JP2003007879A - Vessel for housing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of reliability in air-tight sealing which is induced, as the vessel for housing an electronic component becomes smaller and thinner, related to the vessel for housing an electronic component composed of a plate- like lid which houses air-tightly, using a glass sealing material, an electronic component in the space before an insulating base board. SOLUTION: The vessel for housing an electronic component comprises an insulating base body 1 provided with, on its upper part, a recessed part in which an electronic component 3 is mounted, and a lid 2 which is jointed to the upper surface of insulating base body 1 through a glass sealing material 6 to house the electronic component 3 in air-tight manner in the space before the insulating base body 1. The lid 2 is composed of a flat plate of 0.3 mm or less in thickness. The outside dimension of it is less than the insulating base body 1 by 0.1-0.3 mm, while the outer sides of it are positioned inside the outer sides of the insulating base body 1 across the entire periphery of it by 0.02-0.3 mm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage container for hermetically sealing and storing electronic components such as semiconductor elements and piezoelectric vibrators, and in particular, glass is used as a sealing material for sealing. The present invention relates to a container for storing electronic components.

[0002]

2. Description of the Related Art Conventionally, a container for storing electronic parts such as a semiconductor device including a semiconductor integrated circuit device, or a piezoelectric vibrator such as a crystal resonator or a surface acoustic wave element is made of, for example, aluminum oxide. A plurality of metallizations made of an electrically insulating material such as a sintered body, and a mounting portion for mounting electronic components on the substantially central portion of the upper surface, and a refractory metal such as tungsten or molybdenum led from the periphery to the lower surface. An insulating substrate having a wiring layer,
It is composed of a lid body having a concave portion for accommodating an electronic component in a substantially central portion of a surface facing it.

When the electronic component is, for example, a piezoelectric vibrator, one end of the piezoelectric vibrator is bonded and fixed to the mounting portion of the insulating substrate via a conductive resin such as a conductive epoxy resin, and Each electrode is electrically connected to the metallized wiring layer, and then a lid is bonded to the upper surface of the insulating base through a sealing material made of low-melting glass, and a piezoelectric element is formed inside the container made of the insulating base and the lid. By housing the oscillator airtightly, an electronic component device as a final product is obtained.

The sealing material for bonding the lid to the insulating substrate is, for example, 56 to 66% by weight of lead oxide and 4 to 4 of boron oxide.
A glass component containing 14% by weight, 1 to 6% by weight of silicon oxide, 0.5 to 3% by weight of zinc oxide and 0.5 to 5% by weight of bismuth oxide, and 10 to 20% of a cordierite compound as a filler.
Lead-based glass added by weight% is used.

However, in this conventional container for storing electronic parts, the softening melting temperature of glass, which is a sealing material for joining the lid to the insulating base, is as high as about 400 ° C. Since the heat resistance has decreased due to higher density and higher integration, the insulating base and lid are joined together via a sealing material, and the inside of the insulating container consisting of the insulating base and lid is When the electronic components are hermetically housed, the heat that melts the sealing material acts on the electronic components housed inside, causing deterioration in the characteristics of the electronic components, and the electronic device cannot operate normally. Had.

[0006] In addition, in recent years, with the rise of the global environmental protection movement, lead oxide has been designated as an environmentally hazardous substance. For example, when an electronic device containing lead oxide is discarded and left outdoors and exposed to wind and rain, There is a need to develop a sealing material that does not use lead oxide, which is harmful to the human body because lead may melt into it and pollute the environment.

In order to solve such a problem, a low-melting glass containing no lead oxide, which contains silver phosphate glass or tin phosphate glass as a main component, has been studied.

[0008]

However, with the recent widespread use of portable electronic devices, there is an increasing demand for smaller and thinner electronic component storage containers, and glass is used for sealing. Also in an electronic component storage container, an insulating base having a recess for mounting electronic components on the upper surface for the purpose of downsizing and thinning is joined to the upper surface of the insulating base, and an electronic space is provided between the insulating base and the insulating base. There has been devised a container for storing electronic components, which includes a flat plate lid that hermetically stores components with a glass sealing material. In this electronic component storage container, it is possible to make the electronic component storage container thinner while maintaining the bending strength of the electronic component storage container by reducing the thickness of the lid. As a result, it tends to be difficult to align with the insulating substrate during sealing. On the other hand, along with the reduction of the sealing width due to the miniaturization of the electronic component storage container, high positioning accuracy between the insulating base and the lid at the time of sealing is required, and it is necessary to mount the electronic component on the upper surface. In an electronic component storage container comprising an insulating base having a recess and a flat plate lid which is joined to the upper surface of the insulating base and hermetically stores an electronic component in a space between the insulating base and a glass sealing material, As the container for storing electronic parts has become smaller and thinner, it has become more difficult to perform positioning, which has caused a problem of reliability of hermetic sealing.

