JPH05259424A - Connector for solid-state image sensor and mounting method thereof - Google Patents

Abstract

PURPOSE:To provide a connector for solid-state image sensor and mounting method thereof, being employed in camera-cassette recorder or the like, wherein intrusion of dust is prevented and overall profile can be reduced. CONSTITUTION:A solid-state image sensor 4 and a positioning substrate 28 are contained integrally through the use of a connector 26 mounted on the surface of a wiring board and the solid-state image sensor 4 is secured to an optical system through the use of the positioning board 28. Upon insertion of the solid-state image sensor 4, bottom face thereof abuts on the connector 26 and held in place and thereby the solid-state image sensor 4 and the positioning board 28 are contained integrally and held in place.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology (FIG. 6) Problem to be Solved by the Invention (FIG. 6) Means for Solving the Problem (FIGS. 1 to 3) Action (FIGS. 1 to 3) Example (1) Configuration of Embodiment (FIGS. 1 to 3) (2) Effect of Embodiment (3) Other Embodiment (FIGS. 4 and 5) Effect of Invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector of a solid-state image pickup device and a mounting method, and can be applied to an image pickup apparatus such as a video tape recorder integrated with a camera.

[0003]

2. Description of the Related Art Conventionally, in an image pickup apparatus such as a camera-integrated video tape recorder, a solid-state image pickup element is used to generate a video signal.

That is, as shown in FIG. 6, in the conventional image pickup apparatus 1, a multilayer wiring board 2 is used so as to improve the packaging density, and a solid-state image pickup element is formed by using a through hole of the multilayer wiring board 2. Implement 4. At this time, the imaging device 1 inserts a predetermined metal plate 6 between the multilayer wiring board 2 and the solid-state image sensor 4, and mounts the optical low-pass filter 8 using the metal plate 6.

That is, the image pickup apparatus 1 holds the solid-state image pickup element 4 from the upper surface with a rubber cover 10 so as to cover the entire solid-state image pickup element 4, and utilizes the elasticity of the cover 10 to
An optical low-pass filter 8 is held on the front surface of the imaging surface of the solid-state imaging device 4. Further, in the image pickup apparatus 1, the cover 14 is arranged so as to cover the whole of the cover 10 from the upper portion, and the cover 14 is screwed to the sheet metal 6 using the screws 14.

As a result, the image pickup apparatus 1 is attached to the lens system after assembling the solid-state image pickup element 4 integrally with the related parts in the periphery. At this time, the solid-state imaging device 4 is entirely covered with the multilayer wiring substrate 2, the metal plate 6, the optical low-pass filter 8 and the cover 10 so that dust and the like can be prevented from entering from the outside. Has been done.

[0007]

By the way, when the solid-state image pickup device 4 is mounted on the multilayer wiring board 2 by using the through holes as described above, the multilayer wiring board 2 is provided with the through holes. Mounting density is reduced. Further, in the multilayer wiring board 2, there is an unavoidable occurrence of distortion at the time of drilling a through hole, and it is difficult to select a small pattern width and interval accordingly.

Therefore, in the image pickup device, despite the adoption of the multilayer wiring board 2, there is still an insufficient problem in downsizing the peripheral device of the solid-state image pickup device. That is, in the imaging device, if the multilayer wiring board can be downsized and the peripheral components of the solid-state imaging device can be reduced, the overall shape can be further downsized.

On the other hand, some dust and the like enter not only from the outside but also from the multilayer wiring board 2, and there is a problem that such dust enters the imaging surface.

The present invention has been made in consideration of the above points, and an object of the present invention is to propose a connector and a mounting method for a solid-state image pickup device which can solve these problems all at once.

[0011]

In order to solve such a problem, in the first invention, the solid-state image pickup device 4 is fixed to a positioning board 28 for positioning with respect to the optical system 22 and then surface-mounted on the wiring board 24. The solid-state image sensor 4 and the positioning substrate 28 are integrally housed in the connector 26.

Further, in the second invention, the optical system 22
After fixing the solid-state image sensor 4 to the positioning substrate 28 for positioning with respect to the solid-state image sensor 4, the solid-state image sensor 4 and the positioning substrate 28 are integrally housed in the connector 26 that is surface-mounted on the wiring board 24. The solid-state imaging device 4 is fixed to the optical system 22 by fixing it to the optical system 22 by inserting the positioning projection 22A provided on the lens barrel of the optical system 22 into the positioning hole 28A provided on the positioning substrate 28. Position and perform.

