ATE511667T1 - Kameraeinheit - Google Patents

Kameraeinheit

Info

Publication number
ATE511667T1
ATE511667T1 AT09158746T AT09158746T ATE511667T1 AT E511667 T1 ATE511667 T1 AT E511667T1 AT 09158746 T AT09158746 T AT 09158746T AT 09158746 T AT09158746 T AT 09158746T AT E511667 T1 ATE511667 T1 AT E511667T1
Authority
AT
Austria
Prior art keywords
imaging device
adhesive
base plate
plane
abuts
Prior art date
Application number
AT09158746T
Other languages
English (en)
Inventor
Masaaki Fukuhara
Norio Koike
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of ATE511667T1 publication Critical patent/ATE511667T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Lens Barrels (AREA)
AT09158746T 2008-04-25 2009-04-24 Kameraeinheit ATE511667T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008114761A JP5017168B2 (ja) 2008-04-25 2008-04-25 カメラ装置

Publications (1)

Publication Number Publication Date
ATE511667T1 true ATE511667T1 (de) 2011-06-15

Family

ID=40904143

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09158746T ATE511667T1 (de) 2008-04-25 2009-04-24 Kameraeinheit

Country Status (4)

Country Link
US (1) US8005355B2 (de)
EP (1) EP2112538B1 (de)
JP (1) JP5017168B2 (de)
AT (1) ATE511667T1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2663070A1 (de) * 2012-05-10 2013-11-13 Basler AG Bildsensor-Baugruppe für eine Kamera, sowie Verfahren und Biegewerkzeug zu dessen Herstellung
US11201992B2 (en) 2018-12-21 2021-12-14 Waymo Llc Sensor clamping design for autonomous vehicle camera

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314473Y2 (de) * 1977-05-25 1988-04-22
JPH0777428B2 (ja) 1987-06-19 1995-08-16 キヤノン株式会社 固体撮像装置
JP3387199B2 (ja) * 1994-04-21 2003-03-17 松下電器産業株式会社 角速度センサ装置
US5685682A (en) * 1996-06-26 1997-11-11 General Motors Corporation Snap-fit fastener device with first and second materials
JPH10243280A (ja) * 1997-02-28 1998-09-11 Rhythm Watch Co Ltd 固体撮像素子カメラ
JP3836235B2 (ja) 1997-12-25 2006-10-25 松下電器産業株式会社 固体撮像装置及びその製造方法
JP2000069336A (ja) * 1998-08-26 2000-03-03 Sanyo Electric Co Ltd 撮像装置の取付け構造
JP2001050233A (ja) * 1999-08-11 2001-02-23 Toshiba Eng Co Ltd 締付け確認方法及び締付け確認部材
JP4185236B2 (ja) 2000-06-19 2008-11-26 イーストマン コダック カンパニー 固体撮像素子および撮像装置
US6399888B1 (en) * 2000-10-26 2002-06-04 Lite-On Electronics, Inc. Buffering and supporting device for a circuit board
US7304684B2 (en) 2000-11-14 2007-12-04 Kabushiki Kaisha Toshiba Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus
JP4158347B2 (ja) * 2001-03-21 2008-10-01 日本電気株式会社 電子部品取付構造
JP4083521B2 (ja) * 2001-10-29 2008-04-30 オリンパス株式会社 撮像装置
JP2003348462A (ja) * 2002-05-27 2003-12-05 Olympus Optical Co Ltd カメラ及び撮像素子ユニット
JP4233855B2 (ja) * 2002-11-29 2009-03-04 京セラ株式会社 携帯端末装置
JP2005284147A (ja) * 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd 撮像装置
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
JP2006094444A (ja) 2004-09-27 2006-04-06 Casio Comput Co Ltd 固体撮像素子の固定構造
WO2006088051A1 (ja) * 2005-02-16 2006-08-24 Konica Minolta Opto, Inc. カメラモジュール
JP4233535B2 (ja) * 2005-03-29 2009-03-04 シャープ株式会社 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法
JP2007243641A (ja) * 2006-03-09 2007-09-20 Olympus Imaging Corp 塵埃画像防止装置、画像機器および撮像装置
CN2932759Y (zh) * 2006-07-04 2007-08-08 富士康(昆山)电脑接插件有限公司 电连接器组件
JP2008077072A (ja) * 2006-08-23 2008-04-03 Konica Minolta Opto Inc 撮像素子ユニット及び撮像装置
JP2008130681A (ja) * 2006-11-17 2008-06-05 Fuji Polymer Industries Co Ltd 異方導電性ゴムコネクタ及びこれを用いた電気接続方法
US7277242B1 (en) * 2007-03-16 2007-10-02 Advanced Connection Technology Inc. Lens module
CN101281589B (zh) * 2007-04-04 2010-06-16 鸿富锦精密工业（深圳）有限公司 指纹识别装置及便携式电子装置

Also Published As

Publication number Publication date
JP5017168B2 (ja) 2012-09-05
US20090269050A1 (en) 2009-10-29
EP2112538A1 (de) 2009-10-28
EP2112538B1 (de) 2011-06-01
US8005355B2 (en) 2011-08-23
JP2009267756A (ja) 2009-11-12

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties