JP2009267756A - カメラ装置 - Google Patents
カメラ装置 Download PDFInfo
- Publication number
- JP2009267756A JP2009267756A JP2008114761A JP2008114761A JP2009267756A JP 2009267756 A JP2009267756 A JP 2009267756A JP 2008114761 A JP2008114761 A JP 2008114761A JP 2008114761 A JP2008114761 A JP 2008114761A JP 2009267756 A JP2009267756 A JP 2009267756A
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- JP
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- Prior art keywords
- reference base
- imaging element
- image sensor
- camera device
- elastic material
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
Abstract
温度変動や振動が加わる画像処理装置の使用環境においては、撮像素子に当接する構造部材と接着剤間、及び接着剤と撮像素子間の線膨張係数の違いによる熱応力や振動による応力,接着剤の劣化により接着剥がれ等、撮像素子とレンズの相対位置変動が発生し、画像認識対象を正しく撮像できなくなる可能性が高い、という課題がある。
【解決手段】
レンズと撮像素子を備えるカメラ装置において、撮像素子は、基準ベース,弾性材、及び、プリント基板により固定される。撮像素子は、基準ベースの第1の面に当接され、弾性材は、基準ベースの第1の面とは反対の第2の面と、プリント基板で挟まれていてもよい。
【選択図】図1
Description
1−a 撮像素子のパッケージ
1−b 撮像素子のリード
2 基準ベース
3 弾性体
4 プリント基板
5 はんだ
6 レンズ
Claims (8)
- レンズと撮像素子を備えるカメラ装置において、
前記撮像素子は、基準ベース,弾性材、及び、プリント基板により固定される、カメラ装置。 - 前記撮像素子は、前記基準ベースの第1の面に当接され、
前記弾性材は、前記基準ベースの前記第1の面とは反対の第2の面と、前記プリント基板で挟まれる、請求項1記載のカメラ装置。 - 前記撮像素子,前記基準ベース,前記弾性体、及び、前記プリント基板は、はんだで固定される、請求項1記載のカメラ装置。
- 前記弾性材は、シリコンゴムである、請求項1記載のカメラ装置。
- 前記シリコンゴムは、円筒状である、請求項4記載のカメラ装置。
- 前記弾性材は、着色される、請求項1記載のカメラ装置。
- 前記基準ベースと前記弾性材を、所定値以上の色差とする、請求項6記載のカメラ装置。
- 前記弾性材は、板バネである、請求項1記載のカメラ装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008114761A JP5017168B2 (ja) | 2008-04-25 | 2008-04-25 | カメラ装置 |
AT09158746T ATE511667T1 (de) | 2008-04-25 | 2009-04-24 | Kameraeinheit |
US12/429,719 US8005355B2 (en) | 2008-04-25 | 2009-04-24 | Camera unit |
EP09158746A EP2112538B1 (en) | 2008-04-25 | 2009-04-24 | Camera unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008114761A JP5017168B2 (ja) | 2008-04-25 | 2008-04-25 | カメラ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009267756A true JP2009267756A (ja) | 2009-11-12 |
JP5017168B2 JP5017168B2 (ja) | 2012-09-05 |
Family
ID=40904143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008114761A Active JP5017168B2 (ja) | 2008-04-25 | 2008-04-25 | カメラ装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8005355B2 (ja) |
EP (1) | EP2112538B1 (ja) |
JP (1) | JP5017168B2 (ja) |
AT (1) | ATE511667T1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2663070A1 (de) * | 2012-05-10 | 2013-11-13 | Basler AG | Bildsensor-Baugruppe für eine Kamera, sowie Verfahren und Biegewerkzeug zu dessen Herstellung |
JP2022511552A (ja) * | 2018-12-21 | 2022-01-31 | ウェイモ エルエルシー | 自動運転車両カメラのセンサクランプ設計 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10243280A (ja) * | 1997-02-28 | 1998-09-11 | Rhythm Watch Co Ltd | 固体撮像素子カメラ |
JP2001050233A (ja) * | 1999-08-11 | 2001-02-23 | Toshiba Eng Co Ltd | 締付け確認方法及び締付け確認部材 |
WO2006088051A1 (ja) * | 2005-02-16 | 2006-08-24 | Konica Minolta Opto, Inc. | カメラモジュール |
JP2006279533A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法 |
JP2007243641A (ja) * | 2006-03-09 | 2007-09-20 | Olympus Imaging Corp | 塵埃画像防止装置、画像機器および撮像装置 |