The present invention has been devised in view of the above problems, and an object thereof is to hermetically seal an electronic component inside a container composed of an insulating substrate and a lid, which causes deterioration of its characteristics. It is an object of the present invention to provide a container for storing electronic components, which can operate the electronic components normally and stably for a long period of time.

[0010]

The container for housing electronic parts of the present invention is an insulating base having a concave portion for mounting electronic parts on the upper surface, and is joined to the upper surface of the insulating base via a glass sealing material. And a lid body for hermetically housing an electronic component in a space between the insulating base body, the lid body having a flat plate shape with a thickness of 0.3 mm or less. The external dimensions are 0.1 to 0.3 than the external dimensions of the insulating base.
It is characterized in that it is smaller by mm and the outer side of the lid is 0.02 to 0.3 mm inside from the outer side of the insulating base over the entire circumference of the insulating base.

Further, in the container for storing electronic parts of the present invention, in the above-mentioned constitution, the glass sealing material is 14 to 40% by weight of silver oxide, 5 to 20% by weight of silver iodide, 10 to 30% by weight of phosphorus pentoxide, Boron 5 to 15% by weight, zinc oxide 1 to 6% by weight, and silicon oxide 5
It is characterized in that it comprises 10 to 30% by weight of a solid solution of zirconium phosphate, zirconium oxide and niobium oxide as a filler added to a glass component containing 15 to 15% by weight.

According to the electronic component storage container of the present invention, an insulating base having a concave portion for mounting an electronic component on the upper surface is joined to the upper surface of the insulating base via a glass sealing material,
A container for storing electronic parts, which comprises a cover for hermetically storing electronic parts in a space between the base and the insulating base, the cover having a length of 0.3 m.
It has a flat plate shape with a thickness of m or less, the outer dimension of the lid is 0.1 to 0.3 mm smaller than the outer dimension of the insulating base, and the outer edge of the lid extends over the entire circumference of the insulating base from the outer edge of the insulating base.
Since it is on the inside of 0.02 to 0.3 mm, when the insulating base and the lid are joined together via the glass sealing material to hermetically seal the container, the glass sealing material on the insulating base side and the glass sealing on the lid side The surface tension of the glass sealing material in which the materials are melted works in the direction of aligning the lid with the center of the insulating base, and the insulating base and the lid can be sealed with extremely high positional accuracy, As a result, a small and thin electronic component storage container having extremely high airtight reliability can be provided.

Further, according to the container for storing electronic parts of the present invention, since the insulating base and the lid are joined by the glass sealing material containing silver phosphate glass as a main component, the sealing temperature is 350.
C. or less, and when the insulating base and the lid are joined via a glass sealant and the electronic component is hermetically housed inside the container made of the insulating base and the lid, the glass sealant is used. Even if the heat for melting acts on the electronic components housed inside, the characteristics of the electronic components are not deteriorated, and as a result, it becomes possible to operate the electronic components normally and stably for a long period of time.

[0014]

DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of a container for storing electronic parts of the present invention. In this figure, an example is shown in which the electronic component is a piezoelectric oscillator such as a crystal oscillator, and the electronic component storage container is a piezoelectric oscillator storage container.

In this figure, 1 is an insulating base, 2 is a lid, and the insulating base 1 and the lid 2 constitute a container 4 for accommodating the piezoelectric vibrator 3.

