JP4467413B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic component storage container and an electronic apparatus for hermetically sealing and storing electronic components such as semiconductor elements and piezoelectric vibrators, and particularly to electronic component storage for sealing using glass as a sealing material. Related to the container.

  2. Description of the Related Art Conventionally, electronic component storage containers for storing electronic components such as semiconductor elements such as semiconductor integrated circuit elements, or piezoelectric vibrators such as quartz crystal vibrators and surface acoustic wave elements are, for example, aluminum oxide sintered bodies and the like. It is made of an electrically insulating material, and has a mounting portion for mounting an electronic component at a substantially central portion of the upper surface and a plurality of metallized wiring layers made of a refractory metal such as tungsten or molybdenum led from the periphery to the lower surface. It is comprised from the flat insulating base | substrate and the cover body which has a recessed part for accommodating an electronic component in the approximate center part of the surface facing it.

  When the electronic component is, for example, a piezoelectric vibrator, one end of the piezoelectric vibrator is bonded and fixed to the mounting portion of the insulating base via a conductive resin made of a conductive epoxy resin or the like, and each electrode of the piezoelectric vibrator is attached. After electrically connecting to the metallized wiring layer, a lid is bonded to the upper surface of the insulating base via a sealing material made of low-melting glass, and a piezoelectric vibrator is placed inside the container consisting of the insulating base and the lid. By storing it in an airtight manner, it becomes an electronic device as a final product.

Examples of the sealing material for bonding the lid to the insulating base include 56 to 66% by weight of lead oxide, 4 to 14% by weight of boron oxide, 1 to 6% by weight of silicon oxide, 0.5 to 3% by weight of zinc oxide, and oxidation. Lead glass in which 10 to 20% by weight of a cordierite compound is added as a filler to a glass component containing 0.5 to 5% by weight of bismuth is used.
JP-A-5-121582

  However, with the recent popularization of portable electronic devices, there is an increasing demand for smaller and thinner electronic component storage containers. On the other hand, as the mounting of electronic components on automobiles increases, high airtight reliability of electronic component storage containers is required. In a glass-sealed electronic component storage container, among the high demands regarding downsizing, thinning, and airtight reliability, an insulating substrate having a recess for mounting electronic components on the upper surface, and an upper surface of the insulating substrate are joined. An electronic component storage container has been devised that includes a flat lid for storing an electronic component in a space between the insulating base and a glass sealing material.

  However, in this electronic component storage container, it is possible to reduce the thickness while maintaining the bending strength of the electronic component storage container by reducing the thickness of the lid. There is a tendency that the alignment of the insulating base and the lid at the time becomes difficult. On the other hand, along with the reduction in the sealing width due to the downsizing of the electronic component storage container, high alignment accuracy between the insulating base and the lid is required at the time of sealing, and a recess for mounting the electronic component on the upper surface is required. In an electronic component storage container comprising: an insulating base having a flat plate-like lid that is bonded to the upper surface of the insulating base and airtightly stores the electronic component in a space between the insulating base and the glass sealing material. As miniaturization and thinning progress, alignment becomes more difficult, which leads to a problem that reliability of hermetic sealing is lowered.

  Further, in this conventional electronic component storage container, since the melting temperature of the sealing material for joining the lid to the insulating base is as high as about 400 ° C., the insulating base and the lid are joined via the sealing material. When an electronic component is hermetically accommodated in an electronic component storage container composed of an insulating base and a lid, heat that melts the sealing material acts on the electronic component accommodated therein, leading to characteristic deterioration of the electronic component. Had the problem of making it.

  Furthermore, the melting temperature of the sealing material for bonding the lid to the insulating base is as high as about 400 ° C., and the insulating base and the lid are bonded via the sealing material, so that the electronic component housing comprising the insulating base and the lid is accommodated. When the electronic component is housed in an airtight container, the conductive resin that adheres and fixes the electronic component is deteriorated by heat that melts the sealing material. There is a limitation, and it is impossible to use an epoxy or silicone conductive resin that is strong in impact, and there is a problem in impact resistance reliability such as a drop test.

