JP2009222415A5 - - Google Patents

Download PDF

Info

Publication number
JP2009222415A5
JP2009222415A5 JP2008064359A JP2008064359A JP2009222415A5 JP 2009222415 A5 JP2009222415 A5 JP 2009222415A5 JP 2008064359 A JP2008064359 A JP 2008064359A JP 2008064359 A JP2008064359 A JP 2008064359A JP 2009222415 A5 JP2009222415 A5 JP 2009222415A5
Authority
JP
Japan
Prior art keywords
dimensional structure
elastic body
substrate member
elements
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008064359A
Other languages
English (en)
Japanese (ja)
Other versions
JP4508253B2 (ja
JP2009222415A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008064359A priority Critical patent/JP4508253B2/ja
Priority claimed from JP2008064359A external-priority patent/JP4508253B2/ja
Priority to US12/920,147 priority patent/US8482086B2/en
Priority to CN2009801072470A priority patent/CN101960275A/zh
Priority to PCT/JP2009/001126 priority patent/WO2009113315A1/ja
Publication of JP2009222415A publication Critical patent/JP2009222415A/ja
Publication of JP2009222415A5 publication Critical patent/JP2009222415A5/ja
Application granted granted Critical
Publication of JP4508253B2 publication Critical patent/JP4508253B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008064359A 2008-03-13 2008-03-13 ３次元構造体およびその製造方法 Expired - Fee Related JP4508253B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008064359A JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法
US12/920,147 US8482086B2 (en) 2008-03-13 2009-03-13 Three-dimensional structure and its manufacturing method
CN2009801072470A CN101960275A (zh) 2008-03-13 2009-03-13 三维结构体及其制造方法
PCT/JP2009/001126 WO2009113315A1 (ja) 2008-03-13 2009-03-13 ３次元構造体およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008064359A JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法

Publications (3)

Publication Number Publication Date
JP2009222415A JP2009222415A (ja) 2009-10-01
JP2009222415A5 true JP2009222415A5 (cg-RX-API-DMAC10.html) 2010-01-14
JP4508253B2 JP4508253B2 (ja) 2010-07-21

Family

ID=41064988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008064359A Expired - Fee Related JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法

Country Status (4)

Country Link
US (1) US8482086B2 (cg-RX-API-DMAC10.html)
JP (1) JP4508253B2 (cg-RX-API-DMAC10.html)
CN (1) CN101960275A (cg-RX-API-DMAC10.html)
WO (1) WO2009113315A1 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5198608B2 (ja) * 2010-03-18 2013-05-15 韓国標準科学研究院 半導体ストレインゲージを用いたフレキシブルな力または圧力センサアレイ、そのフレキシブルな力または圧力センサアレイの製造方法、及びそのフレキシブルな力または圧力センサアレイを用いた力または圧力測定方法
JP2013090498A (ja) * 2011-10-20 2013-05-13 Sumitomo Precision Prod Co Ltd アクチュエータ及びその製造方法
CN104321613B (zh) * 2012-05-24 2017-03-29 株式会社村田制作所 传感器装置以及电子设备
DE202013101814U1 (de) * 2013-04-26 2014-07-29 Zumtobel Lighting Gmbh LED-Modul mit Berührungsschutzelement
US10628103B2 (en) 2013-06-07 2020-04-21 Semiconductor Energy Laboratory Co., Ltd. Information processor and program
WO2018094454A1 (en) * 2016-11-24 2018-05-31 The University Of Queensland Force sensing device
US10512164B2 (en) * 2017-10-02 2019-12-17 Encite Llc Micro devices formed by flex circuit substrates

