JP2009206264A - 搬送ロボット - Google Patents
搬送ロボット Download PDFInfo
- Publication number
- JP2009206264A JP2009206264A JP2008046337A JP2008046337A JP2009206264A JP 2009206264 A JP2009206264 A JP 2009206264A JP 2008046337 A JP2008046337 A JP 2008046337A JP 2008046337 A JP2008046337 A JP 2008046337A JP 2009206264 A JP2009206264 A JP 2009206264A
- Authority
- JP
- Japan
- Prior art keywords
- hand
- wafer
- arm
- grip
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 93
- 210000000078 claw Anatomy 0.000 description 22
- 230000007246 mechanism Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20329—Joint between elements
Abstract
【解決手段】搬送ロボット10は、本体12、第1のアーム18、第2のアーム16を備える。第1のアーム18は、ウェハカセットと本体12の上方位置との間で往復移動可能に構成される。第1のアーム18は、ウェハを把持するように構成された複数の把持部を有する第1のハンド182を備える。第2のアーム16は、本体12の上方位置とウェハステージとの間で往復移動可能に構成される。第2のアーム16は、第1のハンド182とは異なる角度からウェハを把持するように構成された複数の把持部を有する第2のハンド162を備える。第1のハンド182における把持部と第2のハンド162における把持部とは、互いに同じ高さに配置されるように構成される。
【選択図】図1
Description
16−第2の把持部
18−第1の把持部
162−第2のハンド
165A、165B−把持片
182−第1のハンド
185A〜185C−把持爪
Claims (3)
- 複数のワーク収納用スロットを備えたワークカセットと、プロセス装置の前段のワークステージとの間におけるワークの搬送を行うように構成された搬送ロボットであって、
本体と、
前記本体に移動自在に支持されており、前記ワークカセットと前記本体の上方位置との間で往復移動可能に構成された第1のアームと、
前記本体に移動自在に支持されており、前記本体の上方位置と前記ワークステージとの間で往復移動可能に構成された第2のアームと、
を備え、
前記第1のアームは、ワークを把持するように構成された複数の把持部を有する第1のハンドを備え、
前記第2のアームは、第1のハンドとは異なる角度からワークを把持するように構成された複数の把持部を有するとともに、前記第1のハンドよりも上方または下方に配置された第2のハンドを備え、かつ
前記第1のハンドにおける把持部と前記第2のハンドにおける把持部とが互いに同じ高さに配置されるように構成された
搬送ロボット。 - 前記第1のハンドの複数の把持部における前記ワークステージ側からワークを把持する把持部は、前記第1のハンドのワーク載置面よりも前記第2のハンドとは反対方向に退避可能に構成される請求項1に記載の搬送ロボット。
- 前記第1のハンドにおける把持部は、前記第1のハンドの移動方向に平行な方向の両側からワークを把持するように構成されており、
前記第2のハンドにおける把持部は、前記第2のハンドの移動方向に直角な方向の両側からワークを把持するように構成される請求項1または2に記載の搬送ロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008046337A JP4511605B2 (ja) | 2008-02-27 | 2008-02-27 | 搬送ロボット |
PCT/JP2009/052963 WO2009107550A1 (ja) | 2008-02-27 | 2009-02-20 | 搬送ロボット |
KR1020107020008A KR101182378B1 (ko) | 2008-02-27 | 2009-02-20 | 반송 로봇 |
US12/866,910 US8459928B2 (en) | 2008-02-27 | 2009-02-20 | Conveyor robot |
TW098105744A TW200946301A (en) | 2008-02-27 | 2009-02-24 | Transfer robot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008046337A JP4511605B2 (ja) | 2008-02-27 | 2008-02-27 | 搬送ロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009206264A true JP2009206264A (ja) | 2009-09-10 |
JP4511605B2 JP4511605B2 (ja) | 2010-07-28 |
Family
ID=41015947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008046337A Active JP4511605B2 (ja) | 2008-02-27 | 2008-02-27 | 搬送ロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US8459928B2 (ja) |
JP (1) | JP4511605B2 (ja) |
KR (1) | KR101182378B1 (ja) |
TW (1) | TW200946301A (ja) |
WO (1) | WO2009107550A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010029987A (ja) * | 2008-07-29 | 2010-02-12 | Yaskawa Electric Corp | ハンドリングシステムおよびハンドリング方法 |
JP2010206042A (ja) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP2012196768A (ja) * | 2012-07-25 | 2012-10-18 | Yaskawa Electric Corp | ハンドリングシステムおよびハンドリング方法 |
JP2014032992A (ja) * | 2012-08-01 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | 基板保持リング把持機構 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9079304B2 (en) * | 2012-10-31 | 2015-07-14 | Semes Co., Ltd. | Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit |
US9682848B2 (en) * | 2013-11-19 | 2017-06-20 | Core Laboratories Lp | System and method for a self-contained lifting device |
CN109585349A (zh) * | 2018-11-23 | 2019-04-05 | 中国电子科技集团公司第五十五研究所 | 一种晶圆传输平台、高压剥离机及其工作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0778859A (ja) * | 1993-09-06 | 1995-03-20 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JPH11163086A (ja) * | 1997-12-01 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002076094A (ja) * | 2000-08-31 | 2002-03-15 | Daikin Ind Ltd | 基板搬送装置 |
