JP2009206115A - Package for electronic component storage - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for electronic component storage which includes a recess for electronic component storage penetrating a ceramic insulating layer, the package for electronic component storage suppressing a fall of a ceramic particle from a recess inner surface. <P>SOLUTION: The package 9 for electronic component storage includes, on an upper surface of an insulating base 1 formed by laminating a plurality of ceramic insulating layers 1a, the recess 2 for electronic component storage formed penetrating center portions of some of the ceramic insulating layers 1a along the thickness, the inner surface of the recess 2 being coated with a ceramic coating layer 3. The ceramic coating layer 3 suppresses a fall of a ceramic particle from the inner surface of the recess 2. Consequently, even when an electronic component 4 whose function is apt to be disturbed by sticking of the ceramic particle like a high-precision optical semiconductor element, an MEMS element, etc., is stored, reliability as an electronic device is easily enhanced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a semiconductor element such as an optical semiconductor element, a micromachine (so-called MEMS element) provided with a fine electromechanical mechanism on a semiconductor substrate, and a recess for airtightly storing an electronic component such as a piezoelectric element. The present invention relates to an electronic component storage package on an upper surface.

  Conventionally, as an electronic component storage package for hermetically storing an electronic component such as a semiconductor element such as an optical semiconductor element or a piezoelectric element, a plurality of ceramic materials such as an aluminum oxide sintered body and a glass ceramic sintered body are used. 2. Description of the Related Art There is known a structure in which a concave portion (so-called cavity) for storing an electronic component is formed on the upper surface of an insulating substrate formed by laminating insulating layers.

  The electronic component is accommodated in the recess, and a lid made of a metal plate or the like is joined to the insulating base to close the recess, so that the electronic component is placed inside the container constituted by the recess of the insulating base and the lid. Hermetically sealed.

Such an electronic component storage package is formed by forming a plurality of square plate-like ceramic green sheets by forming a ceramic raw material powder such as aluminum oxide and calcium oxide into a sheet shape together with an organic solvent and a binder. After the green sheet is punched through the center and formed into a frame shape, multiple ceramic green sheets are stacked so that the frame-shaped ceramic green sheet is the upper layer. Manufactured by firing the body.
JP 2004-247334 A JP 2007-43050

  However, in such a conventional electronic component storage package, a punching process is performed on the ceramic green sheet serving as a ceramic insulating layer, so that a through hole serving as a recess is formed. A fracture surface is likely to occur on the exposed surface (the inner surface of the frame-shaped portion). Such a fractured surface has a rough surface, and so-called scalding is likely to occur, so that a part of the inner surface may be peeled off, and for example, fine ceramic particles having an outer dimension of about several tens of μm may fall off. was there. For example, as shown in FIG. 2, such a fractured surface is obtained when the ceramic green sheet is being punched in the direction A (the stage where the mold does not completely penetrate the ceramic green sheet 1 b). It occurs when 1b breaks in the thickness direction. FIG. 2 is a cross-sectional view schematically showing a state in which the ceramic green sheet 1b serving as the ceramic insulating layer is punched using a mold.

  If such ceramic particles fall off, the ceramic particles may adhere to the surface of the electronic component housed in the recess and cause a problem. In particular, in the case where the electronic component to be stored is an image sensor that has recently been highly integrated (higher number of pixels), imaging is prevented in many pixels even if fine ceramic particles are attached. Therefore, there is a high possibility of causing problems such as imaging defects.

  Moreover, as an electronic component, a micromachine such as an acceleration sensor element formed by forming a switching mechanism by mechanical operation on a semiconductor substrate and a movable fine structure such as a vibration part that moves according to a physical quantity such as acceleration. When an element (so-called MEMS element) is accommodated, the ceramic particles adhere to such a fine movable part, thereby preventing the mechanical movement of the movable part and preventing the normal function as an electronic component. The possibility increases.

  The present invention has been devised in view of such conventional problems, and an object of the present invention is to provide an electronic component storage package having a recess for storing an electronic component in which a ceramic insulating layer is penetrated in the thickness direction. An object of the present invention is to provide an electronic component storage package in which the falling of ceramic particles from the inner surface of a recess is effectively suppressed.

  The electronic component storage package of the present invention is an electronic component storage package formed on the upper surface of an insulating substrate formed by laminating a plurality of ceramic insulating layers, with a central portion of a portion of the ceramic insulating layer penetrating in the thickness direction. And the inner side surface of the recess is coated with a ceramic coating layer.