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814392A (en) 1987-11-25 1989-03-21 General Electric Company Silicone-polyarylene ether block copolymers, and method for making
US5101669A (en) 1988-07-14 1992-04-07 University Of Hawaii Multidimensional force sensor
JPH02641Y2 (cg-RX-API-DMAC10.html) * 1988-07-26 1990-01-09
JP2804196B2 (ja) 1991-10-18 1998-09-24 株式会社日立製作所 マイクロセンサ及びそれを用いた制御システム
US6316796B1 (en) * 1995-05-24 2001-11-13 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
JP2000065653A (ja) * 1998-08-26 2000-03-03 Asmo Co Ltd 固定構造、感圧センサ固定方法、及び圧力検出装置
JP2002118201A (ja) * 2000-10-05 2002-04-19 Hitachi Ltd 半導体装置およびその製造方法
JP3704558B2 (ja) 2002-01-18 2005-10-12 国立大学法人 東京大学 ３次元構造体の組立方法
WO2005001422A2 (en) 2003-06-06 2005-01-06 The Board Of Trustees Of The University Of Illinois Sensor chip and apparatus for tactile and/or flow
JP2005150220A (ja) * 2003-11-12 2005-06-09 Seiko Epson Corp 半導体装置、半導体ウエハおよびその製造方法
US20050172717A1 (en) 2004-02-06 2005-08-11 General Electric Company Micromechanical device with thinned cantilever structure and related methods
US7032454B2 (en) 2004-03-05 2006-04-25 Agilent Technologies, Inc. Piezoelectric cantilever pressure sensor array
JP4876240B2 (ja) * 2005-01-28 2012-02-15 国立大学法人 東京大学 触覚センサ及びその製造方法
JP2006275979A (ja) 2005-03-30 2006-10-12 National Institute Of Information & Communication Technology センサ素子、センサ装置、対象物移動制御装置、対象物判別装置
JP4921185B2 (ja) * 2006-01-20 2012-04-25 国立大学法人 東京大学 ３次元構造体の製造方法
US7825567B2 (en) * 2006-01-20 2010-11-02 Panasonic Corporation Three-dimensional structure and its manufacturing method
JP2008008854A (ja) 2006-06-30 2008-01-17 Osaka Univ 触覚センサ、触覚センサの製造方法および触覚センサユニット
JP2008026178A (ja) * 2006-07-21 2008-02-07 Advanced Telecommunication Research Institute International 触覚センサ装置
JP2008044219A (ja) * 2006-08-15 2008-02-28 Fuji Xerox Co Ltd 基板の製造方法と基板、及び液滴吐出ヘッドの製造方法と液滴吐出ヘッド、並びに液滴吐出装置
JP2008049438A (ja) 2006-08-24 2008-03-06 Osaka Univ 半導体装置の製造方法、半導体装置、及び感圧センサ

Similar Documents

Publication Publication Date Title
JP2016046418A5 (cg-RX-API-DMAC10.html)
MX354168B (es) Método para la manufactura de micro características de producto impreso y disposición para la producción continua de tal producto.
JP2011507792A5 (cg-RX-API-DMAC10.html)
JP2015518772A5 (cg-RX-API-DMAC10.html)
WO2012020332A3 (en) Injection molded microneedle array and method for forming the microneedle array
EP2563101A4 (en) FLEXIBLE PCB AND MANUFACTURING METHOD THEREFOR
EP3281771A3 (en) Solid freedom frabrication of shelled objects
WO2015088708A3 (en) Flexible micromachined transducer device and method for fabricating same
WO2014152008A8 (en) Individual cavity flow control methods and systems for co-injection molding
JP2007305810A5 (cg-RX-API-DMAC10.html)
WO2012106512A3 (en) Nozzle and method of making same
WO2015054340A3 (en) Apparatus and method for forming three-dimensional objects using a curved build platform or curved solidification substrate
WO2016137555A3 (en) Polymer microwedges and methods of manufacturing same
JP2016063046A5 (cg-RX-API-DMAC10.html)
WO2009090157A3 (de) Verfahren zur herstellung von strangprofilen
IL279380B2 (en) A process for producing an electronic component containing a monolayer formed by a self-assembly process
WO2011117634A3 (en) Confectionery product containing active and/or reactive components and methods of production thereof
PT3875248T (pt) Método para produzir uma estrutura tridimensional numa superfície de um substrato plano
WO2012086986A3 (ko) 미세 패턴을 가지는 세라믹 템플릿의 제조 방법 및 이 방법에 의해 제조된 세라믹 템플릿
WO2009131636A3 (en) Manufacture of field activated components by stereolithography
WO2015161202A3 (en) Flexible thermoelectric modules and methods of fabrication
JP2013092758A5 (cg-RX-API-DMAC10.html)
WO2018052287A8 (en) Method for additive manufacturing of a 3d structure
WO2012044004A3 (ko) 3차원 패턴 형성용 성형 몰드 및 이를 이용한 가전제품 외장재 제조 방법
WO2010023261A3 (de) Oberflächenbeschichtungssystem mit dekorativen partikeln, wie perlmutt oder bernstein, sowie verfahren zu seiner herstellung