Further, in the third invention, in the connector 26 of the solid-state image pickup device 4 mounted on a predetermined wiring board 24 and holding the solid-state image pickup device 4, the terminal 4A of the solid-state image pickup device 4 is connected to the wiring board 24. And a case 29 that holds the terminal 4A. The case 29 includes side plates 29A and 29B that surround the side surface periphery of the solid-state image sensor 4.
And a bottom plate 27 connecting the side plates 29A and 29B,
The side plates 29A and 29B are formed of a pair of side plates 29A of the terminal holding portion facing each other and a pair of holding side plates 29B formed between the side plates 29A of the terminal holding portions, and the bottom plate 27 is
Groove 2 that connects between the holding side plates 29B in the substantially central portion.
By forming 6B, the side plate 29 of the terminal holding portion is formed.
The shape between A is formed stepwise by the groove 26B, and when the solid-state image sensor 4 is inserted, the bottom surface of the solid-state image sensor 4 is pressed against the step-shaped portion 27A to hold the solid-state image sensor 4 in a predetermined position. In the pair of holding side plates 29B, notches are formed in a rectangular shape in the extended portion of the groove 26B, and the groove 26B
And the notch, so that the solid-state imaging device 4 can be held at a predetermined position by inserting a predetermined plate-like member 28, and the side plate 29A of the terminal holding portion holds the terminals 26A aligned on the inner wall side. The terminal 26A is a side plate 29A of the terminal holding portion.
And extends through the bottom plate 27, and then extends parallel to the bottom plate 27.

[0014]

Function: Connector 26 surface-mounted on wiring board 24
If the solid-state image sensor 4 and the positioning board 28 are housed together by using, the mounting density of the wiring board 24 can be improved accordingly.

Further, if the positioning projection 22A is inserted into the positioning hole 28A to position the positioning substrate 28 and the solid-state image pickup device 4 is fixed to the optical system 22, the solid-state image pickup device 4 is easily positioned and held. It is possible to prevent the ingress of dust as necessary.

When the solid-state image sensor 4 is inserted, the bottom surface of the solid-state image sensor 4 is pressed against the stepped portion 27A so that the solid-state image sensor 4 can be held at a predetermined position. Form a rectangular notch on the bottom plate 2
If the solid-state imaging device 4 can be held at a predetermined position by inserting the predetermined plate-shaped member 28 by the groove 26B of No. 7 and the rectangular notch, the plate-shaped member 28 can be used for positioning. At the same time, the solid-state imaging device 4 can be easily held.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to the drawings.

(1) Configuration of the Embodiment In FIG. 1 in which parts corresponding to those in FIG. 6 are assigned the same reference numerals, 20 indicates an image pickup apparatus as a whole, and in this embodiment, peripheral parts of the solid-state image pickup element 4 are shown. To the lens barrel 22 at the rear of the lens.

That is, in the image pickup apparatus 20, the connector 26 is surface-mounted on the multilayer wiring board 24, and the solid-state image pickup element 4 is mounted using the connector 26. At this time, in the imaging device 20, the solid-state imaging device 4 is first fixed to the lens rear lens barrel 22, and then the solid-state imaging device 4 is inserted into the connector 26.

That is, in the image pickup device 20, the solid-state image pickup element 4 is first bonded to the positioning substrate 28. Here, the positioning substrate 28 is a front H-shaped aluminum plate member, and the bottom surface of the solid-state imaging device 4 is bonded so as to straddle the central horizontal plate portion.

Further, the positioning substrate 28 has through holes 2 at the four corners.
8A, the solid-state imaging device 20 positions the solid-state imaging device 4 using this through hole 28A. That is, the lens barrel 2
2, the projection 22A and the screw hole 22B are formed corresponding to the through hole 28A. In the imaging device 20, by inserting the projection 22A into the through hole 28A, the solid-state image sensor 4 is positioned with respect to the optical system. After that, the remaining through hole 2
The solid-state image sensor 4 is solidified by screwing the screw 30 into the screw hole 22B through 8A.

Thus, after the solid-state image pickup device 4 is adhered to the positioning board 28 in advance, the positioning board 28 is used for assembly, whereby the assembly work can be automated using the positioning board 28. The assembling work can be simplified. Further protrusion 2
Since the positioning can be performed using 2A and the through hole 28A, the solid-state imaging device 4 can be positioned by a simple positioning operation, and the entire assembling operation can be simplified accordingly.

Further, in the image pickup device 20, a lens barrel 22 is provided.
The optical low-pass filter 8 and the cylindrical rubber sealing member 32 are sequentially inserted between the solid-state image sensor 4 and the solid-state image sensor 4, and the solid-state image sensor 4 is fixed to the lens barrel 22. Also, the optical low pass filter 8 presses the sealing member 32 to form a sealed space. Thereby, in the imaging device 20,
With a simple configuration in which the sealing member 32 is inserted between the solid-state image sensor 4 and the optical low-pass filter 8, dust and the like generated from the multilayer wiring board 24 enters between the solid-state image sensor 4 and the optical low-pass filter 8. It is designed not to.