JP2006210378A (ja) * | 2005-01-25 | 2006-08-10 | Jel:Kk | 基板保持装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0152324B1 (ko) * | 1994-12-06 | 1998-12-01 | 양승택 | 웨이퍼 측면파지 이송 반도체 제조장치 |
US6183183B1 (en) * | 1997-01-16 | 2001-02-06 | Asm America, Inc. | Dual arm linear hand-off wafer transfer assembly |
US6155768A (en) * | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
JP2002158272A (ja) | 2000-11-17 | 2002-05-31 | Tatsumo Kk | ダブルアーム基板搬送装置 |
US6592324B2 (en) * | 2001-02-26 | 2003-07-15 | Irm, Llc | Gripper mechanism |
US20030035711A1 (en) * | 2001-07-14 | 2003-02-20 | Ulysses Gilchrist | Centering double side edge grip end effector with integrated mapping sensor |
JP2008108991A (ja) * | 2006-10-27 | 2008-05-08 | Daihen Corp | ワーク保持機構 |
-
2008
- 2008-02-27 JP JP2008046337A patent/JP4511605B2/ja active Active
-
2009
- 2009-02-20 KR KR1020107020008A patent/KR101182378B1/ko active IP Right Grant
- 2009-02-20 WO PCT/JP2009/052963 patent/WO2009107550A1/ja active Application Filing
- 2009-02-20 US US12/866,910 patent/US8459928B2/en active Active
- 2009-02-24 TW TW098105744A patent/TW200946301A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0778859A (ja) * | 1993-09-06 | 1995-03-20 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JPH11163086A (ja) * | 1997-12-01 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002076094A (ja) * | 2000-08-31 | 2002-03-15 | Daikin Ind Ltd | 基板搬送装置 |
JP2006210378A (ja) * | 2005-01-25 | 2006-08-10 | Jel:Kk | 基板保持装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010029987A (ja) * | 2008-07-29 | 2010-02-12 | Yaskawa Electric Corp | ハンドリングシステムおよびハンドリング方法 |
JP2010206042A (ja) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP2012196768A (ja) * | 2012-07-25 | 2012-10-18 | Yaskawa Electric Corp | ハンドリングシステムおよびハンドリング方法 |
JP2014032992A (ja) * | 2012-08-01 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | 基板保持リング把持機構 |
Also Published As
Publication number | Publication date |
---|---|
TW200946301A (en) | 2009-11-16 |
US20100322745A1 (en) | 2010-12-23 |
WO2009107550A1 (ja) | 2009-09-03 |
US8459928B2 (en) | 2013-06-11 |
KR20100105905A (ko) | 2010-09-30 |
JP4511605B2 (ja) | 2010-07-28 |
KR101182378B1 (ko) | 2012-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4511605B2 (ja) | 搬送ロボット | |
JP6630591B2 (ja) | 基板把持ハンド及び基板搬送装置 | |
KR102018742B1 (ko) | 로봇 및 그 제어 방법 | |
KR102448070B1 (ko) | 밴딩가공장치 | |
TWI666724B (zh) | 基板把持手及基板搬送裝置 | |
KR102423803B1 (ko) | 피공작물 파지 장치 | |
JP2009148845A (ja) | 小型生産設備 | |
JP2007021696A (ja) | 搬送装置 | |
WO2018139574A1 (ja) | 搬送システム及びその運転方法 | |
JP2002066861A (ja) | ハンド | |
JP5921902B2 (ja) | ロボット制御装置 | |
US11207775B2 (en) | Method of teaching robot | |
JP6492426B2 (ja) | ワーク保持確認装置、及びワーク保持確認方法 | |
JP2019111614A (ja) | ワーク反転装置、及びワーク反転方法 | |
JP6653763B2 (ja) | ロボットシステム、ロボットコントローラー、ロボットコントロール方法、ロボットプログラム | |
JP2009131910A (ja) | ワーク搬送ロボット及びワーク搬出入方法 | |
JP2007144552A (ja) | ロボットのクランプハンド | |
US20190193277A1 (en) | Robot and method of operating the same | |
JP2015089582A (ja) | ロボットシステム、制御装置、ロボット、駆動方法及びプログラム | |
JP2014116536A (ja) | エンドエフェクタ装置及び該エンドエフェクタ装置を用いた板状部材の位置決め方法 | |
JP7079861B2 (ja) | ロボットハンド及びそれを備えるロボット | |
JP2023129095A (ja) | ハンド | |
JP7409800B2 (ja) | ロボット制御装置、ロボット、及びロボット制御方法 | |
WO2019207687A1 (ja) | 水平多関節ロボット | |
JP3141891U (ja) | ワーク搬送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090703 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100406 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100506 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130514 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4511605 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130514 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160514 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |