JP2009170978A - Solid-state image pickup device and electronic apparatus equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device capable of detachably attaching a solid-state image pickup element on a wiring board and easily positioning the solid-state image pickup element on the wiring board. <P>SOLUTION: This solid-state image pickup device 100 is fixed on the wiring board 1 so as to be detachable from the wiring board 1, wherein pressure is applied vertically to side surfaces of a light transmissive lid 3 to sandwich the light transmissive lid 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device and an electronic apparatus including the solid-state imaging apparatus. More specifically, the present invention is suitable for various electronic apparatuses such as a mobile phone with a camera, a digital still camera, a security camera such as a surveillance camera and a door phone. The present invention relates to a solid-state image pickup device that can be used in the field.

  In mounting (soldering) components on an electronic apparatus equipped with a solid-state imaging device, surface mounting soldering using a reflow furnace is generally used from the viewpoint of reducing the mounting density and the number of processes. In this method, since the components are put into the reflow furnace and heated together with the substrate, a plurality of components can be soldered to the printed circuit board at a high density.

  However, conventionally, when a solid-state imaging device is mounted on a printed circuit board (wiring board) of an imaging device (digital still camera, video movie, surveillance camera, etc.), the solid-state imaging device itself is once sealed with a resin package Was mounted inside the imaging device.

  The mounting method of the solid-state imaging device inside the imaging device is roughly classified into a solder mounting method, a method using a socket, a method of mounting by relaying a flexible substrate, and the like. However, the solder mounting method has a problem of heat resistance of the solid-state imaging device. In the method using a socket, there is a problem of alignment error due to variations in resin molding and temperature expansion. In the method using a flexible substrate, there is a possibility that the printed wiring may be disconnected if a strong bending stress is applied during the mounting operation of the flexible substrate, or that the soldered portion on the flexible substrate may be cracked due to pressure applied to the soldered portion on the flexible substrate. is there.

  On the other hand, the mounting method using a socket is adopted when importance is placed on reducing the mounting cost (man-hours) because the socket can be mounted by a reflow furnace.

  For example, Patent Documents 1 to 3 describe a solid-state imaging device mounted on an imaging device.

  FIG. 13 is a cross-sectional view of the solid-state imaging device of Patent Document 1. In the solid-state imaging device 200 of Patent Document 1, the wiring board 201 and the solid-state imaging element 202 are electrically connected to each other by wire bonding using a metal piece 203.

  FIG. 14 is a cross-sectional view of the solid-state imaging device of Patent Document 2. The solid-state imaging device 300 of Patent Document 2 includes a wiring substrate 301 and a solid-state imaging device by a solder electrode (not shown) formed on the back surface of the solid-state imaging device 302 (a surface opposite to the light receiving surface of the solid-state imaging device 302). 302 are electrically connected to each other.

FIG. 15 is a plan view and a cross-sectional view of a solid-state imaging element in the solid-state imaging device of Patent Document 3. In the solid-state imaging device 400 of Patent Document 3, the effective pixel region 403 of the solid-state imaging element 402 is covered with a translucent member 404. A bonding pad 405 is formed on the light receiving surface where the effective pixel region 403 is formed. Then, the bonding pads 405 and terminals on a wiring board (not shown) are wire-bonded, whereby the solid-state imaging element 402 and the wiring board are electrically connected to each other. In Patent Document 3, such a solid-state imaging device 402 is formed by separating a semiconductor wafer on which glass is pasted.
JP 2001-021976 A (published Jan. 26, 2001) JP 2003-319217 A (published on November 07, 2003) JP 2004-296453 A (released on October 21, 2004)

  However, in the conventional solid-state imaging device, since the solid-state imaging element needs to be bonded or pressure-bonded to the wiring board, it is difficult to remove the solid-state imaging element from the wiring board, and the position of the solid-state imaging element on the wiring board Matching is also difficult. In addition, the manufacturing process becomes complicated.

  Specifically, in Patent Document 1, the solid-state imaging device 202 is bonded to an element mounting plate 204 provided between the wiring board 201 and the solid-state imaging device 202. Furthermore, the wiring board 201 and the solid-state imaging device 202 are wire-bonded with the metal piece 203. For this reason, it is very difficult to remove the solid-state imaging element 202 from the wiring board 201.

  In addition, in the solid-state imaging device 200, the element mounting plate 204 to which the solid-state imaging element 202 is bonded is fixed to the lens case 205 with screws (not shown). When fixed, the elastic body (filter holding member 206) holds down the solid-state imaging device 202 and the low-pass filter 207. For this reason, the position of the solid-state imaging device 202 on the wiring board 201 is caused by screw tightening. Further, since the solid-state image sensor 202 is pressed by the filter pressing member 206, a protective glass 208 for protecting the solid-state image sensor 202 is required in addition to the low-pass filter 207.

  On the other hand, Patent Document 2 does not describe any method for forming a solder electrode on the back surface of the solid-state imaging element 302. In order to form such a solder electrode, it is necessary to form an electrode (through electrode) penetrating the solid-state imaging element 302 or to form a wiring on the side surface of the solid-state imaging element 302. However, in order to form a solder electrode on the back surface of the solid-state imaging element 302, many very complicated processes are necessary. For this reason, the production efficiency and the production cost are greatly increased.

  In Patent Document 3, a bonding pad 405 formed on the light receiving surface of the solid-state imaging element 402 and a terminal on the wiring board are wire-bonded. Further, in Patent Document 3, in order to align the solid-state image pickup element 402 on the wiring board or mount it on the image pickup apparatus, the solid-state image pickup element 402 must be packaged on the wiring board including wire bonding. I must. For this reason, it is very difficult to remove the solid-state imaging element 402 from the wiring board.

  Therefore, the present invention has been made in view of the above-described problems, and an object of the present invention is to allow the solid-state image sensor to be attached to and detached from the wiring board, and to easily align the solid-state image sensor on the wiring board. An object of the present invention is to provide a solid-state imaging device capable of performing the above and an electronic apparatus including the solid-state imaging device.

In order to solve the above problems, the solid-state imaging device of the present invention provides
A solid-state image sensor;
A wiring board on which a solid-state imaging device is mounted and having wiring electrically connected to the solid-state imaging device;
On the solid-state imaging device, the solid-state imaging device including the light-receiving portion of the solid-state imaging device and a translucent lid provided with a gap between the light-receiving portion,
On the wiring board, provided with a holder that accommodates the solid-state imaging device inside,
The holder is
It is detachably fixed to the wiring board,
It is characterized in that a pressure is applied perpendicularly to the side surface portion of the translucent lid portion to sandwich the translucent lid portion.

  According to said invention, a holder clamps the side surface of a translucent cover part in the state fixed to the wiring board. Moreover, the holder presses the translucent lid perpendicularly to the side surface of the translucent lid. Thereby, the solid-state imaging device is fixed on the wiring board by the fixing of the holder to the wiring board and the pressing force of the holder against the translucent lid. Therefore, in order to mount the solid-state imaging device on the wiring board, conventional bonding using an adhesive or pressure bonding by physical pressure becomes unnecessary. Moreover, the holder and the wiring board are detachable. For this reason, even if a defect occurs in the wiring board or the solid-state imaging device, it can be easily replaced.

  Further, the holder is fixed to the wiring board, and the holder sandwiches the side surface of the light-transmitting lid, so that the holder can be aligned with the wiring board. Along with this, it is possible to align the solid-state imaging device accommodated in the holder with the wiring board.

  Thus, according to said invention, a solid-state image sensor can be attached or detached from a wiring board, and it also becomes possible to align a solid-state image sensor on a wiring board easily.

  In addition, since a holder clamps the side surface of a translucent cover part, the optical path from the surface (upper surface) of a translucent cover part to the light-receiving part of a solid-state image sensor is ensured.

  In the solid-state imaging device of the present invention, the holder is provided independently for each side surface of the translucent lid portion, and a contact portion that contacts each side surface portion, and the contact portion is rotatably held, and wiring is provided. The structure provided with the fixing | fixed part detachably fixed to the board | substrate and the flame | frame which fits in the outer side part of a contact part and fixes a contact part may be sufficient.