  Moreover, the electronic component storage package of the present invention is characterized in that, in the above configuration, the ceramic coating layer contains a glass component in a larger proportion than the ceramic insulating layer.

  The electronic component storage package according to the present invention is characterized in that, in the above configuration, the ceramic coating layer is mainly composed of the same ceramic material as the ceramic material of the ceramic insulating layer.

  According to the electronic component storage package of the present invention, an electronic component formed by penetrating the central portion of a part of the ceramic insulating layer in the thickness direction on the upper surface of an insulating base formed by laminating a plurality of ceramic insulating layers. Since it has a recess for storage and the inner surface of the recess is coated with a ceramic coating layer, even if there are ceramic particles that are about to fall off from the inner surface of the recess, the ceramic particles are covered with the ceramic coating layer. Since it is covered, it can be held so as not to fall off. Therefore, it is possible to provide an electronic component storage package in which the falling of ceramic particles from the inner surface of the recess is effectively suppressed.

  In the electronic component storage package according to the present invention, in the above configuration, when the ceramic coating layer contains a glass component in a larger proportion than the ceramic insulating layer, the ceramic coating layer is ceramic via the glass component. It is possible to bond more firmly to the insulating layer. Therefore, it is possible to more effectively coat the inner surface of the concave portion and suppress the ceramic particles from falling off. Therefore, in this case, it is possible to provide an electronic component storage package in which the ceramic particles are prevented from dropping off from the inner surface of the concave portion of the insulating base.

  In this case, since the ceramic coating layer itself is also bonded to the ceramic insulating layer through a larger glass component, it is possible to more effectively suppress peeling of the ceramic coating layer itself from the ceramic insulating layer. it can.

  In the electronic component storage package of the present invention, in the above configuration, when the ceramic coating layer is mainly composed of the same ceramic component as the ceramic component of the ceramic insulating layer, the same ceramic component is sintered during firing. By joining together, the ceramic insulation layer is more firmly joined. In addition, since it is easy to approximate the thermal expansion coefficient (linear expansion coefficient) of the ceramic coating layer to that of the ceramic insulating layer, the difference in thermal expansion coefficient between the ceramic coating layer and the ceramic insulating layer is different. It is also easy to effectively suppress the occurrence of a large thermal stress due to. Therefore, the bonding of such a ceramic coating layer to the ceramic insulating layer can be made stronger and more reliable. Therefore, in this case, it is possible to provide an electronic component storage package in which peeling of the ceramic coating layer itself from the ceramic insulating layer is more effectively suppressed.

  The electronic component storage package of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package according to the present invention. In FIG. 1, reference numeral 1 denotes an insulating substrate formed by laminating a plurality of ceramic insulating layers 1a, and 2 denotes a recess. On the upper surface of the insulating substrate 1 formed by laminating a plurality of ceramic insulating layers 1a, a central portion of a part of the ceramic insulating layers 1a is penetrated in the thickness direction so as to form a recess 2 for storing electronic components. The package 9 is basically configured. In addition, by mounting the electronic component 4 on the electronic component storage package 9, an electronic device (no symbol) used as a component of various electronic devices is manufactured.

  The insulating substrate 1 has, for example, a rectangular parallelepiped shape having a length of about 3 to 30 μm in length and width and a height of about 1 to 3 mm, such as a CCD (Charge Coupled Device) type or a CMOS (Complementary MOS) type imaging device. The upper surface has a recess 2 for accommodating an electronic component 4 such as a semiconductor element including an optical semiconductor element, a micromachine element (MEMS element) such as a switching element or an acceleration sensor element, or a piezoelectric element such as a surface acoustic wave element. ing. The insulating base 1 functions as a part of a container for storing the electronic component 4 in an airtight manner.

  For example, the recess 2 is formed in a shape corresponding to the electronic component 4 and slightly larger than the electronic component 4 in order to efficiently store the electronic component 4 (so as not to create a useless space as much as possible). In the example of this embodiment, the electronic component 4 to be accommodated is a square plate-like imaging element or a MEMS element, and the recess 2 is formed in a rectangular column shape slightly larger than that. In addition, the step-shaped part (no code | symbol) in the recessed part 2 is mentioned later.

  In the example of this embodiment, the bottom surface of the concave portion 2 is a mounting portion (no symbol) of the electronic component 4, and the electronic component 4 is attached to the mounting portion via an adhesive such as glass, brazing material, or resin. Bonded and fixed.