Thus, when the solid-state image pickup device 4 is fixed to the lens barrel 22, the optical low-pass filter 8 and the sealing member 3 are simply used.
It is possible to prevent dust from entering with a simple assembling work by simply inserting 2, and the entire assembling work can be simplified accordingly. At this time, dust can be prevented from entering by simply using the rubber-like sealing member 32 having a cylindrical shape, and thus the entire configuration can be simplified and downsized accordingly.

After assembling the solid-state image pickup device 4 into the lens barrel 22 in this manner, in the image pickup apparatus 20, the solid-state image pickup device 4 is inserted into the connector 26. 2 and 3
As shown in FIG. 5, the connector 26 is formed with side plates 29A and 29B so as to surround the solid-state image sensor 4 from the periphery, and the side plates 29A and 29B are connected by a bottom plate 27.

A groove 26B is formed in the center of the bottom plate 27,
In the side plate 29B, a rectangular cutout is formed in the extension of the groove 26B. In the connector 26, the terminals 26A are arranged on the side plate 29A orthogonal to the side plate 29B, whereby the bottom plate 26B is formed stepwise from the side plate 29A side, and when the solid-state image sensor 4 is inserted into the positioning substrate 28 integrally, The bottom surface of the image pickup device 4 hits the stepped portion 27A, and in this state, the solid-state image pickup device 4 can be held at a predetermined holding position.

At this time, the connector 26 has a side plate 29.
The heights of the side plates 29A and 29B are selected so that the upper end surfaces of A and 29B and the upper surface of the solid-state image sensor 4 are substantially aligned with each other, and it is possible to easily confirm whether or not the solid-state image sensor 4 is securely inserted. It is designed to be able to do. Further, by raising the side plates 29A and 29B in this manner for a long time, the stroke for inserting the solid-state image sensor 4 can be selected to be long as shown by the arrow a, and the solid-state image sensor 4 can be surely inserted and after the insertion. In, it can be stably held.

On the other hand, in the side plate 29A, the terminals 26A are arranged in alignment with the inner wall surface, so that the lead terminals 4A of the solid-state image pickup device 4 are connected to the multilayer wiring board 24. Here, after the terminal 26A rises up the inner wall surface of the side plate 29A in the upward direction, the terminal 26A bends at an angle close to 180 degrees and falls down to make contact with the lead terminal 4A. Further, the terminal 26A, after coming into contact with the lead terminal 4A, penetrates the bottom plate 27 and bends there at a substantially right angle.
It is designed to extend around.

As a result, the terminal 26A becomes the lead terminal 4A.
Is formed in a spring shape so as to press the side surface of the lead wire from the surroundings, and bending of the lead terminal 4A can be effectively avoided even when the solid-state imaging device 4 is inserted, and at the same time, high dimensional accuracy is maintained and stable. It is designed to ensure contact. Further, the terminal 26A can make contact with the lead terminal 4A in a wide range, and by selecting a large overall spring length, stable contact can be secured accordingly.

Further, since the solid-state image pickup device 4 can be held so as to be surrounded from the periphery in this manner, in addition to the conventional leadframe-type solid-state image pickup device 4, a surface mount type solid-state image pickup device 4B having no leadframe is also provided. It can be inserted and held, and the usability of the connector 26 can be improved accordingly. Further, by forming the ends of the terminals 26A so as to extend to the periphery, the connector 26 is surface-mounted on the multilayer wiring board 24. In this case, in the multilayer wiring board 24, since the other side of the mounting surface of the solid-state image sensor 4 can be used to mount other electronic components, the mounting density can be improved accordingly.

Further, since it is not necessary to form through holes, the wiring pattern can be formed at a high density, and the wiring pattern itself can be narrowly selected. Therefore, the multilayer wiring board 24
In the above, the overall shape can be made smaller than the conventional one, and the entire shape of the imaging device 20 can also be made smaller. Thus, in the multilayer wiring board 24, after the solid-state image sensor 4 is inserted into the connector 26 as described above, the through hole 2 is formed.
4A is pierced and the screw 34 is screwed to the lens barrel 22, whereby the assembly of the solid-state image sensor 4 is completed in the imaging device 20.

(2) Effects of the Embodiments According to the above configuration, the solid-state image pickup device is adhered to the positioning substrate and then housed integrally in the surface-mounted connector to improve the mounting density of the multilayer wiring substrate. Therefore, the multilayer wiring board can be miniaturized accordingly.

At this time, the solid-state image sensor is integrally held in advance in the lens barrel by using the positioning substrate and then housed in the connector to prevent dust from entering in advance and to assemble the solid-state image sensor with a simple structure. Therefore, the entire structure can be downsized and simplified accordingly.