  According to said invention, the contact part provided for every side of the translucent cover part is hold | maintained rotatably by the fixing | fixed part. As a result, after the contact part is expanded more than the solid-state image sensor and the solid-state image sensor is mounted on the wiring board, the contact part is narrower than the solid-state image sensor and the contact part is brought into contact with the side surface of the translucent lid. Can be made. Therefore, it becomes easy to mount the solid-state imaging device on the wiring board.

  Moreover, in the solid-state imaging device of the present invention, one of the holder and the solid-state imaging device is provided with a connection portion that electrically connects the holder and the solid-state imaging device to each other. It is preferable that the holder and the solid-state image sensor be in contact with each other with the lid portion interposed therebetween.

  According to said invention, the connection part which contacts a holder and a solid-state image sensor is provided in the state which clamped the translucent cover part. Thereby, when the holder is locked to the wiring board, the electric signal of the solid-state imaging device can be sent to the wiring board via the connection portion.

  In the solid-state imaging device of the present invention, the connection portion may be a probe terminal. Thereby, when the holder is locked to the wiring board, the electric signal of the solid-state imaging device can be sent to the wiring board via the probe terminal.

  In the solid-state imaging device of the present invention, the connecting portion may be a conductive rubber. Thereby, when the holder is locked to the wiring board, an electric signal of the solid-state imaging device can be sent to the wiring board via the conductive rubber.

  In the solid-state imaging device of the present invention, a groove may be formed in a side surface portion of the translucent lid portion, and the holder may include a protrusion that is locked to the groove.

  According to said invention, the protrusion formed in the holder is latched by the groove | channel formed in the side part of a translucent cover part in the state which clamped the side surface of the translucent cover part. As a result, the holder and the solid-state imaging device can be aligned with respect to the wiring board with high accuracy.

  An electronic apparatus according to the present invention includes any one of the solid-state imaging devices. Therefore, it is possible to provide an electronic apparatus in which the solid-state imaging element can be attached to and detached from the wiring board, and the solid-state imaging element can be easily aligned on the wiring board.

  The solid-state imaging device of the present invention includes a holder for housing the solid-state imaging element on the wiring board. The holder is detachably fixed to the wiring board and is attached to the side surface of the translucent lid. On the other hand, pressure is applied vertically to sandwich the translucent lid. Therefore, the solid-state image sensor can be detached from the wiring board, and the solid-state image sensor can be easily aligned on the wiring board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a schematic configuration of a solid-state imaging device of the present invention. FIG. 2 is a perspective view of the solid-state imaging device of the present invention.

  As shown in FIG. 1, the solid-state imaging device 100 includes a wiring board 1, a solid-state imaging device 2, a translucent lid 3, and a holder 4. Moreover, the solid-state imaging device 100 has a configuration in which the solid-state imaging device 2 is accommodated in the holder 4 as shown in FIG. Further, the upper surface of the translucent lid 3 is exposed from the holder 4. For convenience of explanation, the wiring board 1 side (the direction closer to the wiring board 1) is the lower side, and the translucent lid 3 side (the side away from the wiring board 1) is the upper side.

  Specifically, the wiring board 1 is a board that takes out an electrical signal of the solid-state imaging device 2 and has a patterned wiring (not shown). That is, the wiring board 1 and the solid-state imaging device 2 are electrically connected by this wiring. As will be described later, an electrical signal of the solid-state imaging device 2 flows to the wiring board 1 through the holder 4. The wiring board 1 is, for example, a printed board or a ceramic board. An external connection electrode (not shown) is formed on the back surface of the wiring board 1.

  The solid-state imaging device 2 is disposed at the center of the wiring substrate 1 and is a semiconductor substrate (for example, a silicon single crystal substrate) on which a semiconductor circuit is formed formed in a rectangular shape in plan view. The solid-state imaging device 2 is, for example, a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or a threshold voltage modulation image sensor (VMIS). The solid-state imaging device 2 is formed with a light receiving portion 21 in which a plurality of light receiving elements (pixels) are arranged in a matrix. The light receiving unit 21 is an effective pixel region (imaging surface) in the solid-state image sensor 2. The light receiving unit 21 is formed in a rectangular shape in plan view at the center of the main surface (front surface) of the solid-state imaging device 2. Further, the light receiving element converts the subject image (light that has passed through the translucent lid 3) formed on the light receiving unit 21 into an electrical signal. As will be described later, the mounting of the solid-state imaging device 2 on the wiring substrate 1 is not performed using an adhesive or a physical pressure.