The insulating substrate 1 has a substantially rectangular shape having a concave portion on the upper surface, and a mounting portion 1a for mounting the piezoelectric vibrator 3 is provided on the upper surface of the concave portion. The mounting portion 1a has the piezoelectric vibrator 3 therein.
Are bonded and fixed via the conductive resin J. The insulating substrate 1 has a longitudinal dimension of 1.5 to 7.0 mm, a lateral dimension of 1.0 to 5.0 mm, and a height of about 0.3 to 1.5 mm. The width of the joint surface with is 0.25
It is about 0.7 mm.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. If it is made of aluminum oxide sintered material, powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. is mixed with appropriate organic binder, solvent, plasticizer, dispersant, etc. Then, the sludge is formed into a sheet by using a sheet forming method such as the well-known doctor blade method or calendar roll method to obtain a ceramic green sheet (ceramic green sheet), and then suitable for those ceramic green sheets. It is manufactured by performing various punching processes, stacking multiple sheets, and firing at a high temperature of about 1600 ° C.

A plurality of metallized wiring layers 5 are formed on the insulating substrate 1 from the vicinity of the mounting portion 1a to the bottom surface. Then, each electrode of the piezoelectric vibrator 3 is electrically connected to a portion of the metallized wiring layer 5 located in the vicinity of the mounting portion 1a via a conductive resin J made of a conductive epoxy resin or the like, and an insulating substrate. A wiring conductor (not shown) of an external electric circuit is attached to a portion led out to the bottom surface of 1 via a brazing material such as solder.

For the metallized wiring layer 5, a metal paste obtained by adding and mixing a suitable organic solvent, a solvent, a plasticizer, etc. to a high melting point metal powder such as tungsten, molybdenum, manganese, etc. by a conventionally known screen printing method or the like. A thick film method is used to print and apply to the ceramic green sheet to be the insulating substrate 1 in advance, and this is baked simultaneously with the ceramic green sheet to form a predetermined pattern from the upper surface to the bottom surface of the insulating substrate 1. . Further, the metallized wiring layer 5 is formed by depositing a metal such as nickel or gold having good conductivity, corrosion resistance and wettability with the brazing material to a thickness of 1 to 20 μm by plating. Oxidation and corrosion of the wiring layer 5 can be effectively prevented, and connection between the metallized wiring layer 5 and the piezoelectric element 3 by the conductive resin J and brazing of the metallized wiring layer 5 and the external electrode can be made extremely strong. it can.

The conductive resin J is made of, for example, a conductive epoxy resin, and the piezoelectric vibrator 3 is placed on the mounting portion 1a of the insulating substrate 1 via the conductive resin J. By heat-curing J to heat-cure it, the piezoelectric vibrator 3 serves to adhere and fix to the insulating substrate 1.

Further, the lid 2 is bonded to the upper surface of the insulating base 1 through the glass sealing material 6, whereby the piezoelectric vibrator 3 is hermetically sealed inside the container 4 composed of the insulating base 1 and the lid 2. Housed in.

The lid 2 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, a silicon carbide sintered body or a mullite sintered body, or iron-nickel. -Cobalt alloy, iron-nickel alloy and other metal materials. When the lid body 2 is made of, for example, an aluminum oxide sintered body, it is formed by filling raw material powder such as aluminum oxide, silicon nitride, magnesium oxide, calcium oxide, etc. into a predetermined press die and pressing it with a constant pressure. ,
Then, the molded product is manufactured by firing at a temperature of about 1500 ° C. Further, the lid body 2 has a flat plate shape having a thickness of 0.3 mm or less, and the outer dimensions of the lid body 2 are smaller by 0.1 to 0.3 mm than the outer dimensions of the insulating substrate 1.

In order to bond and seal the insulating substrate 1 and the lid body 2, first, the glass sealing material 6 is applied in advance to the bonding region of the insulating substrate 1 and the lid body 2 by using a conventionally known screen printing method or the like. The glass encapsulant 6 is fired at the softening melting temperature of the glass encapsulant 6 to be melted and adhered to the bonding region of the insulating base 1 and the lid 2. Next, the piezoelectric vibrator 3 is mounted on the mounting portion 1a of the insulating base 1. The conductive resin J is bonded and fixed, and the lid 2 is placed on the joint surface of the insulating substrate 1 so that the joint surface overlaps.
This is performed by the weight of the lid body 2 by firing at the softening melting temperature of the glass sealing material 6.

