JP2009252894A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2009252894A
JP2009252894A JP2008097295A JP2008097295A JP2009252894A JP 2009252894 A JP2009252894 A JP 2009252894A JP 2008097295 A JP2008097295 A JP 2008097295A JP 2008097295 A JP2008097295 A JP 2008097295A JP 2009252894 A JP2009252894 A JP 2009252894A
Authority
JP
Japan
Prior art keywords
recess
semiconductor device
substrate
mounting substrate
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008097295A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009252894A5 (https=
Inventor
Yuichi Yoshida
裕一 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to JP2008097295A priority Critical patent/JP2009252894A/ja
Priority to US12/382,613 priority patent/US20090250809A1/en
Publication of JP2009252894A publication Critical patent/JP2009252894A/ja
Publication of JP2009252894A5 publication Critical patent/JP2009252894A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008097295A 2008-04-03 2008-04-03 半導体装置 Pending JP2009252894A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008097295A JP2009252894A (ja) 2008-04-03 2008-04-03 半導体装置
US12/382,613 US20090250809A1 (en) 2008-04-03 2009-03-19 Semiconductor package having thermal stress canceller member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008097295A JP2009252894A (ja) 2008-04-03 2008-04-03 半導体装置

Publications (2)

Publication Number Publication Date
JP2009252894A true JP2009252894A (ja) 2009-10-29
JP2009252894A5 JP2009252894A5 (https=) 2010-05-13

Family

ID=41132500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008097295A Pending JP2009252894A (ja) 2008-04-03 2008-04-03 半導体装置

Country Status (2)

Country Link
US (1) US20090250809A1 (https=)
JP (1) JP2009252894A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015053463A (ja) * 2013-09-05 2015-03-19 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷回路基板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8633597B2 (en) * 2010-03-01 2014-01-21 Qualcomm Incorporated Thermal vias in an integrated circuit package with an embedded die
US8518746B2 (en) * 2010-09-02 2013-08-27 Stats Chippac, Ltd. Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
CN107393836B (zh) * 2017-06-19 2020-04-10 矽力杰半导体技术(杭州)有限公司 芯片封装方法及封装结构
JP7210191B2 (ja) * 2018-08-30 2023-01-23 京セラ株式会社 電子素子実装用基板、電子装置、および電子モジュール
RU201912U1 (ru) * 2020-09-25 2021-01-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Петрозаводский государственный университет" Многокристальная микросхема с верхним радиатором

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015053463A (ja) * 2013-09-05 2015-03-19 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷回路基板

Also Published As

Publication number Publication date
US20090250809A1 (en) 2009-10-08

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