  The translucent lid 3 is disposed on the surface of the solid-state imaging device 2 on which the light receiving unit 21 is formed so as to face the light receiving unit 21. That is, the translucent lid 3 is provided so as to cover the light receiving unit 21. FIG. 3 is a side view showing the solid-state imaging device 2 and the translucent lid 3 in the solid-state imaging device 100, and FIG. 4 is a sectional view of the same. As shown in FIG. 3 and FIG. 4, the translucent lid 3 is bonded onto the solid-state imaging device 2 by the bonding portion 5 formed around the light receiving portion 21. The translucent lid 3 is provided such that a gap (gap / gap) S is formed between the light-receiving lid 21 and the light-receiving portion 21. Since the adhesion part 5 is formed in the whole periphery of the light-receiving part 21, this space | interval S turns into sealed space. Thereby, it is possible to prevent moisture from entering the light receiving unit 21 and dust from entering and adhering to the light receiving unit 21, thereby preventing occurrence of defects in the light receiving unit 21. The translucent cover part 3 is comprised from translucent members, such as glass and resin which have translucency. The translucent lid 3 may be formed with an optical filter such as an infrared cut filter that cuts infrared rays incident on the solid-state imaging device 2. Thereby, the translucent cover part 3 comes to have a function which interrupts the infrared rays from the outside.

  The adhesive portion 5 is formed by patterning, for example, by attaching a sheet-like adhesive and performing a process such as exposure and development with a photolithography technique. If the photolithography technique is used in this way, the bonding portion 5 can be patterned with high accuracy. Moreover, if a sheet-like adhesive is used, the thickness of the adhesion part 5 can be made uniform. Thereby, the translucent cover part 3 can be adhere | attached with respect to the light-receiving part 21 with high precision.

  The holder 4 is detachably fixed on the wiring board 1 and accommodates the solid-state imaging device 2 therein. Further, the holder 4 applies pressure perpendicularly to the side surface portion of the translucent lid portion 3 to sandwich the translucent lid portion 3. That is, the holder 4 presses the upper surface of the translucent lid portion 3 perpendicular to the light receiving portion 21 (in the case of FIG. 1, perpendicular to the optical axis indicated by the one-dot chain line). Note that the holder 4 has conductive wiring (not shown) and plays a role of conducting electrical continuity between the wiring board 1 and the solid-state imaging device 2. The point where the holder 4 clamps the side surface of the translucent lid 3 will be described later.

  Further, the holder 4 is in contact with the side surface of the translucent lid 3 while being fixed to the wiring board 1. Thereby, alignment with respect to the translucent cover part 3 of the holder 4 is attained. In addition, if the holder 4 is fixed to the wiring substrate 1 in this manner and aligned with the translucent lid 3, the solid-state imaging device 2 can be aligned on the wiring substrate 1. The holder 4 holds the side surface of the translucent lid 3, and the surface (upper surface) of the translucent lid 3 is exposed from the holder 4. The optical path is secured. That is, the holder 4 is provided on the wiring board 1 so as to avoid the optical path to the light receiving portion 21 of the solid-state imaging device 2 and to accommodate the solid-state imaging device 2 and the translucent lid portion 3 inside. Yes.

  Note that various electronic components (not shown) for driving the solid-state imaging device 100 may be mounted on the wiring board 1. Such an electronic component is, for example, a signal processing circuit that performs signal processing of the solid-state imaging device 2. Specifically, this signal processing circuit functions as a control unit (image processing apparatus) that controls the operation of the solid-state imaging device 2 and appropriately processes signals output from the solid-state imaging device 2 to generate necessary signals. To do. For example, the signal processing circuit amplifies the electrical signal converted by the light receiving element of the light receiving unit 21 and outputs the electrical signal as an analog signal. The analog signal is converted into a digital signal. Stores analog / digital conversion processing circuit section for conversion, DSP (digital signal processor) for controlling the operation of the solid-state imaging device 2, CPU for performing various arithmetic processing according to programs, ROM for storing the programs, data for each process, etc. Electronic components such as RAM. This electronic component includes a resistor and a capacitor.