  In addition, when an organic resin is used as a sealing material, the organic resin has a low curing temperature but is inferior in moisture resistance, so that moisture contained in the atmosphere is used for storing electronic components consisting of an insulating substrate and a lid through the sealing material. As a result, moisture may adhere to the surface of the electronic component housed inside the electronic component storage container, causing oxidative corrosion of the electrode on the surface of the electronic component and causing variations in the characteristics of the electronic component. Was.

  In addition, in electronic component storage containers that use glass for sealing, the thickness and width of the glass sealing material required for hermetic sealing are other seals such as low-temperature metal brazing material and resin sealing material. There is a tendency to become thicker or wider than the material, which has been an obstacle to miniaturization and thinning of electronic component storage containers that are sealed using glass.

  The present invention has been devised in view of the above problems, and its purpose is to hermetically seal the electronic component without causing deterioration of its characteristics, and to operate the electronic component normally over a long period of time. An object of the present invention is to provide a small and thin container for storing electronic components and an electronic device.

An electronic device according to the present invention includes an insulating base having a recess for mounting an electronic component on an upper surface, and a lid bonded to the upper surface of the insulating base via a sealing material so as to close the opening of the recess. A container for storing electronic parts, wherein a convex portion is formed on a lower surface of the lid body, and a gap is provided over the entire circumference between a side surface of the convex portion and a side surface of the concave portion , The side surface of the convex portion is not in contact with the corner formed by the side surface of the concave portion and the upper surface of the insulating base, and the shapes of the lid, the convex portion, the insulating base, and the concave portion are viewed in plan view. The outer dimension of the lid is 0.05 to 0.20 mm smaller than the outer dimension of the insulating base, and the outer dimension of the convex part is 0.05 to 0 smaller than the inner dimension of the concave part. .20 mm smaller, and the thickness of the central portion of the lid body is 0.15 to 0.30. m, characterized by comprising housing the electronic component in the recess of the electronic component storing container was 0.05~0.10mm the thickness of the convex portion.

In the electronic device according to the present invention, it is preferable that a width of the gap is 0.02 to 0.3 mm.

In the electronic device according to the present invention, preferably, the sealing material is made of a glass sealing material obtained by adding a ceramic filler to amorphous glass.

In the electronic device of the present invention, preferably, the glass sealing material is added to 10 to 60 parts by mass of ceramic filler powder having a maximum particle size of 20 to 30 μm and an average particle size of 3 to 4 μm to 100 parts by mass of amorphous glass. It is characterized by comprising.

According to the electronic component storage container of the present invention, the convex portion is formed on the lower surface of the lid, and the gap is provided around the entire circumference between the side surface of the convex portion and the side surface of the concave portion. When the lid is bonded via the sealing material and the electronic component storage container is hermetically sealed, the surface tension of the melted sealing material works in a direction to align the lid with the central portion of the insulating base, It is possible to provide a small and thin container for storing electronic components that can seal the insulating base and the lid with extremely high positional accuracy.

  Further, when the insulating base and the lid are joined, the sealing material easily enters the gap, and not only the bottom surface of the lid and the top surface of the insulating base are joined via the sealing material, but also the convexity of the lid. The side surface of the portion and the side surface of the concave portion of the insulating substrate can be bonded via the sealing material, and the airtightness becomes very high.

In the electronic component storage container in the present invention, preferably, the width of the gap is 0.02 to 0.3 mm, so that when the insulating base and the lid are joined, the sealing material easily enters the gap, The surface tension of the sealing material that has entered the gap makes it easy for the lid to move with respect to the recess, and the bonding area between the lid and the insulating substrate can be made very uniform over the entire circumference. It is possible to satisfactorily prevent the occurrence of failure.