  Then, a lid (not shown) made of, for example, a metal plate such as an iron-nickel-cobalt alloy or a copper alloy is joined to the upper surface of the insulating base 1 so as to close the concave 2, thereby forming the concave 2 of the insulating base 1. The electronic component 4 is hermetically sealed inside a container (not shown) composed of a lid and a lid. An electronic device (no symbol) in which the electronic component 4 is hermetically sealed in the electronic component storage package 9 is an imaging device such as a digital camera or an image inspection device, a switching device of a communication device, an acceleration detector for a vehicle, etc. And an electronic device (not shown) such as various sensor devices such as an angular velocity detector.

  In the example of this embodiment, the wiring conductor 5 is formed from the inside to the outside of the recess 2. The wiring conductor 5 is electrically connected to the electronic component 4 that is hermetically sealed in the recess 2, and functions as a conductive path that electrically leads it to the outside of the recess 2. An electrode (not shown) of the electronic component 4 is electrically connected to a portion of the wiring conductor 5 located inside the recess 2 via a bonding wire 6 or the like, and a portion located outside the recess 2 is externally connected. The electronic component 4 is electrically connected to an external electrical circuit by being electrically connected to the electrical circuit (not shown) via solder or the like.

  Moreover, in the example of this embodiment, the stepped portion is provided on the inner surface of the recess 2 as described above. This step-shaped portion is for forming the wiring conductor 5 on the upper surface thereof, and is as high as the thickness of the electronic component 4. If the wiring conductor 5 is provided on the upper surface of such a stepped portion, the distance between the electrode on the upper surface of the electronic component 4 and the wiring conductor 5 is shortened and the height difference is also reduced. The connection between the interposed electrode and the wiring conductor 5 can be easily performed. Further, since the length of the bonding wire 6 can be suppressed, the connection resistance can be lowered and the connection reliability can be improved.

  The stepped portion is, for example, the size of the punched portion that becomes the recess 2 is made smaller for some ceramic green sheets than the other ceramic green sheets, and the ceramic green sheet with the smaller size of the punched portion is the lower layer side It can form by laminating | stacking so that it may be located in.

  The ceramic insulating layer 1a forming the insulating base 1 of the electronic component storage package 9 is composed of an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, glass, or the like. It consists of a ceramic sintered body such as a ceramic sintered body.

  Further, the concave portion 2 on the upper surface of the insulating base 1 is formed by penetrating the central portion of a part of the ceramic insulating layer 1a in the thickness direction.

  If the insulating substrate 1 formed by laminating a plurality of such ceramic insulating layers 1a is made of an aluminum oxide sintered body, for example, a raw material such as aluminum oxide, silicon oxide, boron oxide, magnesium oxide, calcium oxide or the like. A suitable organic binder and solvent are added to the powder to make a slurry, and this slurry is formed into a ceramic green sheet by adopting a doctor blade method or a calender roll method. It is manufactured by laminating sheets and firing the laminate at a temperature of about 1600 ° C.

  The concave portion 2 is formed by penetrating through a central portion of a part of the ceramic insulating layer 1a such as the uppermost ceramic insulating layer 1a or a plurality of ceramic insulating layers 1a continuous from the uppermost layer in the thickness direction. ing. That is, among the ceramic green sheets that become the ceramic insulating layer 1a, the one that becomes the uppermost layer when laminated or a plurality of continuous ones below the ceramic green sheet are punched in the thickness direction and processed into a frame shape. The concave portion 2 is formed by laminating a ceramic green sheet processed into a frame shape on a ceramic green sheet that has not been punched.

  The ceramic green sheet is punched using, for example, a punching die having a predetermined punching pattern. The die for punching includes, for example, an upper punch that is movable up and down, and a base plate for positioning a ceramic green sheet that is disposed below the upper punch. Then, the ceramic green sheet is positioned and set on the base plate, the upper punch is lowered, and the ceramic green sheet is punched through the thickness direction to perform punching (so-called punching).

  In the electronic component storage package 9, the inner surface of the recess 2 is covered with the ceramic coating layer 3 as shown in an enlarged cross-sectional view of the main part in FIG. 3. Since the inner surface of the recess 2 is covered with the ceramic coating layer 3 in this way, even if there are ceramic particles C that are about to fall off from the surface of the ceramic insulating layer 1a that is the inner surface of the recess 2, The ceramic particles C can be covered and held with the ceramic coating layer 3. Therefore, it is possible to provide the electronic component storage package 9 in which the ceramic particles C are prevented from dropping from the inner surface of the recess 2. FIG. 3 is an enlarged cross-sectional view of the main part showing the main part of the electronic component storage package 9 shown in FIG. In FIG. 3, the same parts as those in FIG.