  Such a solid-state imaging device 100 takes in external light taken in through a lens (not shown) into the solid-state imaging device 2 through the translucent lid 3 and arranges it in the light-receiving unit 21 of the solid-state imaging device 2. An image is received by the received light receiving element. Since the solid-state imaging device 100 is hollow between the light receiving unit 21 and the translucent lid 3, the light from the outside that has passed through the translucent lid 3 is directly incident on the light receiving unit 21. Thus, no optical loss occurs in the middle of the optical path.

  As described above, in the solid-state imaging device 100, the holder 4 holds the side surface of the translucent lid 3 in a state where the holder 4 is fixed to the wiring board 1. In addition, the holder 4 presses the translucent lid 3 perpendicular to the side surface of the translucent lid 3. Thereby, the solid-state imaging device 2 is fixed on the wiring board 1 by the fixing of the holder 4 to the wiring board 1 and the pressing force of the holder 4 against the translucent lid 3. Therefore, in order to mount the solid-state imaging device 2 on the wiring board 1, conventional bonding using an adhesive or pressure bonding by physical pressure becomes unnecessary. In addition, the holder 4 and the wiring board 1 are detachable. For this reason, even if a defect occurs in the wiring board 1 or the solid-state imaging device 2, it can be easily replaced.

  Further, the holder 4 is fixed to the wiring board 1, and the holder 4 sandwiches the side surface of the translucent lid 3, whereby the holder 4 can be aligned with the wiring board 1. Accordingly, it is possible to align the solid-state imaging device 2 accommodated in the holder 4 with the wiring board 1.

  As described above, in the solid-state imaging device 100 according to the present embodiment, the solid-state imaging device 2 can be fixed on the wiring substrate 1 without bonding or crimping, and the solid-state imaging device 2 can be aligned with the wiring substrate 1. Become.

  Here, the point which the holder 4 clamps the side surface of the translucent cover part 3 is demonstrated based on FIG. 1 and FIG. As shown in FIG. 1, the holder 4 includes a holding portion 41 that holds the translucent lid portion 3 and a frame 42 that fixes the holding portion 41. In the solid-state imaging device 100, the holding unit 41 is provided independently for each side surface of the translucent lid 3. That is, in FIG. 1, a holding portion 41 is provided for each of the four sides of the rectangular translucent lid portion 3. And each holding | maintenance part 41 contacts each side part of the corresponding translucent cover part 3. As shown in FIG. The frame 42 is formed in a frame shape along the outer surface of the holding portion 41 and is fitted into the holding portion 41.

  More specifically, FIG. 5 is a cross-sectional view showing a configuration in which the holder 4 holds the side surface of the translucent lid 3. As shown in FIG. 5, the holding portion 41 is provided independently for each side surface of the translucent lid portion 3, and a contact portion 41 a that contacts each side surface portion, and a fixed portion that rotatably holds the contact portion 41 a. 41b. The fixing portion 41b is detachably fixed to the wiring board 1, for example, by being inserted into a hole (not shown) formed in the wiring board 1.

  Since the contact part 41a clamps the side surface of the translucent cover part 41a, the pressure of the arrow direction (direction approaching the translucent cover part 3) of FIG. However, the fixing portion 41b has flexibility, and the contact portion 41a is moved in the direction opposite to the arrow in FIG. 5 (the direction away from the translucent lid portion 3) by rotating the contact portion 41a. Can be made.

  With such a configuration, when the solid-state imaging device 2 is mounted on the wiring board 1, the contact portion 41 a is expanded more than the solid-state imaging device 2. And after mounting, the contact part 41a can be narrowed rather than a solid-state image sensor, and the contact part 41a can be made to contact | abut to the side surface of the translucent cover part 3. FIG. Therefore, mounting of the solid-state imaging device 2 on the wiring board 1 is facilitated. In addition, after the translucent cover part 3 is clamped by the contact part 41a, the flame | frame 4 is engage | inserted by the outer side part of the contact part 41a. For this reason, the contact part 41a is fixed without rotating.