In the electronic component storage container according to the present invention, the shape of the lid , the convex portion, the insulating base, and the concave portion are substantially similar in plan view, and the outer dimension of the lid is 0.05 to more than the outer dimension of the insulating base. 0.20 mm smaller, the outer dimension of the convex part is 0.05 to 0.20 mm smaller than the inner dimension of the concave part, and the thickness of the central part of the lid is 0.15 to 0.30 mm, and the thickness of the convex part is Since it was 0.05 to 0.10 mm, the surface tension due to the fillet of the sealing material formed between the side surface of the lid and the upper surface of the insulating base, the surface tension due to the sealing material entering the gap, can be a good balance between the own weight of the lid, when bonding an insulating base and the lid can be made good position置精degree movement against the recess of the lid.

In the electronic component storage container according to the present invention, preferably, since the sealing material is made of a glass sealing material obtained by adding a ceramic filler to amorphous glass, the sealing material is extremely excellent in moisture resistance. Even if moisture contained in the atmosphere attempts to enter the interior of the electronic component storage container through the sealing material, the penetration of the moisture is effectively prevented, and as a result, the electrons stored in the electronic component storage container The electrode of the component is hardly oxidized and corroded, and the electronic component can be operated normally.

In the electronic component storage container according to the present invention, preferably, the glass sealing material is 10 to 60 ceramic filler powder having a maximum particle size of 20 to 30 μm and an average particle size of 3 to 4 μm in 100 parts by mass of amorphous glass. Since the insulating part and the lid are joined via the glass sealing material and the electronic component storage container is hermetically sealed, when the amount of the glass sealing material is small, Does not contain coarse filler particles with a particle size exceeding 30 μm, which makes it possible to reduce the thickness of the glass sealing material and narrow the sealing width. And it can be set as a thin container for electronic component accommodation.

The electronic device of the present invention is a small and thin electronic device capable of operating the electronic component normally over a long period of time because the electronic component is stored in the recess of the electronic component storage container according to the present invention . .

Next, the electronic component storage container according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 is a sectional view showing an example of an embodiment of an electronic component storing container according to the present invention. In this figure, an example is shown in which the electronic component is a piezoelectric vibrator such as a quartz crystal vibrator, and the electronic component storage container is a piezoelectric vibrator storage container.

  In this figure, 1 is an insulating substrate, 2 is a lid, 3 is a sealing material, 4 is a piezoelectric vibrator as an electronic component, 5 is a conductive resin, and 6 is a metallized wiring layer. The body 2 constitutes an electronic component housing container for housing the piezoelectric vibrator 4.

FIG. 2 shows a state before the lid of the electronic component storage container according to the present invention and the insulating base are joined with a sealing material. In this figure, the lid is only placed on the upper surface of the insulating base via a sealing material. In this figure, 11 is an insulating substrate, 12 is a lid, 13 is a sealing material, 14 is a piezoelectric vibrator as an electronic component, 15 is a conductive resin, and 16 is a metallized wiring layer.

  The insulating base 1 is a substantially rectangular parallelepiped having a concave portion on the upper surface, and a mounting portion for mounting the piezoelectric vibrator 4 is provided on the bottom surface of the concave portion. The piezoelectric vibrator 4 is electrically conductive resin 5 on the mounting portion. It is bonded and fixed through. The insulating base 1 has, for example, a vertical dimension of 1.5 to 7.0 mm, a horizontal dimension of 1.0 to 5.0 mm, and a height of about 0.3 to 1.5 mm. Moreover, the width | variety of the joint surface with the cover body 2 mentioned later around the recessed part of the upper surface of the insulation base | substrate 1 is about 0.25-0.7 mm.

  Such an insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. In the case of an aluminum oxide sintered body, a suitable organic binder, solvent, plasticizer, dispersant, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. The slurry is formed into a sheet by using a sheet forming method such as a doctor blade method or a calender roll method, which is conventionally known, to obtain a ceramic green sheet (ceramic raw sheet), and then suitable for the ceramic green sheet. It is manufactured by performing a punching process, laminating a plurality of these, and firing at a high temperature of about 1600 ° C.

