JP2009200117A5 - - Google Patents

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Publication number
JP2009200117A5
JP2009200117A5 JP2008037775A JP2008037775A JP2009200117A5 JP 2009200117 A5 JP2009200117 A5 JP 2009200117A5 JP 2008037775 A JP2008037775 A JP 2008037775A JP 2008037775 A JP2008037775 A JP 2008037775A JP 2009200117 A5 JP2009200117 A5 JP 2009200117A5
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JP
Japan
Prior art keywords
substrate
substrates
pair
proximity
pressure
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Application number
JP2008037775A
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English (en)
Japanese (ja)
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JP2009200117A (ja
JP4978505B2 (ja
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Priority to JP2008037775A priority Critical patent/JP4978505B2/ja
Priority claimed from JP2008037775A external-priority patent/JP4978505B2/ja
Publication of JP2009200117A publication Critical patent/JP2009200117A/ja
Publication of JP2009200117A5 publication Critical patent/JP2009200117A5/ja
Application granted granted Critical
Publication of JP4978505B2 publication Critical patent/JP4978505B2/ja
Active legal-status Critical Current
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JP2008037775A 2008-02-19 2008-02-19 接合装置および製造方法 Active JP4978505B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008037775A JP4978505B2 (ja) 2008-02-19 2008-02-19 接合装置および製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008037775A JP4978505B2 (ja) 2008-02-19 2008-02-19 接合装置および製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012087593A Division JP5488636B2 (ja) 2012-04-06 2012-04-06 接合装置、接合方法、および、製造方法

Publications (3)

Publication Number Publication Date
JP2009200117A JP2009200117A (ja) 2009-09-03
JP2009200117A5 true JP2009200117A5 (cg-RX-API-DMAC10.html) 2011-09-08
JP4978505B2 JP4978505B2 (ja) 2012-07-18

Family

ID=41143346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008037775A Active JP4978505B2 (ja) 2008-02-19 2008-02-19 接合装置および製造方法

Country Status (1)

Country Link
JP (1) JP4978505B2 (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5504840B2 (ja) * 2009-11-18 2014-05-28 株式会社ニコン 複数の基板を重ね合わせる重ね合わせ装置、重ね合わせ方法及びデバイスの製造方法
JP5454310B2 (ja) * 2010-04-01 2014-03-26 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
JP2014225282A (ja) * 2014-07-23 2014-12-04 株式会社ニコン 圧弁、加圧装置、重ね合わせ装置、加圧方法および重ね合わせ方法
KR102356109B1 (ko) * 2016-11-09 2022-02-03 도쿄엘렉트론가부시키가이샤 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
JP7465552B2 (ja) * 2021-02-10 2024-04-11 Ａｉメカテック株式会社 基板貼り付け装置及び基板貼り付け方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326633A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JP4245138B2 (ja) * 2003-03-11 2009-03-25 富士通株式会社 基板貼合せ装置及び基板貼合せ方法
JP4686377B2 (ja) * 2004-01-22 2011-05-25 ボンドテック株式会社 接合方法および接合装置
JP4950478B2 (ja) * 2005-11-15 2012-06-13 ボンドテック株式会社 加圧方法およびこの方法を用いた接合方法並びにこの接合方法により作成されるデバイス並びに加圧装置およびこの装置を用いた接合装置
JP2007157970A (ja) * 2005-12-05 2007-06-21 Sony Corp ボンディング方法及びボンディング装置
JP2007311683A (ja) * 2006-05-22 2007-11-29 Matsushita Electric Ind Co Ltd 貼り合せ方法及びその装置

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