  The ceramic coating layer 3 is mainly composed of ceramic powder made of a ceramic material that can be bonded to the ceramic material (ceramic component) of the ceramic insulating layer 1a containing the ceramic particles C, and the ceramic powder is bonded to the ceramic coating layer. A glass component, an auxiliary agent, or the like for reinforcing the bonding between the layer 3 and the ceramic insulating layer 1a is added. The joining of the ceramic component of the ceramic insulating layer 1a and the ceramic component of the ceramic coating layer 3 is due to sintering of both, and includes liquid phase sintering via the glass component described above.

  The ceramic coating layer 3 covers at least the surface roughness (maximum roughness: Rmax) of the inner surface of the recess 2 in order to cover the inner surface of the recess 2 while effectively suppressing the falling of the ceramic particles C. A thickness is preferred. For example, the ceramic insulating layer 1a contains an aluminum oxide sintered body having an aluminum oxide content of about 95 to 99% by mass, or a glass ceramic sintered body containing about 40 to 60% by volume of a glass component such as boron oxide or silicon oxide. In this case, since the maximum roughness of the side surface that is punched and exposed is about 10 to 15 μm, the thickness of the ceramic coating layer 3 may be set to about 15 μm or more. Moreover, since the ceramic coating layer 3 may become easy to peel from the inner surface of the recessed part 2 when it becomes too thick, it is preferable to set it as the range of about 15-50 micrometers. The particle size (average particle size) of the ceramic material forming the ceramic coating layer 3 may be about 1/5 to 1/10 of the thickness of the ceramic coating layer 3 described above.

  Ceramic materials for forming the ceramic coating layer 3 include ceramics such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, and a glass ceramic sintered body. Materials can be used. In order to form the ceramic coating layer 3 by co-firing with the ceramic insulating layer 1a (insulating base 1), it is preferable to have the same composition as the ceramic insulating layer 1a.

  As described above, the ceramic coating layer 3 is configured by adding a glass material, a sintering aid, or the like to these ceramic materials, and if necessary, a metal oxide for coloring may be mixed. Good.

  As the glass material to be added, for example, the ceramic insulating layer 1a and the ceramic coating layer 3 are made of an oxide-based material such as an aluminum oxide sintered body, a glass ceramic sintered body containing an oxide-based glass, or a mullite sintered body. In such a case, an oxide-based glass material such as silicon oxide, boron oxide, calcium oxide, or lithium oxide can be used.

  Further, if both the ceramic insulating layer 1a and the ceramic coating layer 3 are made of an aluminum nitride sintered body, a sintering aid such as calcium oxide, strontium oxide, barium oxide, yttrium oxide, or the like can be added. Further, if both the ceramic insulating layer 1a and the ceramic coating layer 3 are made of a silicon nitride sintered body, a sintering aid such as an oxide of a rare earth metal such as yttrium oxide can be mixed.

  As the colorant, a metal oxide such as chromium oxide or molybdenum oxide can be used. If the ceramic coating layer 3 is colored in dark green or dark brown with such a colorant, it is possible to suppress the reflection of extra light in the recess 2, so that the electronic component 4 is an imaging device. In such a case, the electronic component storage package 9 that can manufacture an electronic device with higher reliability can be obtained.

  The ceramic coating layer 3 is prepared, for example, by kneading such a ceramic material and a raw material powder such as a glass material together with an organic solvent and a binder to prepare a paste-like mixture, and this mixture is a portion (punched) that becomes the inner surface of the recess 2. It can be formed by applying to the inner surface of the processed ceramic green sheet. Alternatively, the viscosity of the paste-like mixture may be lowered by increasing the amount of the organic solvent added, etc., and sprayed onto the portion that will be the inner surface of the recess 2 for deposition. Further, the ceramic insulating layer 1a is formed by forming a mixture of such raw material powders into a sheet shape, and positioning and affixing the mixture to a portion serving as the inner side surface of the recess 2 to form the insulating substrate 1 (lamination of ceramic green sheets). Body) and simultaneous firing.