  A plurality of metallized wiring layers 6 are deposited on the insulating substrate 1 from the vicinity of the mounting portion to the bottom surface. Then, each electrode of the piezoelectric vibrator 4 is electrically connected to a portion located in the vicinity of the mounting portion of the metallized wiring layer 6 through a conductive resin 5 made of a conductive epoxy resin or the like, and the insulating substrate 1 A wiring conductor (not shown) of an external electric circuit is attached to a portion led to the bottom surface of the wire via a brazing material such as solder.

  The metallized wiring layer 6 is made of a metal paste obtained by adding and mixing an appropriate organic solvent, solvent, plasticizer, etc. to a high melting point metal powder such as tungsten, molybdenum, manganese, etc. Is applied in advance to a ceramic green sheet to be the insulating base 1, and is fired at the same time as the ceramic green sheet to form a predetermined pattern from the top surface to the bottom surface of the insulating base 1. Further, when the metallized wiring layer 6 is coated with a metal having good conductivity, corrosion resistance and good wettability with a brazing material, such as nickel and gold, to a thickness of 1 to 20 μm by plating. The oxidative corrosion of the wiring layer 5 can be effectively prevented, and the connection between the metallized wiring layer 6 and the piezoelectric element 4 by the conductive resin 5 and the brazing between the metallized wiring layer 6 and the external electrode can be made extremely strong. it can.

  The conductive resin 5 is made of, for example, a conductive epoxy resin, and the piezoelectric vibrator 4 is placed on the mounting portion of the insulating base 1 via the conductive resin 5. Thereafter, the conductive resin 5 is thermally cured. By performing the treatment and thermosetting, the piezoelectric vibrator 4 is bonded and fixed to the insulating substrate 1.

  Further, the lid 2 is joined to the upper surface of the insulating base 1 via the sealing material 3, whereby the piezoelectric vibrator 4 is airtightly sealed inside the electronic component storage container composed of the insulating base 1 and the lid 2. Be contained.

  A convex portion 2a is formed at the central portion of the bottom surface of the lid body 2. Preferably, the thickness of the central portion of the lid body 2 is 0.15 to 0.30 mm, and the thickness of the convex portion 2a, that is, the lid body. The thickness difference between the center portion of 2 and the outer peripheral portion is preferably 0.05 to 0.10 mm.

Further, it is preferable that the shapes of the lid 2, the convex portion 2 a, the insulating base 1, and the concave portion are similar in plan view, and the outer dimension of the lid 2 is 0.05 to 0 than the outer dimension of the insulating base 1. .20mm small external dimensions of the convex portion 2a is 0.05~0.20mm not smaller than the inner dimension of the recess.

  The lid 2 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, a silicon carbide sintered body, a mullite sintered body, or an iron-nickel-cobalt alloy. , Made of metal material such as iron-nickel alloy. When the lid 2 is made of, for example, an aluminum oxide sintered body, the raw material powder such as aluminum oxide, silicon nitride, magnesium oxide, calcium oxide is filled in a predetermined press mold and pressed at a constant pressure. Thereafter, the molded article is manufactured by firing at a temperature of about 1500 ° C.

  In the sealing of the insulating substrate 1 and the lid 2, first, the sealing material 3 is first applied to the bonding region of the insulating substrate 1 and the lid 2 by using a conventionally known screen printing method or the like. Is fired at a temperature equal to or higher than the softening point of the sealing material 3 and melted and deposited on the bonding regions of the insulating base 1 and the lid 2. Next, the piezoelectric vibrator 4 is placed on the mounting portion of the insulating base 1 with a conductive resin. Then, the lid body 2 is placed on the bonding surface of the insulating base 1 so that the bonding surface overlaps, and then heated to the melting temperature of the sealing material 3. Bonding is performed under pressure by the weight of 2.

