JP2009239014A5 - - Google Patents
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- Publication number
- JP2009239014A5 JP2009239014A5 JP2008083046A JP2008083046A JP2009239014A5 JP 2009239014 A5 JP2009239014 A5 JP 2009239014A5 JP 2008083046 A JP2008083046 A JP 2008083046A JP 2008083046 A JP2008083046 A JP 2008083046A JP 2009239014 A5 JP2009239014 A5 JP 2009239014A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- facing
- processing apparatus
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083046A JP5348919B2 (ja) | 2008-03-27 | 2008-03-27 | 電極構造及び基板処理装置 |
US12/407,109 US20090242133A1 (en) | 2008-03-27 | 2009-03-19 | Electrode structure and substrate processing apparatus |
CN2009101294603A CN101546700B (zh) | 2008-03-27 | 2009-03-20 | 电极构造和基板处理装置 |
TW098109962A TWI475610B (zh) | 2008-03-27 | 2009-03-26 | Electrode construction and substrate processing device |
KR1020110109965A KR20110131157A (ko) | 2008-03-27 | 2011-10-26 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083046A JP5348919B2 (ja) | 2008-03-27 | 2008-03-27 | 電極構造及び基板処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009239014A JP2009239014A (ja) | 2009-10-15 |
JP2009239014A5 true JP2009239014A5 (ko) | 2011-05-06 |
JP5348919B2 JP5348919B2 (ja) | 2013-11-20 |
Family
ID=41115344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008083046A Active JP5348919B2 (ja) | 2008-03-27 | 2008-03-27 | 電極構造及び基板処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090242133A1 (ko) |
JP (1) | JP5348919B2 (ko) |
KR (1) | KR20110131157A (ko) |
CN (1) | CN101546700B (ko) |
TW (1) | TWI475610B (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5102706B2 (ja) * | 2008-06-23 | 2012-12-19 | 東京エレクトロン株式会社 | バッフル板及び基板処理装置 |
CN101740298B (zh) | 2008-11-07 | 2012-07-25 | 东京毅力科创株式会社 | 等离子体处理装置及其构成部件 |
US20110206833A1 (en) * | 2010-02-22 | 2011-08-25 | Lam Research Corporation | Extension electrode of plasma bevel etching apparatus and method of manufacture thereof |
US9543123B2 (en) | 2011-03-31 | 2017-01-10 | Tokyo Electronics Limited | Plasma processing apparatus and plasma generation antenna |
JP2015053384A (ja) * | 2013-09-06 | 2015-03-19 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
JP6339866B2 (ja) * | 2014-06-05 | 2018-06-06 | 東京エレクトロン株式会社 | プラズマ処理装置およびクリーニング方法 |
US20160289827A1 (en) * | 2015-03-31 | 2016-10-06 | Lam Research Corporation | Plasma processing systems and structures having sloped confinement rings |
KR101938306B1 (ko) * | 2016-04-18 | 2019-01-14 | 최상준 | 건식 에칭장치의 제어방법 |
US10242845B2 (en) * | 2017-01-17 | 2019-03-26 | Lam Research Corporation | Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber |
KR102568084B1 (ko) * | 2020-06-02 | 2023-08-21 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
TW202232566A (zh) | 2020-10-22 | 2022-08-16 | 日商東京威力科創股份有限公司 | 電漿處理裝置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5472565A (en) * | 1993-11-17 | 1995-12-05 | Lam Research Corporation | Topology induced plasma enhancement for etched uniformity improvement |
TW299559B (ko) * | 1994-04-20 | 1997-03-01 | Tokyo Electron Co Ltd | |
JP3814176B2 (ja) * | 2001-10-02 | 2006-08-23 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
JP4672456B2 (ja) * | 2004-06-21 | 2011-04-20 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US7740737B2 (en) * | 2004-06-21 | 2010-06-22 | Tokyo Electron Limited | Plasma processing apparatus and method |
US7988816B2 (en) * | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
JP4704088B2 (ja) * | 2005-03-31 | 2011-06-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US7993489B2 (en) * | 2005-03-31 | 2011-08-09 | Tokyo Electron Limited | Capacitive coupling plasma processing apparatus and method for using the same |
US8789493B2 (en) * | 2006-02-13 | 2014-07-29 | Lam Research Corporation | Sealed elastomer bonded Si electrodes and the like for reduced particle contamination in dielectric etch |
US7829469B2 (en) * | 2006-12-11 | 2010-11-09 | Tokyo Electron Limited | Method and system for uniformity control in ballistic electron beam enhanced plasma processing system |
JP5231038B2 (ja) * | 2008-02-18 | 2013-07-10 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法、ならびに記憶媒体 |
JP2009239012A (ja) * | 2008-03-27 | 2009-10-15 | Tokyo Electron Ltd | プラズマ処理装置及びプラズマエッチング方法 |
-
2008
- 2008-03-27 JP JP2008083046A patent/JP5348919B2/ja active Active
-
2009
- 2009-03-19 US US12/407,109 patent/US20090242133A1/en not_active Abandoned
- 2009-03-20 CN CN2009101294603A patent/CN101546700B/zh active Active
- 2009-03-26 TW TW098109962A patent/TWI475610B/zh active
-
2011
- 2011-10-26 KR KR1020110109965A patent/KR20110131157A/ko not_active Application Discontinuation
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