(3) Other Embodiments In the above-described embodiments, the case where the solid-state image pickup device is inserted into the frame-shaped connector has been described, but the present invention is not limited to this, and as shown in FIGS. 4 and 5. Alternatively, the terminal 40A may be moved and pressed from the side surface. That is, in the connector 40, the whole is divided into two and opened / closed, and the case 42 is closed by pressing the solid-state image sensor 4 against the portion corresponding to the bottom plate, and the terminal 40A contacts the lead terminal 4A. It is designed to do. Even if the connector is configured as described above, the same effect as that of the above-described embodiment can be obtained, and the bending of the lead terminal 4A can be more effectively avoided by opening and closing the case.

Furthermore, in the above-mentioned embodiment, the case of sealing with the cylindrical sealing member 32 was described, but the present invention is not limited to this, and sealing of various shapes such as a ring shape and a frame shape is performed. The stop member can be widely applied.

Further, in the above-mentioned embodiments, the case where the solid-state image pickup device is first fixed to the lens barrel and then inserted into the connector has been described. However, the present invention is not limited to this, and it is inserted into the connector and then attached to the lens barrel. It may be fixed.

Further, in the above-mentioned embodiment, the case where the connector is shared with the surface mount type solid-state image pickup device has been described, but the present invention is not limited to this, and various connectors can be used when simply assembling with the lens barrel. Can be widely applied.

[0038]

As described above, according to the present invention, the solid-state image sensor is fixed to the positioning board and then housed integrally in the surface-mounted connector, so that the positioning board can be used with a simple structure. Positioning can be performed, the entire configuration can be simplified accordingly, the mounting density of the wiring board can be improved, and the overall shape can be reduced. Further, it is possible to prevent dust from entering by using a predetermined sealing member. Further, the positioning board and the solid-state image sensor are integrally formed so as to be housed in the connector, so that the assembling work and the entire structure can be simplified accordingly.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an image pickup apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the periphery of the connector.

FIG. 3 is a plan view showing the connector as a partial cross section.

FIG. 4 is a sectional view showing a connector according to another embodiment.

FIG. 5 is a cross-sectional view showing a mounting state thereof.

FIG. 6 is a perspective view showing a conventional imaging device.

[Explanation of symbols]

1, 20 ... Imaging device, 2, 24 ... Multi-layer wiring board, 4
...... Solid-state image sensor, 8 …… Optical low-pass filter, 2
2 ... Lens barrel, 26, 40 ... Connector, 28 ... Positioning substrate, 32 ... Sealing member.

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[Procedure amendment]

[Submission date] December 7, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

Title: Connector and mounting method of solid-state imaging device

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Kunio Nakatani Kunio Nakatani, 10 Hanazono Dodo-cho, Ukyo-ku, Kyoto, Japan Omron Co., Ltd. Ron Co., Ltd.

Claims (3)

[Claims] 1. A solid-state image sensor is fixed to a positioning board for positioning with respect to an optical system, and then the solid-state image sensor and the positioning board are integrally housed in a connector surface-mounted on a wiring board. Solid-state image sensor mounting method. 2. A solid-state image sensor is fixed to a positioning board for positioning with respect to an optical system, and then the solid-state image sensor and the positioning board are integrally housed in a connector surface-mounted on a wiring board. The image pickup element is fixed to the optical system, and the solid-state image pickup element is fixed to the optical system by inserting the positioning projection provided on the lens barrel of the optical system into the positioning hole provided on the positioning substrate. A method for mounting a solid-state imaging device, which is characterized in that positioning is performed by. 3. A connector for a solid-state image sensor mounted on a predetermined wiring board to hold a solid-state image sensor, comprising: a terminal for connecting a terminal of the solid-state image sensor to the wiring board; and a case for holding the terminal. The case is formed of a side plate that surrounds a side surface of the solid-state imaging device and a bottom plate that connects the side plates, and the side plate includes a pair of opposing side plates of the terminal holding portion and the terminal holding portion. And a pair of holding side plates formed between the side plates of the terminal holding portion, and the bottom plate is formed with a groove that connects the holding side plates at substantially the central portion. The shape of is formed stepwise by the groove, when the solid-state image sensor is inserted, the bottom surface of the solid-state image sensor is pressed against the step-shaped portion to hold the solid-state image sensor at a predetermined position, 1 set above The holding side plate has a rectangular cutout formed in an extension of the groove, and the groove and the cutout can hold the solid-state imaging device at the predetermined position through a predetermined plate member. Thus, the side plate of the terminal holding portion holds the terminals in alignment with the inner wall side, the terminal extends from the side plate of the terminal holding portion and penetrates the bottom plate, and then becomes parallel to the bottom plate. A solid-state image sensor connector characterized by being extended.