According to the electronic component storage container of the present invention, when the insulating substrate 1 and the lid 2 are joined via the sealing material 3 and the electronic component storage container is hermetically sealed, the sealing on the insulating substrate 1 side is performed. The surface tension of the sealing material 3 in which the material and the sealing material on the lid 2 side are melted works in a direction in which the lid 2 is aligned with the central portion of the insulating base 1, and the insulating base 1 and the lid 2 Can be sealed with extremely high positional accuracy. As a result, the outer periphery of the lid 2 can be sealed with the outer periphery of the insulating substrate 1 being a certain distance inside the outer periphery of the insulating substrate 1, and the compact and thin structure with extremely high hermetic reliability. It can be set as a container for storing electronic components.

  When the lid 2 and the insulating base 1 are similar in plan view, and the outer dimension of the lid 2 is 0.05 to 0.20 mm smaller than the outer dimension of the insulating base 1, the outer side of the lid 2 is When the entire circumference of the insulating substrate 1 is positioned on the inner side from the outer side of the insulating substrate 1 by less than 0.02 mm or more than 0.28 mm, a portion where the width of the joint portion between the insulating substrate 1 and the lid 2 is narrowed is generated. The reliability of hermetic sealing of the electronic component storage container 6 tends to decrease. Therefore, the lid 2 is preferably sealed in a state in which the outer side of the lid 2 is 0.02 to 0.28 mm inside the outer side of the insulating base 1 over the entire circumference of the insulating base 1.

  Further, the lid 2 should have a thickness of the central portion of 0.15 to 0.3 mm. When the thickness exceeds 0.3 mm, the lid 2 has its own weight, and the surface tension of the molten glass sealing material 3 This makes it difficult to move, and tends to make it difficult to seal with high positional accuracy. Therefore, the thickness of the lid 2 is preferably 0.3 mm or less. On the other hand, from the viewpoint of imparting strength to the lid body 2, the thickness is preferably 0.15 mm or more.

  Furthermore, it is preferable that the lid 2 and the insulating base 1 are similar in plan view, and the outer dimension of the lid 2 is 0.05 to 0.20 mm smaller than the outer dimension of the insulating base 1. When the outer dimension of the lid 2 is smaller than the outer dimension of the insulating substrate 1 by less than 0.05 or more than 0.2 mm, the positional accuracy is improved by the surface tension of the sealing material 3 in which the lid 2 is melted. It tends to be difficult to move and seal.

  Furthermore, it is preferable that the convex part 2a of the lid body 2 and the concave part of the insulating base 1 are similar in plan view, and the outer dimension of the convex part 2a is 0.05 to 0.2 mm smaller than the inner dimension of the concave part. . When the outer dimension of the convex part 2a is smaller than the inner dimension of the concave part by less than 0.05 or more than 0.2 mm, the lid 2 moves with high positional accuracy due to the surface tension of the molten sealing material 3. Tend to be difficult to seal.

  In addition, it is preferable that the thickness of the sealing material 3 to be melted and deposited on the bonding region between the insulating base 1 and the lid 2 is in the range of 0.03 to 0.15 mm. If the thickness of the sealing material is less than 0.03 mm, the surface tension acting on the molten sealing material 3 is small, and it tends to be difficult to align the lid 2 with the center portion of the insulating substrate 1 due to the surface tension. . On the other hand, if the thickness of the sealing material 3 exceeds 0.15 mm, the thickness of the sealing material 3 after joining becomes carelessly thick, and it tends to be difficult to reduce the thickness of the electronic component storage container. Accordingly, the thickness of the sealing material 3 to be melted and deposited on the bonding region between the insulating base 1 and the lid 2 is in the range of 0.03 to 0.15 mm, and the total thickness after sealing is insulating. From the viewpoint of the bonding strength between the base 1 and the lid 2, it is preferably 0.05 mm or more and from the viewpoint of reducing the thickness, it is preferably 0.30 mm or less.

