JP2009280788A5 - - Google Patents
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- Publication number
- JP2009280788A5 JP2009280788A5 JP2008264136A JP2008264136A JP2009280788A5 JP 2009280788 A5 JP2009280788 A5 JP 2009280788A5 JP 2008264136 A JP2008264136 A JP 2008264136A JP 2008264136 A JP2008264136 A JP 2008264136A JP 2009280788 A5 JP2009280788 A5 JP 2009280788A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- optical semiconductor
- semiconductor element
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 19
- 229920001187 thermosetting polymer Polymers 0.000 claims 19
- 230000003287 optical effect Effects 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 12
- 150000002430 hydrocarbons Chemical group 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 238000001721 transfer moulding Methods 0.000 claims 5
- -1 tricarboxylic acid compound Chemical class 0.000 claims 5
- 150000001735 carboxylic acids Chemical class 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 claims 2
- 125000004018 acid anhydride group Chemical group 0.000 claims 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims 2
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 claims 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 150000007973 cyanuric acids Chemical class 0.000 claims 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 claims 1
- 239000004914 cyclooctane Substances 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 150000002790 naphthalenes Chemical class 0.000 claims 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims 1
- 229930195734 saturated hydrocarbon Natural products 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical class OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008264136A JP5401905B2 (ja) | 2008-04-25 | 2008-10-10 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008115391 | 2008-04-25 | ||
| JP2008115391 | 2008-04-25 | ||
| JP2008264136A JP5401905B2 (ja) | 2008-04-25 | 2008-10-10 | 熱硬化性樹脂組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012256297A Division JP5803883B2 (ja) | 2008-04-25 | 2012-11-22 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009280788A JP2009280788A (ja) | 2009-12-03 |
| JP2009280788A5 true JP2009280788A5 (https=) | 2011-09-22 |
| JP5401905B2 JP5401905B2 (ja) | 2014-01-29 |
Family
ID=41451571
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008264136A Active JP5401905B2 (ja) | 2008-04-25 | 2008-10-10 | 熱硬化性樹脂組成物 |
| JP2012256297A Active JP5803883B2 (ja) | 2008-04-25 | 2012-11-22 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2015086231A Pending JP2015149507A (ja) | 2008-04-25 | 2015-04-20 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2017002764A Active JP6512228B2 (ja) | 2008-04-25 | 2017-01-11 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012256297A Active JP5803883B2 (ja) | 2008-04-25 | 2012-11-22 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2015086231A Pending JP2015149507A (ja) | 2008-04-25 | 2015-04-20 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2017002764A Active JP6512228B2 (ja) | 2008-04-25 | 2017-01-11 | 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (4) | JP5401905B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194965B (zh) * | 2010-03-18 | 2015-01-07 | 展晶科技(深圳)有限公司 | 化合物半导体封装结构及其制造方法 |
| JP2015053468A (ja) * | 2013-08-07 | 2015-03-19 | 日東電工株式会社 | 半導体パッケージの製造方法 |
| JP2016180088A (ja) * | 2014-07-24 | 2016-10-13 | 三菱化学株式会社 | 熱硬化性樹脂組成物及びその成形体 |
| JP7305104B2 (ja) * | 2021-07-26 | 2023-07-10 | 太陽ホールディングス株式会社 | Ｌｅｄ実装用基板およびｌｅｄ実装基板 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5021151B2 (ja) * | 2003-11-19 | 2012-09-05 | 株式会社カネカ | 半導体のパッケージ用硬化性樹脂組成物および半導体 |
| JP5303097B2 (ja) * | 2005-10-07 | 2013-10-02 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
| KR20090013230A (ko) * | 2006-06-02 | 2009-02-04 | 히다치 가세고교 가부시끼가이샤 | 광반도체소자 탑재용 패키지 및 이것을 이용한 광반도체장치 |
| JP5572936B2 (ja) * | 2007-11-26 | 2014-08-20 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP4586925B2 (ja) * | 2008-01-09 | 2010-11-24 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP4666075B2 (ja) * | 2008-01-11 | 2011-04-06 | 日立化成工業株式会社 | 多価カルボン酸縮合体、並びにこれを用いたエポキシ樹脂用硬化剤、エポキシ樹脂組成物、ポリアミド樹脂及びポリエステル樹脂 |
-
2008
- 2008-10-10 JP JP2008264136A patent/JP5401905B2/ja active Active
-
2012
- 2012-11-22 JP JP2012256297A patent/JP5803883B2/ja active Active
-
2015
- 2015-04-20 JP JP2015086231A patent/JP2015149507A/ja active Pending
-
2017
- 2017-01-11 JP JP2017002764A patent/JP6512228B2/ja active Active
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