  Next, electrical connection between the wiring board 1 and the solid-state imaging element 2 in the solid-state imaging device 100 will be described. In the solid-state imaging device 100, the method for taking out the electrical signal of the solid-state imaging device 2 to the wiring board 1 is not particularly limited. For example, the electrical signal of the solid-state imaging device 2 may be taken out directly to the wiring board 1 or taken out to the wiring board 1 via the holder 4. 6 to 7 are cross-sectional views showing examples of electrical connection between the solid-state imaging device 2 and the holder 4. FIG. 8 is a rear view of the holding portion 41 and the frame 42 in the configuration of FIG. FIG. 9 is a rear view of the holding portion 41 and the frame 42 in the configuration of FIG. In these configurations, one of the holder 4 and the solid-state image sensor 2 is provided with a connection portion that electrically connects the holder 4 and the solid-state image sensor 2 to each other. And this connection part contacts the holder 4 and the solid-state image sensor 2 in the state which the holder 4 clamped the translucent cover part 3. As shown in FIG. Thereby, the electric signal of the solid-state image sensor 2 can be sent to the wiring board 1 through the connection part.

  Specifically, the configurations of FIGS. 6 and 8 show an example in which a probe terminal 44 is used as the connecting portion. That is, in FIG. 6, the probe terminal 44 is formed on the back surface of the holding portion 41. As shown in FIG. 8, the probe terminal 44 is formed on the entire back surface of the holding portion 41. Then, as shown in FIG. 6, the holder 4 is in contact with an electrode terminal (not shown) formed on the solid-state imaging device 2 with the translucent lid 3 being sandwiched. Thereby, the electrical signal of the solid-state imaging device 2 can be sent to the wiring board 1 via the probe terminal 44.

  When the probe terminal 44 is used, pressure concentrates on the tip of the probe (needle). For this reason, this pressure acts moderately for the contact between the probe terminal 44 and the electrode terminal (pad terminal) formed on the solid-state imaging device 2. In addition, the tip of the probe terminal 44 scratches the electrode terminal of the solid-state imaging device 2 during this contact. As a result, the oxidized portion of the surface of the electrode terminal of the solid-state imaging device 2 and the other contaminated portion are scraped off. For this reason, the contact state between the probe terminal 44 and the electrode terminal of the solid-state imaging device 2 is always good. Therefore, the solid-state imaging device 2 and the wiring board 1 can be reliably connected via the probe terminal 44.

  On the other hand, the structure of FIG. 7 and FIG. 9 has shown the example using the conductive rubber 45 as the said connection part. That is, in FIG. 7, the conductive rubber 45 is formed on the back surface of the holding portion 41. As shown in FIG. 8, the conductive rubber 45 is formed on the entire back surface of the holding portion 41. Here, as shown in FIG. 7, the conductive rubber 45 includes a resin portion 45a made of rubber (elastomer) and a conductive portion 45b made of a plurality of copper wires. The conductive portion 45b is conductive only in one direction (vertical direction). Thereby, the electrical signal of the solid-state imaging device 2 can be sent to the wiring board 1 through the conductive rubber 45. In addition, since a plurality of copper wires are formed in the conductive portion 45b, the conductive portions 45b are electrically connected to terminals (not shown) formed for electrical connection in the solid-state image pickup device 2 and the holder 4 so as to be strictly matched. Even if the conductive rubber 45 is not disposed, the solid-state imaging device 2 and the holder 4 can be electrically connected. Furthermore, since the conductive rubber 45 has an elastic force, the conductive rubber 45 functions as a cushion when the translucent lid 3 is pressed.

  Such a solid-state imaging device 100 can have, for example, an LCC type structure as shown in FIG. 10 or a BGA type structure as shown in FIG. 10 and 11 are a rear view and a side view in each structure, and are soldered to the substrates of various imaging devices (electronic devices) by terminals 50 formed on the rear surface.