According to the container for storing electronic parts of the present invention, when the insulating base 1 and the lid 2 are bonded to each other through the glass sealing material 6 to hermetically seal the container 4, the glass on the insulating base 1 side is sealed. The surface tension of the glass encapsulant 6 in which the encapsulant 6 and the glass encapsulant on the side of the lid 2 melt together acts in the direction of aligning the lid 2 with the central portion of the insulating substrate 1, and the insulating substrate 1 The lid 2 and the lid 2 can be sealed with extremely high positional accuracy. As a result, the outer edge of the lid 2 is 0.02 to 0.3 mm inside from the outer edge of the insulating base 1 over the entire circumference of the insulating base 1. It is possible to provide a small and thin electronic component storage container that is sealed in a state and has extremely high airtight reliability.

When the outer edge of the lid body 2 is located inside the outer edge of the insulating base body 1 by less than 0.02 or more than 0.3 mm over the entire circumference of the insulating base body 1, the insulating base body 1 and the lid body 2 are separated from each other. The width of the joint portion becomes narrow, and the reliability of hermetically sealing the container 6 tends to decrease. Therefore, it is preferable that the outer periphery of the lid body 2 is sealed 0.02 to 0.3 mm inside from the outer periphery of the insulating base 1 over the entire periphery of the insulating base 1.

If the lid 2 has a thickness of more than 0.3 mm, its own weight becomes large and it becomes difficult to move due to the surface tension of the molten glass sealing material 6, so that the lid 2 should be sealed with high positional accuracy. Tends to be difficult. Therefore, it is important that the thickness of the lid body 2 is 0.3 mm or less. On the other hand, from the viewpoint of imparting strength to the lid body 2,
It is preferable that the thickness is 0.1 mm or more.

Further, it is important that the outer dimensions of the lid 2 are smaller than the outer dimensions of the insulating substrate 1 by 0.1 to 0.3 mm. When the outer dimension of the lid body 2 is smaller than the outer dimension of the insulating substrate 1 by less than 0.1 or more than 0.3 mm, the lid body 2 moves with high position accuracy due to the surface tension of the melted glass sealing material 6. Thus, it tends to be difficult to seal the lid body 2 with the outer edge thereof being 0.02 to 0.3 mm inside from the outer edge of the insulating base 1 over the entire circumference of the insulating base 1. Therefore, it is important that the outer dimensions of the lid 2 are smaller than the outer dimensions of the insulating substrate 1 by 0.1 to 0.3 mm.

In addition, the thickness of the glass sealing material 6 melt-deposited on the joint area between the insulating base 1 and the lid 2 is both 0.05.
It is preferably in the range of 0.15 mm. If the thickness of the glass sealing material is less than 0.05 mm, the surface tension acting on the melted glass sealing material 6 is small, and it becomes difficult to position the lid body 2 on the central portion of the insulating substrate 1 by the surface tension. On the other hand, when the thickness of the glass sealing material exceeds 0.15 mm, the thickness of the glass sealing material 6 after joining becomes too thick, and it becomes difficult to make the container 4 thin. Therefore, the thickness of the glass sealing material 6 melt-deposited on the joint region between the insulating base 1 and the lid 2 is 0.05 to 0.15.
It is preferably in the range of mm.

Further, the width of the glass sealing material 6 melt-deposited on the lid body 2 is the width of the glass sealing material 6 melt-deposited on the insulating substrate 1.
It is preferable that the width is the same as the width of the joining region. By doing so, a glass fillet is formed on the side of the insulating substrate 1 on the outer circumference of the container 4, and the lid 2 is formed on the inner circumference of the container 4.
A glass fillet is formed on the side. As a result, container 4
By forming the glass fillets on both the outer circumference and the inner circumference, the sealing strength between the insulating base 1 and the lid 2 becomes extremely high. It should be noted that the glass fillets formed on both the outer circumference and the inner circumference of the container 4 are insulated from each other by the insulating base 1 when the lid 2 is bonded by its own weight at the softening melting temperature of the glass sealing material 6.
It is also suitable from the viewpoint of the surface tension acting in the direction in which the lid 2 is aligned with the central portion of the.