JP2008077072A (ja) * | 2006-08-23 | 2008-04-03 | Konica Minolta Opto Inc | 撮像素子ユニット及び撮像装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6314473Y2 (ja) * | 1977-05-25 | 1988-04-22 | ||
JPH0777428B2 (ja) | 1987-06-19 | 1995-08-16 | キヤノン株式会社 | 固体撮像装置 |
JP3387199B2 (ja) * | 1994-04-21 | 2003-03-17 | 松下電器産業株式会社 | 角速度センサ装置 |
US5685682A (en) * | 1996-06-26 | 1997-11-11 | General Motors Corporation | Snap-fit fastener device with first and second materials |
JP3836235B2 (ja) * | 1997-12-25 | 2006-10-25 | 松下電器産業株式会社 | 固体撮像装置及びその製造方法 |
JP2000069336A (ja) | 1998-08-26 | 2000-03-03 | Sanyo Electric Co Ltd | 撮像装置の取付け構造 |
JP4185236B2 (ja) | 2000-06-19 | 2008-11-26 | イーストマン コダック カンパニー | 固体撮像素子および撮像装置 |
US6399888B1 (en) * | 2000-10-26 | 2002-06-04 | Lite-On Electronics, Inc. | Buffering and supporting device for a circuit board |
US7304684B2 (en) * | 2000-11-14 | 2007-12-04 | Kabushiki Kaisha Toshiba | Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus |
JP4158347B2 (ja) * | 2001-03-21 | 2008-10-01 | 日本電気株式会社 | 電子部品取付構造 |
JP4083521B2 (ja) * | 2001-10-29 | 2008-04-30 | オリンパス株式会社 | 撮像装置 |
JP2003348462A (ja) * | 2002-05-27 | 2003-12-05 | Olympus Optical Co Ltd | カメラ及び撮像素子ユニット |
JP4233855B2 (ja) * | 2002-11-29 | 2009-03-04 | 京セラ株式会社 | 携帯端末装置 |
JP2005284147A (ja) * | 2004-03-30 | 2005-10-13 | Fuji Photo Film Co Ltd | 撮像装置 |
US7368695B2 (en) * | 2004-05-03 | 2008-05-06 | Tessera, Inc. | Image sensor package and fabrication method |
JP2006094444A (ja) | 2004-09-27 | 2006-04-06 | Casio Comput Co Ltd | 固体撮像素子の固定構造 |
CN2932759Y (zh) * | 2006-07-04 | 2007-08-08 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
JP2008130681A (ja) * | 2006-11-17 | 2008-06-05 | Fuji Polymer Industries Co Ltd | 異方導電性ゴムコネクタ及びこれを用いた電気接続方法 |
US7277242B1 (en) * | 2007-03-16 | 2007-10-02 | Advanced Connection Technology Inc. | Lens module |
CN101281589B (zh) * | 2007-04-04 | 2010-06-16 | 鸿富锦精密工业(深圳)有限公司 | 指纹识别装置及便携式电子装置 |
-
2008
- 2008-04-25 JP JP2008114761A patent/JP5017168B2/ja active Active
-
2009
- 2009-04-24 EP EP09158746A patent/EP2112538B1/en active Active
- 2009-04-24 AT AT09158746T patent/ATE511667T1/de not_active IP Right Cessation
- 2009-04-24 US US12/429,719 patent/US8005355B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10243280A (ja) * | 1997-02-28 | 1998-09-11 | Rhythm Watch Co Ltd | 固体撮像素子カメラ |
JP2001050233A (ja) * | 1999-08-11 | 2001-02-23 | Toshiba Eng Co Ltd | 締付け確認方法及び締付け確認部材 |
WO2006088051A1 (ja) * | 2005-02-16 | 2006-08-24 | Konica Minolta Opto, Inc. | カメラモジュール |
JP2006279533A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法 |
JP2007243641A (ja) * | 2006-03-09 | 2007-09-20 | Olympus Imaging Corp | 塵埃画像防止装置、画像機器および撮像装置 |
JP2008077072A (ja) * | 2006-08-23 | 2008-04-03 | Konica Minolta Opto Inc | 撮像素子ユニット及び撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
ATE511667T1 (de) | 2011-06-15 |
US20090269050A1 (en) | 2009-10-29 |
EP2112538A1 (en) | 2009-10-28 |
JP5017168B2 (ja) | 2012-09-05 |
EP2112538B1 (en) | 2011-06-01 |
US8005355B2 (en) | 2011-08-23 |
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