  In this embodiment, the side part of the translucent cover part 3 was flat. However, as shown in FIG. 12, a groove 31 is formed in the side surface portion of the translucent lid portion 3, and the protrusion that is locked to the groove 31 in a state where the holder 4 holds the translucent lid portion 3. 48 may be formed in the holder 4. Thereby, alignment of the holder 4 and the solid-state image sensor 2 with respect to the wiring board 1 can be performed with high precision.

  The solid-state imaging device of the present invention is suitable for electronic devices capable of photographing such as a mobile phone with a camera, a digital still camera, a video camera, and a security camera. With the above-described configuration, the solid-state imaging device can be reliably attached and fixed to the imaging unit of the electronic device.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can be applied to various electronic devices including a solid-state imaging device such as a camera-equipped mobile phone, a digital still camera, and a security camera such as a surveillance camera and a door phone.

It is a disassembled perspective view which shows schematic structure of the solid-state imaging device of this invention. It is a perspective view of the solid-state imaging device of the present invention. It is a side view which shows the solid-state image sensor and the translucent cover part in the solid-state imaging device of FIG. It is sectional drawing which shows a solid-state image sensor and a translucent cover part in the solid-state imaging device of FIG. FIG. 2 is a cross-sectional view illustrating a configuration in which a holder sandwiches a translucent lid in the solid-state imaging device of FIG. 1. FIG. 2 is a cross-sectional view illustrating an example of electrical connection between a solid-state imaging element and a holder in the solid-state imaging device of FIG. 1. FIG. 2 is a cross-sectional view illustrating an example of electrical connection between a solid-state imaging element and a holder in the solid-state imaging device of FIG. 1. FIG. 7 is a rear view of a holding unit and a frame in the solid-state imaging device of FIG. 6. FIG. 8 is a rear view of a holding unit and a frame in the solid-state imaging device of FIG. 7. It is the side view and back view which show the solid-state imaging device of a LCC structure. It is the side view and back view which show the solid-state imaging device of a BGA structure. FIG. 2 is a cross-sectional view illustrating an example of electrical connection between a wiring board and a holder in the solid-state imaging device of FIG. 1. It is sectional drawing of the solid-state imaging device of patent document 1. It is sectional drawing of the solid-state imaging device of patent document 2. It is the top view and sectional drawing of the solid-state imaging device of patent document 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2 Solid-state image sensor 3 Translucent cover part 4 Holder 5 Adhesion part 31 Groove 41 Holding part 41a Contact part 41b Arm part 42 Frame 44 Probe terminal 45 Conductive rubber 45a Resin part 45b Conductive part 48 Protrusion 100 Solid-state imaging device S interval

Claims (7)

A solid-state image sensor;
A wiring board on which a solid-state imaging device is mounted and having wiring electrically connected to the solid-state imaging device;
On the solid-state imaging device, the solid-state imaging device including the light-receiving portion of the solid-state imaging device and a translucent lid provided with a gap between the light-receiving portion,
On the wiring board, provided with a holder that accommodates the solid-state imaging device inside,
The holder is
It is detachably fixed to the wiring board,
A solid-state imaging device, wherein pressure is applied perpendicularly to a side surface portion of a translucent lid portion to sandwich the translucent lid portion. The holder is
A contact portion that is provided independently for each side surface of the translucent lid portion and that contacts each side surface portion;
A fixed portion that rotatably holds the contact portion and is detachably fixed to the wiring board;
The solid-state imaging device according to claim 1, further comprising a frame that is fitted into an outer portion of the contact portion and fixes the contact portion. One of the holder and the solid-state image sensor is provided with a connection part that electrically connects the holder and the solid-state image sensor,
3. The solid-state imaging device according to claim 1, wherein the connection portion is configured to contact the holder and the solid-state imaging element in a state where the holder sandwiches the translucent lid portion.   The solid-state imaging device according to claim 3, wherein the connection portion is a probe terminal.   The solid-state imaging device according to claim 3, wherein the connection portion is a conductive rubber. A groove is formed on the side surface of the translucent lid,
The solid-state imaging device according to claim 1, wherein the holder includes a protrusion that is locked to the groove in a state where the light-transmitting lid is sandwiched.   The electronic device provided with the solid-state imaging device of any one of Claims 1-6.

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