Further, in the container for storing electronic parts of the present invention, the glass sealing material 6 for joining the insulating base 1 and the lid 2 together.
Silver oxide 14 to 40% by weight, silver iodide 5 to 20% by weight, phosphorus pentoxide 10 to 30% by weight, boron oxide 5 to 15% by weight, zinc oxide 1
-10% by weight of a solid solution of zirconium phosphate, zirconium oxide and niobium oxide as a filler was added to a glass component containing 6% by weight to 5% by weight of silicon oxide and 5% to 15% by weight of silicon oxide. The point can be lowered to 350 ° C. or lower, the insulating base 1 and the lid 2 are joined together via the sealing material 6, and the piezoelectric vibrator 3 is placed inside the container 4 composed of the insulating base 1 and the lid 2. Piezoelectric vibrator 3 in which heat for melting glass sealing material 6 is housed inside when hermetically housed
Does not deteriorate the characteristics of the piezoelectric vibrator 3, and as a result, the piezoelectric vibrator 3 can be operated normally and stably for a long period of time.

In the glass component of the glass sealing material 6, if the amount of silver oxide is less than 14% by weight, the softening and melting temperature of the glass becomes high and it becomes difficult to hermetically seal the container 4 at a low temperature. On the other hand, if it exceeds 40% by weight, the softening and melting temperature of the glass lowers, and the glass sealing material 6 softens and melts by the heat when the piezoelectric vibrator 3 is mounted on the external electric circuit board. The reliability of the airtight sealing of No. 4 tends to be greatly reduced. Therefore, the amount of silver oxide is preferably in the range of 14-40% by weight.

If the amount of silver iodide is less than 5% by weight, the softening and melting temperature of the glass becomes high and the container 4 at a low temperature is heated.
However, if the amount exceeds 20% by weight, the chemical resistance of the glass tends to deteriorate, and the reliability of the hermetic sealing of the container 4 tends to largely decrease. Therefore,
The amount of silver iodide is preferably in the range of 5 to 20% by weight.

If the amount of phosphorus pentoxide is less than 10% by weight, the softening and melting temperature of the glass tends to be high, and it tends to be difficult to hermetically seal the container 4 at low temperatures, while it exceeds 30% by weight. Therefore, the chemical resistance of the glass is lowered, and the reliability of hermetic sealing of the container 4 tends to be greatly lowered. Therefore, the amount of phosphorus pentoxide is preferably in the range of 10 to 30% by weight.

If the amount of boron oxide is less than 5% by weight, crystallization of the glass is promoted, and it becomes difficult to hermetically seal the container 4 at low temperatures, while if it exceeds 15% by weight, the chemical resistance of the glass becomes high. Property, and the reliability of hermetically sealing the container 4 tends to be greatly reduced. Therefore, the amount of boron oxide is 5 to 15
It is preferably in the range of% by weight.

If the amount of zinc oxide is less than 1% by weight, the chemical resistance of the glass tends to deteriorate, and the reliability of the hermetic sealing of the container 4 tends to decrease significantly, while it exceeds 6% by weight. When the glass is crystallized, it becomes difficult to hermetically seal the container 4 at a low temperature. Therefore, the amount of zinc oxide is 1 to 6
It is preferably in the range of% by weight.

If the amount of silicon oxide is less than 5% by weight, the coefficient of thermal expansion of the glass becomes large and the coefficient of thermal expansion greatly differs from the coefficients of thermal expansion of the insulating substrate 1 and the lid 2. The reliability tends to decrease, and if it exceeds 15% by weight, the softening and melting temperature of the glass becomes high, and it tends to be difficult to hermetically seal the container 4 at a low temperature. Therefore, the amount of silicon oxide is preferably in the range of 5 to 15% by weight.

The filler composed of zirconium phosphate, zirconium oxide, and niobium oxide solid solution adjusts the thermal expansion coefficient of the glass sealing material 6, and the insulating base 1 and the lid 2
The glass sealing material 6 is strongly bonded to the glass sealing material 6, and the airtight reliability of the container 4 is greatly improved and the mechanical strength of the glass sealing material 6 is improved. The content of this filler is
If it is less than 10% by weight, the mechanical strength of the glass sealing material 6 is lowered, and the thermal expansion coefficient of the glass sealing material 6 is greatly different from the thermal expansion coefficients of the insulating substrate 1 and the lid body 2 for sealing. There is a tendency that the material 6 cannot be firmly bonded to the insulating base 1 and the lid 2. On the other hand, if it exceeds 30% by weight, the fluidity of the glass sealing material 6 is lowered, and airtight sealing at low temperature tends to be difficult. Therefore, the content of the filler is preferably in the range of 10 to 30% by weight.