  For example, when the ceramic coating layer 3 is formed by application of a paste-like mixture prepared using a raw material powder obtained by mixing a ceramic material and a glass material, the application is performed by punching individual ceramic green sheets. (Before lamination), or may be applied collectively to a portion of the laminated body of ceramic green sheets which will be the inner surface of the recess 2.

  In the electronic component storage package 9, in the above configuration, when the ceramic coating layer 3 contains a glass component in a larger proportion than the ceramic insulating layer 1 a, the ceramic coating layer 3 contains more glass. It can be bonded to and coated on the ceramic insulating layer 1a via components. Therefore, in this case, it is possible to provide the electronic component storage package 9 in which the ceramic particles C are prevented from dropping off from the inner surface of the recess 2 of the insulating base 1 even more effectively.

  Further, in this case, the ceramic coating layer 3 itself is also bonded to the ceramic insulating layer 1a through more glass components, so that the ceramic coating layer 3 itself can be more effectively removed from the ceramic insulating layer 1a. It can also be suppressed.

  The glass component contained in the ceramic insulating layer 1a is, for example, a glass component such as silicon oxide or boron oxide added to the ceramic insulating layer 1a made of the above-described aluminum oxide sintered body, or a glass ceramic sintered body. Are glass components (silicon oxide, boron oxide, lithium oxide, etc.).

  For example, if the ceramic coating layer 3 and the ceramic insulating layer 1a are both aluminum oxide sintered bodies and the glass components contained are the same (silicon oxide, boron oxide, calcium oxide, etc.), the glass in the ceramic coating layer 3 The component may be about 1.1 to 2 times the volume of the glass component in the ceramic insulating layer 1a. When both the ceramic coating layer 3 and the ceramic insulating layer 1a are made of a glass ceramic sintered body (a sintered body of aluminum oxide and a glass component such as silicon oxide or boron oxide), that is, the glass component of the ceramic insulating layer 1a is relatively In many cases, the glass component in the ceramic coating layer 3 may be about 1.05 to 1.2 times in volume ratio with respect to the glass component in the ceramic insulating layer 1a.

  Moreover, the glass component contained in the ceramic coating layer 3 in a proportion higher than that of the ceramic insulating layer 1a is set to the same composition in both the ceramic coating layer 3 and the ceramic insulating layer 1a, and the bonding between the two is more performed. It is preferable to make it easy and strong.

  As a specific example, in the electronic component storage package 9 having the structure shown in FIG. 1, each ceramic insulating layer 1a is made of an aluminum oxide-based material having a thickness of about 0.25 mm and an aluminum oxide content of about 97% by mass. When it is made of a knot, the maximum roughness of the inner surface of the recess 2 is about 10 μm, and ceramic particles having a size of about 10 μm may fall off. In this case, when the inner surface of the recess 2 is covered with the ceramic coating layer 3 having a thickness of about 30 μm, a defect occurs in the electronic component 4 stored in the recess 2 in about 1200 electronic component storage packages. It was confirmed that the falling of the ceramic particles could be suppressed. The ceramic coating layer 3 at this time contains about 95% by mass of aluminum oxide (particles having an average particle diameter of about 3 μm) as a main component, and also contains silicon oxide, boron oxide and calcium oxide as glass components. there were. In addition, the electronic component 4 at this time is a square plate shape having an outer dimension of about 7 × 5 mm and a pixel size of 2.2 × 2.2 μm (3 million pixels) used for a mobile phone camera or the like. It was an element.

  Further, in the electronic component storage package 9 having the above-described configuration, when the ceramic coating layer 3 is mainly composed of the same ceramic component as the ceramic component of the ceramic insulating layer 1a, the same ceramic components are bonded to each other. Thereby, it joins more firmly with respect to the ceramic insulating layer 1a. Moreover, since it is easy to approximate the thermal expansion coefficient (linear expansion coefficient) of the ceramic coating layer 3 to the thermal expansion coefficient of the ceramic insulating layer 1a, the heat of both between the ceramic coating layer 3 and the ceramic insulating layer 1a is obtained. It is also easy to effectively suppress the occurrence of a large thermal stress due to the difference in expansion coefficient. Therefore, it is possible to more effectively suppress a decrease in the strength of bonding of the ceramic coating layer 3 to the ceramic insulating layer 1a due to such stress as thermal stress. Therefore, in this case, it is possible to provide the electronic component storage package 9 in which peeling of the ceramic coating layer 3 itself is more effectively suppressed.

