JP2009260049A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009260049A5 JP2009260049A5 JP2008107582A JP2008107582A JP2009260049A5 JP 2009260049 A5 JP2009260049 A5 JP 2009260049A5 JP 2008107582 A JP2008107582 A JP 2008107582A JP 2008107582 A JP2008107582 A JP 2008107582A JP 2009260049 A5 JP2009260049 A5 JP 2009260049A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal
- alloy
- metal layer
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 38
- 239000002184 metal Substances 0.000 claims 27
- 229910052751 metal Inorganic materials 0.000 claims 27
- 229910045601 alloy Inorganic materials 0.000 claims 11
- 239000000956 alloy Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 7
- 229910000846 In alloy Inorganic materials 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 239000000155 melt Substances 0.000 claims 3
- 229910017980 Ag—Sn Inorganic materials 0.000 claims 2
- 229910017755 Cu-Sn Inorganic materials 0.000 claims 2
- 229910017927 Cu—Sn Inorganic materials 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008107582A JP5248179B2 (ja) | 2008-04-17 | 2008-04-17 | 電子装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008107582A JP5248179B2 (ja) | 2008-04-17 | 2008-04-17 | 電子装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009260049A JP2009260049A (ja) | 2009-11-05 |
| JP2009260049A5 true JP2009260049A5 (OSRAM) | 2011-02-24 |
| JP5248179B2 JP5248179B2 (ja) | 2013-07-31 |
Family
ID=41387100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008107582A Active JP5248179B2 (ja) | 2008-04-17 | 2008-04-17 | 電子装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5248179B2 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130155629A1 (en) * | 2011-12-19 | 2013-06-20 | Tong Hsing Electronic Industries, Ltd. | Hermetic Semiconductor Package Structure and Method for Manufacturing the same |
| JP6041731B2 (ja) | 2013-03-27 | 2016-12-14 | 新光電気工業株式会社 | インターポーザ、及び電子部品パッケージ |
| US9859179B2 (en) * | 2013-09-27 | 2018-01-02 | Kyocera Corporation | Lid body, package, and electronic apparatus |
| US10453786B2 (en) | 2016-01-19 | 2019-10-22 | General Electric Company | Power electronics package and method of manufacturing thereof |
| KR102367619B1 (ko) * | 2017-02-09 | 2022-02-28 | 제네럴 일렉트릭 컴퍼니 | 전력 전자 패키지 및 그 제조 방법 |
| JP2022102015A (ja) * | 2020-12-25 | 2022-07-07 | 株式会社大真空 | パッケージ、リッド及びパッケージの製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH105990A (ja) * | 1996-06-17 | 1998-01-13 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
| US5945735A (en) * | 1997-01-31 | 1999-08-31 | International Business Machines Corporation | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity |
| JP2001044239A (ja) * | 1999-07-29 | 2001-02-16 | Matsushita Electric Ind Co Ltd | 電子部品の混載実装方法及びその混載実装工程に用いる部材 |
| JP3905041B2 (ja) * | 2003-01-07 | 2007-04-18 | 株式会社日立製作所 | 電子デバイスおよびその製造方法 |
| JP4513513B2 (ja) * | 2004-11-09 | 2010-07-28 | 株式会社村田製作所 | 電子部品の製造方法 |
| US7745897B2 (en) * | 2005-05-27 | 2010-06-29 | Aptina Imaging Corporation | Methods for packaging an image sensor and a packaged image sensor |
| US7569926B2 (en) * | 2005-08-26 | 2009-08-04 | Innovative Micro Technology | Wafer level hermetic bond using metal alloy with raised feature |
-
2008
- 2008-04-17 JP JP2008107582A patent/JP5248179B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205282469U (zh) | 电子器件和半导体封装体 | |
| JP2009513026A5 (OSRAM) | ||
| JP2009158593A5 (OSRAM) | ||
| JP2009260049A5 (OSRAM) | ||
| US9013034B2 (en) | Semiconductor package | |
| JP2013243339A5 (OSRAM) | ||
| JP2011023574A5 (OSRAM) | ||
| JP2010192696A5 (OSRAM) | ||
| JP2009117767A5 (OSRAM) | ||
| JP2011528176A5 (OSRAM) | ||
| JP2006516361A5 (OSRAM) | ||
| CN104851867A (zh) | 应用在功率半导体元器件中的铝合金引线框架 | |
| JP2010087221A5 (OSRAM) | ||
| JP2006339559A5 (OSRAM) | ||
| TW200910566A (en) | Semiconductor device, lead frame, and manufacturing method for the lead frame | |
| JP2012084681A5 (OSRAM) | ||
| JP5248179B2 (ja) | 電子装置の製造方法 | |
| TW201528389A (zh) | 半導體封裝件及其製法 | |
| JP2004318074A5 (OSRAM) | ||
| JP2009077341A5 (OSRAM) | ||
| JP2008258353A5 (OSRAM) | ||
| US8242594B2 (en) | Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure | |
| JPWO2022107719A5 (OSRAM) | ||
| JP2014150235A (ja) | 半導体装置および半導体装置の製造方法 | |
| JP2011056555A5 (ja) | 接続材料、接続材料の製造方法、半導体装置、半導体装置の製造方法 |