Since the glass sealing material 6 is composed of a glass component and a filler and is excellent in moisture resistance, moisture contained in the atmosphere tries to enter the inside of the container 4 through the glass sealing material 6. The invasion of water is effectively blocked,
As a result, the surface electrode of the piezoelectric vibrator 3 housed inside the container 4 is hardly oxidized and corroded, and the piezoelectric vibrator 3 can be normally operated.

Further, in the present invention, the glass sealing material 6
Since it does not contain lead oxide, it does not affect the global environment.

Thus, according to the container for storing electronic parts of the present invention, one end of the piezoelectric vibrator 3 is adhered and fixed to the mounting portion 1a of the insulating substrate 1 through the conductive resin J made of a conductive epoxy resin or the like, and the piezoelectric element is formed. Each electrode of the vibrator 3 is electrically connected to the metallized wiring layer 5, and then the lid body 2 is bonded via the glass sealing material 6 so as to cover the mounting portion 1a of the insulating base body 1. A piezoelectric vibrating device as a final product is completed by hermetically housing the piezoelectric vibrator 3 in a container 4 composed of the lid 2 and the lid 2.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention. For example, although the electronic component housing container for housing the piezoelectric vibrator is shown in the above example, the present invention can also be applied to a semiconductor element housing container for housing a semiconductor element.

[0043]

According to the electronic component storage container of the present invention,
An electronic device including an insulating base having a concave portion for mounting an electronic component on the upper surface, and a lid body joined to the upper surface of the insulating base and hermetically housing the electronic component in a space between the insulating base and a sealing material. A container for storing parts, wherein the lid has a flat plate shape with a thickness of 0.3 mm or less, the outer dimensions of the lid are 0.1 to 0.3 mm smaller than the outer dimensions of the insulating base, and the outer periphery of the lid is insulated. 0.02 to 0.3 from the outer edge of the insulating substrate over the entire circumference of the substrate
Since the insulating base and the lid are bonded to each other via the glass sealing material and the container is hermetically sealed, the glass sealing material on the insulating base side and the glass sealing material on the lid side are The surface tension of the fused glass sealing material acts in the direction of aligning the lid with the center of the insulating base, and the insulating base and the lid can be sealed with extremely high positional accuracy, and as a result, It is possible to provide a small and thin electronic component storage container with extremely high airtight reliability.

Further, according to the container for storing electronic parts of the present invention, since the insulating substrate and the lid are joined by the glass sealing material containing silver phosphate glass as a main component, the sealing temperature is set to 350.
C. or less, and when the insulating base and the lid are joined via a glass sealant and the electronic component is hermetically housed inside the container made of the insulating base and the lid, the glass sealant is used. Even if the heat for melting acts on the electronic components housed inside, the characteristics of the electronic components are not deteriorated, and as a result, it becomes possible to operate the electronic components normally and stably for a long period of time.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a container for storing electronic components of the present invention.

[Explanation of symbols]

1 ... Insulating substrate 1a ・ ・ ・ ・ ・ ・ Mounting part 2 ... Lid 3 ・ ・ Electronic parts (piezoelectric vibrator) 4 ・ ・ Container 6 ... Glass encapsulant

Claims (2)

[Claims] 1. An insulating base having a recess for mounting an electronic component on an upper surface thereof, and an insulating base bonded to the upper surface of the insulating base via a glass sealing material, and an electronic component being provided in a space between the insulating base and the insulating base. An electronic component storage container comprising a lid body that is hermetically sealed, wherein the lid body has a flat plate shape having a thickness of 0.3 mm or less, and an outer dimension of the lid body is larger than an outer dimension of the insulating base body. Electronic component storage characterized in that it is smaller by 0.1 to 0.3 mm and the outer side of the lid is 0.02 to 0.30 mm inside from the outer side of the insulating base over the entire circumference of the insulating base. Container. 2. The glass sealing material comprises 14 to 40% by weight of silver oxide, 5 to 20% by weight of silver iodide, 10 to 30% by weight of phosphorus pentoxide, 5 to 15% by weight of boron oxide, and 1 to 6 of zinc oxide. weight%
2. A glass component containing 5 to 15% by weight of silicon oxide and 10 to 30% by weight of a solid solution of zirconium phosphate, zirconium oxide and niobium oxide as a filler added externally. A container for storing electronic components.