  Further, the width of the sealing material 3 that is melted and deposited on the lid 2 is equal to the width of the joining region of the sealing material 3 that is melted and deposited on the insulating base 1 and can be joined while being shifted from each other. preferable. By doing so, a good fillet of the sealing material 3 is formed along the side surface of the lid body 2 on the outer peripheral side of the joint portion and along the side surface of the convex portion 2a on the inner peripheral side of the joint portion. The sealing strength between the base 1 and the lid 2 can be made extremely high. Note that the glass fillet formed along the side surface of the lid body 2 and the side surface of the convex portion 2a is formed when the lid body 2 is joined to the insulating base 1 by the weight of the lid body 2 at the softening and melting temperature of the glass sealing material 3. It is also preferable from the viewpoint of the surface tension acting in the direction in which the lid 2 is aligned with the central portion of the insulating substrate 1.

As the sealing material 3 in the present invention, glass, resin, or the like can be used. Preferably, the sealing material 3 is made of a glass sealing material obtained by adding a ceramic filler to amorphous glass. Thereby, the sealing material 3 becomes very excellent in moisture resistance, and even if moisture contained in the atmosphere attempts to enter the inside of the electronic component storage container through the sealing material 3, As a result, the electrode of the electronic component accommodated in the electronic component storage container is hardly oxidized and corroded, and the electronic component can be operated normally.

Further, in the electronic component storage container according to the present invention, the glass sealing material 3 for joining the insulating substrate 1 and the lid 2 is made of 100 parts by mass of amorphous glass with a maximum particle size of 20 to 30 μm and an average particle size. It is preferable that 10 to 60 parts by mass of 3 to 4 μm ceramic filler powder is added. Thereby, when there is little quantity of the glass sealing material 3, since the glass sealing material 3 does not contain the coarse filler particle exceeding 30 micrometers which prevents the fluidity | liquidity, the thickness is thin and it is possible to narrow sealing width, as a result, it is possible to hermetically reliability is extremely high have small type and electronic component storing container thin.

  When the average particle diameter of the filler powder constituting the glass sealing material 3 is less than 3 μm, the fluidity of the glass sealing material 3 decreases due to the reaction between the amorphous glass and the filler powder in the sealing step, and the low temperature There is a tendency that hermetic sealing with becomes difficult. On the other hand, when the average particle diameter of the filler powder exceeds 4 μm, the strength of the glass sealing material 3 is lowered, and it is difficult to reduce the thickness and sealing width of the glass sealing material 3 after sealing. is there. Therefore, it is preferable that the average particle diameter of the filler powder which comprises the glass sealing material 3 is 3-4 micrometers.

  Moreover, when the maximum particle diameter of filler powder exceeds 30 micrometers, when the quantity of the glass sealing material 3 is small, the fluidity | liquidity of the glass sealing material 3 is disturbed and the thickness of the glass sealing material 3 after sealing is made thin. , It tends to be difficult to reduce the sealing width. Therefore, the maximum particle size of the filler powder is preferably 30 μm or less.

  Furthermore, when the addition amount of the filler powder which comprises the glass sealing material 6 is less than 10 mass parts with respect to 100 mass parts of amorphous glass, while the mechanical strength of the glass sealing material 6 falls, the glass sealing material 3 The thermal expansion coefficients of the insulating base 1 and the lid 2 are greatly different from each other, and it is difficult to firmly bond the glass sealing material 3 to the insulating base 1 and the lid 2. . On the other hand, when the addition amount of the filler powder exceeds 60 parts by mass with respect to 100 parts by mass of the amorphous glass, the fluidity of the glass sealing material 3 is lowered and airtight sealing at a low temperature tends to be difficult. Therefore, the amount of filler powder added is preferably in the range of 10 to 60% by mass with external addition. The filler powder having an average particle size of 3 to 4 μm and a maximum particle size of 30 μm or less is obtained by pulverizing the filler with a ball mill to adjust the particle size and then passing through a 500 mesh sieve.