  For example, when the ceramic insulating layer 1a is made of an aluminum oxide sintered body having an aluminum oxide content of about 95 to 99% by mass, the ceramic coating layer 3 is formed with aluminum oxide particles as the main component. do it. In this case, it is preferable that the content of the aluminum oxide particles is approximately the same in order to match the coefficient of thermal expansion between the ceramic insulating layer 1a and the ceramic coating layer 3. Further, as described above, in order to obtain an effect of strengthening the bonding of the ceramic coating layer 3 to the ceramic insulating layer 1a by increasing the glass component, the content ratio of the aluminum oxide particles on the ceramic coating layer 3 side is relatively set. It is preferable that the amount is small (the glass component is large). In such a case, the content of the aluminum oxide particles in the ceramic coating layer 3 is, for example, in the range of about 90 to 99% by mass, and the conditions such as the thickness of the ceramic insulating layer 1a and the ease of printing of the ceramic paste. It may be set appropriately according to the above.

  Moreover, the ceramic coating layer 3 makes the thickness in the part which becomes the torn surface of the ceramic insulating layer 1a (ceramic green sheet) penetrated among the inner surfaces of the recessed part 2 larger than the thickness in another part. May be.

  For example, as shown in a sectional view of FIG. 4A, the wiring board 9 is formed by punching a ceramic green sheet into a stepped portion in the recess 2, and a layer above and below the stepped portion. After the divided laminates 11 to 13 are separately manufactured, the punching process is performed on the predetermined portions P2 and P3 of the divided laminates 12 and 13 that are laminated on the upper side of the divided laminates 11 to 13, and the die is punched. In some cases, a paste-like mixture that becomes the ceramic coating layer 3 is applied to each of the inner surfaces of the recesses 2 and then laminated and fired. 4A is a cross-sectional view schematically showing an example of the manufacturing process of the electronic component storage package of the present invention, and FIG. 4B is an electronic diagram manufactured through the manufacturing process of FIG. FIG. 4 is an enlarged cross-sectional view of a main part showing an enlarged main part of a component storage package 9. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  In such a case, in each of the divided laminates 12 and 13, the lower part is likely to have a fractured surface at the time of punching (the upper part becomes a so-called shear surface, the roughness of the surface is small, and caressed. Is less likely to occur). On the other hand, as shown in FIG. 4B, if the ceramic coating layer 3 is thickened at the lower portion of the inner surface of the recess 2 that tends to be a fracture surface, the ceramic particles are more effectively produced at such a portion. (Not shown in FIG. 4) is covered and held by the ceramic coating layer 3, and the falling off from the ceramic insulating layer 1a can be effectively suppressed.

  In such a case, internal stress (such as residual stress during firing) that may occur in the ceramic coating layer 3 can be suppressed to a smaller value than when the ceramic coating layer 3 is made thick overall. it can. Therefore, the electronic component storage package 9 is capable of effectively suppressing the falling of the ceramic powder from the inner surface of the recess 2 while ensuring the strength of bonding of the ceramic coating layer 3 itself to the ceramic insulating layer 1a. be able to.

It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows typically the condition which has punched the ceramic green sheet using the metal mold | die. It is a principal part expanded sectional view which expands and shows the principal part of the electronic component storage package shown in FIG. (A) is sectional drawing which shows typically an example of the manufacturing process of the electronic component storage package of this invention, (b) is the principal part of the electronic component storage package manufactured through the manufacturing process of (a). It is a principal part expanded sectional view which expands and shows.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating base | substrate 1a ... Ceramic insulating layer 1b ... Ceramic green sheet 2 ... Recess 3 ... Ceramic coating layer 4 ... Electronic component 5 .... Wiring conductor 6 ... Bonding wire 9 ... Package for storing electronic components
11-13 ... Divided laminate C ... Ceramic powder P2, P3-Predetermined part to be punched

Claims (3)

On the upper surface of an insulating substrate formed by laminating a plurality of ceramic insulating layers, there is a recess for storing an electronic component formed by penetrating a central portion of a part of the ceramic insulating layer in the thickness direction. A package for storing electronic parts, wherein the side surface is coated with a ceramic coating layer. The electronic component storage package according to claim 1, wherein the ceramic coating layer contains a glass component in a larger proportion than the ceramic insulating layer. 2. The electronic component storing package according to claim 1, wherein the ceramic coating layer is mainly composed of the same ceramic material as the ceramic material of the ceramic insulating layer.

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