JP2009188226A5 - - Google Patents

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Publication number
JP2009188226A5
JP2009188226A5 JP2008027282A JP2008027282A JP2009188226A5 JP 2009188226 A5 JP2009188226 A5 JP 2009188226A5 JP 2008027282 A JP2008027282 A JP 2008027282A JP 2008027282 A JP2008027282 A JP 2008027282A JP 2009188226 A5 JP2009188226 A5 JP 2009188226A5
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JP
Japan
Prior art keywords
semiconductor
inspection
holding position
wafer
position information
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Application number
JP2008027282A
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English (en)
Japanese (ja)
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JP2009188226A (ja
JP4981703B2 (ja
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Priority to JP2008027282A priority Critical patent/JP4981703B2/ja
Priority claimed from JP2008027282A external-priority patent/JP4981703B2/ja
Publication of JP2009188226A publication Critical patent/JP2009188226A/ja
Publication of JP2009188226A5 publication Critical patent/JP2009188226A5/ja
Application granted granted Critical
Publication of JP4981703B2 publication Critical patent/JP4981703B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008027282A 2008-02-07 2008-02-07 外観検査装置および外観検査方法 Expired - Fee Related JP4981703B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008027282A JP4981703B2 (ja) 2008-02-07 2008-02-07 外観検査装置および外観検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008027282A JP4981703B2 (ja) 2008-02-07 2008-02-07 外観検査装置および外観検査方法

Publications (3)

Publication Number Publication Date
JP2009188226A JP2009188226A (ja) 2009-08-20
JP2009188226A5 true JP2009188226A5 (enExample) 2011-03-03
JP4981703B2 JP4981703B2 (ja) 2012-07-25

Family

ID=41071172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008027282A Expired - Fee Related JP4981703B2 (ja) 2008-02-07 2008-02-07 外観検査装置および外観検査方法

Country Status (1)

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JP (1) JP4981703B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7202828B2 (ja) * 2018-09-26 2023-01-12 東京エレクトロン株式会社 基板検査方法、基板検査装置および記録媒体
JP2021015850A (ja) * 2019-07-10 2021-02-12 株式会社ディスコ ウェーハ検査装置
JP7632254B2 (ja) * 2021-12-08 2025-02-19 株式会社Sumco ウェーハ端面部の評価方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7031796B2 (en) * 2003-09-03 2006-04-18 Kla-Tencor Technologies Corporation Radiation damage reduction
JP2008021967A (ja) * 2006-06-13 2008-01-31 Fujitsu Ltd 検査方法及び検査装置
JP2009026839A (ja) * 2007-07-18 2009-02-05 Fujitsu Microelectronics Ltd 基板異常発生源特定装置、そのプログラム、及びその方法
JP2009071230A (ja) * 2007-09-18 2009-04-02 Elpida Memory Inc 欠陥分布解析システム、方法およびプログラム

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