JP2009182274A5 - - Google Patents
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- Publication number
- JP2009182274A5 JP2009182274A5 JP2008022013A JP2008022013A JP2009182274A5 JP 2009182274 A5 JP2009182274 A5 JP 2009182274A5 JP 2008022013 A JP2008022013 A JP 2008022013A JP 2008022013 A JP2008022013 A JP 2008022013A JP 2009182274 A5 JP2009182274 A5 JP 2009182274A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- resin layer
- protruding electrode
- wiring layer
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 11
- 229920005989 resin Polymers 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 235000010724 Wisteria floribunda Nutrition 0.000 claims 1
- 230000000875 corresponding Effects 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008022013A JP5028291B2 (ja) | 2008-01-31 | 2008-01-31 | 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 |
CN2009101346932A CN101540299B (zh) | 2008-01-31 | 2009-02-01 | 元件搭载用基板、半导体组件及其制造方法及便携式设备 |
US12/364,084 US8309864B2 (en) | 2008-01-31 | 2009-02-02 | Device mounting board and manufacturing method therefor, and semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008022013A JP5028291B2 (ja) | 2008-01-31 | 2008-01-31 | 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009182274A JP2009182274A (ja) | 2009-08-13 |
JP2009182274A5 true JP2009182274A5 (fr) | 2011-03-10 |
JP5028291B2 JP5028291B2 (ja) | 2012-09-19 |
Family
ID=41035973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008022013A Active JP5028291B2 (ja) | 2008-01-31 | 2008-01-31 | 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5028291B2 (fr) |
CN (1) | CN101540299B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101669534B1 (ko) * | 2009-12-07 | 2016-10-26 | 해성디에스 주식회사 | 범프를 구비한 회로기판 및 그 제조 방법 |
WO2011136363A1 (fr) * | 2010-04-28 | 2011-11-03 | 三洋電機株式会社 | Procédé de fabrication d'un dispositif à circuit |
US9398389B2 (en) * | 2013-05-13 | 2016-07-19 | Knowles Electronics, Llc | Apparatus for securing components in an electret condenser microphone (ECM) |
JP7226472B2 (ja) * | 2020-05-26 | 2023-02-21 | 株式会社村田製作所 | 部品相互接続要素を備えた電子部品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823943B2 (ja) * | 1975-07-16 | 1983-05-18 | 松下電器産業株式会社 | 絶縁体の貫通電極形成方法 |
KR100280298B1 (ko) * | 1995-11-17 | 2001-02-01 | 니시무로 타이죠 | 다층배선기판, 다층배선기판의 프리패브 소재, 다층배선기판의 제조방법, 전자부품, 전자부품 패키지 및 도전성 필러의 형성방법 |
JP2951882B2 (ja) * | 1996-03-06 | 1999-09-20 | 松下電器産業株式会社 | 半導体装置の製造方法及びこれを用いて製造した半導体装置 |
JP3050807B2 (ja) * | 1996-06-19 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JP3769587B2 (ja) * | 2000-11-01 | 2006-04-26 | 株式会社ノース | 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置 |
JP2004095913A (ja) * | 2002-08-30 | 2004-03-25 | Dainippon Printing Co Ltd | プリント配線基板及びその製造方法 |
JP2006310530A (ja) * | 2005-04-28 | 2006-11-09 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
JP4568215B2 (ja) * | 2005-11-30 | 2010-10-27 | 三洋電機株式会社 | 回路装置および回路装置の製造方法 |
-
2008
- 2008-01-31 JP JP2008022013A patent/JP5028291B2/ja active Active
-
2009
- 2009-02-01 CN CN2009101346932A patent/CN101540299B/zh active Active
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