  As such a glass sealing material 3, for example, lead oxide 50 to 65% by mass, lead fluoride 10 to 30% by mass, boron oxide 2 to 10% by mass, zinc oxide 1 to 6% by mass and bismuth oxide 10 to 10% by mass. What added 26-45 mass parts of lead titanate type compounds as a filler to 100 mass parts of glass components containing 20 mass% is suitable. The glass sealing material 3 can have a glass softening and melting temperature as low as 300 ° C. or less, and the insulating base 1 and the lid 2 are joined together via the glass sealing material 3. When the piezoelectric vibrator 4 is hermetically housed in the electronic component housing container composed of 2, even if heat that melts the glass sealing material 3 acts on the piezoelectric vibrator 4 housed therein, As a result, the piezoelectric vibrator 4 can be operated normally and stably over a long period of time.

  In addition, since the glass sealing material 4 consists of a glass component and a filler and is excellent in moisture resistance, moisture contained in the atmosphere tends to enter the inside of the electronic component storage container through the glass sealing material 3. However, the penetration of moisture is effectively prevented, and as a result, the surface electrode of the piezoelectric vibrator 4 accommodated inside the electronic component storage container is hardly oxidized and corroded, and the piezoelectric vibrator 4 operates normally. It is also possible to make it.

Thus, according to the electronic component storage container of the present invention, one end of the electronic component 4 such as a piezoelectric vibrator is bonded and fixed to the mounting portion of the insulating base 1 via the conductive resin 5 made of conductive epoxy resin or the like. Each electrode of the component 4 is electrically connected to the metallized wiring layer 6, and then the lid body 2 is joined via the sealing material 3 so as to cover the mounting portion of the insulating base body 1. inside the electronic component storing container consisting of 2 which by accommodating the electronic component 4 in an airtight manner, an electronic device such as a piezoelectric vibrator as a final product is completed.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described example, an electronic component storage container for storing a piezoelectric vibrator is shown. However, the present invention can also be applied to a semiconductor element storage container for storing semiconductor elements.

It is sectional drawing which shows an example of embodiment of the container for electronic components accommodation in this invention. It is sectional drawing which shows the state before sealing of the electronic component storage container in this invention. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 .... Insulation base body 2 .... Lid 2a ... Convex part 3 .... Sealing material 4 .... Electronic component (piezoelectric vibrator)

Claims (5)

Electronic component storage comprising an insulating base having a recess for mounting an electronic component on the upper surface, and a lid bonded to the upper surface of the insulating base via a sealing material so as to close the opening of the recess. a container, to form a convex portion on the lower surface of the lid, the clearance is provided over the entire circumference between the side surface of the convex portion and the side surface of the recess, the side of the convex portion, the It is not in contact with the corner formed by the side surface of the concave portion and the upper surface of the insulating base, and the shape of the lid, the convex portion, the insulating base and the concave portion is substantially similar in plan view, The outer dimension of the lid is 0.05 to 0.20 mm smaller than the outer dimension of the insulating base, the outer dimension of the convex part is 0.05 to 0.20 mm smaller than the inner dimension of the concave part, The thickness of the central part of the lid body is 0.15 to 0.30 mm, and the thickness of the convex part Electronic device characterized by comprising housing the electronic component in the recess of the electronic component storing containers with 0.05～0.10Mm. The electronic device according to claim 1, wherein a width of the gap is 0.02 to 0.3 mm. The sealing material is an electronic device according to claim 1 or claim 2, wherein in that it consists of glass sealing material obtained by adding a ceramic filler amorphous glass. The glass encapsulant, claim 3, wherein the maximum particle diameter 20~30μm amorphous glass 100 parts by weight, by comprising a ceramic filler powder having an average particle diameter of 3~4μm added 10 to 60 parts by weight The electronic device described. The sealing material, together with intrudes into the gap, the electronic device according to claim 1, wherein that you have to form a fillet between the upper side and the insulating substrate of the lid.

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