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JP2008318791A 2008-12-15 2008-12-15 Iii族窒化物半導体積層構造体 Pending JP2009283895A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008318791A JP2009283895A (ja) 2008-12-15 2008-12-15 Iii族窒化物半導体積層構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008318791A JP2009283895A (ja) 2008-12-15 2008-12-15 Iii族窒化物半導体積層構造体

Related Parent Applications (1)

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JP2008135939A Division JP2009283785A (ja) 2008-05-23 2008-05-23 Iii族窒化物半導体積層構造体およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010278305A Division JP2011103472A (ja) 2010-12-14 2010-12-14 Iii族窒化物半導体積層構造体

Publications (2)

Publication Number Publication Date
JP2009283895A JP2009283895A (ja) 2009-12-03
JP2009283895A5 true JP2009283895A5 (https=) 2010-07-08

Family

ID=41453989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008318791A Pending JP2009283895A (ja) 2008-12-15 2008-12-15 Iii族窒化物半導体積層構造体

Country Status (1)

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JP (1) JP2009283895A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010035489A1 (de) * 2010-08-26 2012-03-01 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelement
KR101335937B1 (ko) * 2012-06-04 2013-12-04 주식회사 루미스탈 Llo 방식을 이용한 질화갈륨 웨이퍼 제조 방법
JP2015160995A (ja) * 2014-02-27 2015-09-07 シャープ株式会社 AlNOバッファ層の製造方法および窒化物半導体素子の製造方法
JP6491488B2 (ja) * 2015-01-30 2019-03-27 住友金属鉱山株式会社 エピタキシャル成長用基板及びその製造方法
CN119643908A (zh) * 2025-02-19 2025-03-18 吉林大学 一种薄膜透射样品制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173829A (ja) * 1984-02-14 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体薄膜の成長方法
JPH0964477A (ja) * 1995-08-25 1997-03-07 Toshiba Corp 半導体発光素子及びその製造方法
JP2002029896A (ja) * 2000-07-05 2002-01-29 National Institute Of Advanced Industrial & Technology 窒化物半導体の結晶成長方法
JP3954335B2 (ja) * 2001-06-15 2007-08-08 日本碍子株式会社 Iii族窒化物多層膜
JP4117402B2 (ja) * 2002-03-14 2008-07-16 国立大学法人東京工業大学 単結晶窒化アルミニウム膜およびその形成方法、iii族窒化物膜用下地基板、発光素子、並びに表面弾性波デバイス
JP4749792B2 (ja) * 2005-08-03 2011-08-17 国立大学法人東京農工大学 アルミニウム系iii族窒化物結晶の製造方法および結晶積層基板
JP2007095786A (ja) * 2005-09-27 2007-04-12 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子

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